JP2556346Y2 - Semiconductor wafer transfer container - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer transfer container for storing a plurality of semiconductor wafers, and more particularly to a semiconductor wafer transfer container having a structure in which the semiconductor wafers stored therein are not easily damaged.

[0002]

2. Description of the Related Art A conventional semiconductor wafer transfer container for accommodating a plurality of semiconductor wafers is provided with a box-shaped container body whose upper part is opened from a bottom wall and a side wall. Cross section V whose whole is almost semicircular curved
A plurality of U-shaped grooves are provided side by side, and the lower peripheral edge of the semiconductor wafer is housed in the grooves in the vertical direction. On the other hand, a lid can be attached to the upper part of the container main body, and a plurality of pressers are provided below the lid to abut on and hold the upper side of the semiconductor wafer housed in the container main body.

[0003]

In a conventional container for transporting semiconductor wafers, the lower peripheral edge of the semiconductor wafer is housed in a groove in the container body.
For example, when the container body receives an impact force from the outside, the impact force is transmitted to the semiconductor wafer via the groove, and there is a possibility that the semiconductor wafer may be damaged. For this reason, at the time of transportation, the work must be performed carefully and with great care so as not to damage the semiconductor wafer, and there is a problem that the work is troublesome. The purpose of the present invention is to solve these problems.

[0004]

According to the present invention, there is provided a container body having an upper part opening from a bottom wall and a side wall, a lid mounted on an upper part of the container body, a detachably provided inside the container body, and A carrier formed with a groove capable of accommodating the outer peripheral edge of the semiconductor wafer, and flexibility provided at an upper portion of a bottom wall of the container body and holding the lower portion of the semiconductor wafer so that the semiconductor wafer slightly floats from the groove of the carrier. And a supporting member provided below the lid and having flexibility to hold an upper portion of the semiconductor wafer, to constitute a semiconductor wafer transport container.

[0005]

According to the present invention, in a semiconductor wafer transport container, a semiconductor wafer can be held by a flexible support and a flexible presser.

[0006]

[Embodiment] An embodiment of a semiconductor wafer transfer container according to the present invention will be described. As shown in FIGS. 1, 2, and 3, the semiconductor wafer transfer container includes a box-shaped container body 1 having an open top, and the container body 1 has a bottom wall 2 and a side wall 3 erected from the periphery thereof. A lower portion between both corners of the pair of opposed side walls 3 is formed in a concave shape curved downward and inward, and protrudes outward over the entire outer periphery of an upper end portion of the side wall 3. A handle piece 4 is formed to be bent at the point and to be hung down. A lid 5 is provided at the upper end of the side wall 3 of the container body 1 so as to be freely attached.
The lid 5 includes a flat portion 6 having substantially the same area as the upper portion of the container body 1 and a side portion 7 provided on a peripheral edge of the flat portion 6, and a packing 8 is provided annularly below the side portion 7. When the lid 5 is attached to the upper part of the container body 1, the packing 8 is interposed between the container body 1 and the lid 5. In addition, a handle 10 of the container main body 1 is provided while a hook body 10 which is freely bendable and has a hole 9 for hooking is provided at a lower portion of each of the pair of opposed side faces 7 among the side face parts 7. 4, a recess 11 is formed in each of a pair of opposing portions, and a projection 12 for engagement is provided in the recess 11, so that the lid 5 is mounted on the upper portion of the container body 1, and Coalescing 10
The hole 9 is engaged with the projection 12 in the concave portion 11 on the container body 1 side, and the lid 5 is fixed to the upper part of the container body 1.

A carrier 13 is detachably provided inside the container body 1, and the carrier 13 extends downward from above, and has a V-shaped groove 14 slightly curved downward.
A plurality of side walls 15 are provided in opposition to each other, one end of the opposing side walls 15 is connected by a connection wall 16, and the other end is connected by an elongated connection plate 17. 13, a groove 14 provided on the opposing side wall 15
By accommodating the outer peripheral edge of the semiconductor wafer W in each, a plurality of semiconductor wafers W can be accommodated.

[0008] A pair of right and left insertion portions 18 are provided above the bottom wall 2 inside the container body 1.
A plurality of support members 19 are provided in parallel with each other so as to face the groove portions 14 provided in parallel with the side walls 15 of each of the insertion portions 18 and have an upward Y-shape.
Insert and fix. The support 19 is, as shown in FIG.
V-grooves 20 are formed at both ends of the Y-shape,
The semiconductor wafer W can be held at the same time, and the whole has flexibility. In the support 19,
When holding the semiconductor wafer W, the semiconductor wafer W is held so as to slightly float from the groove 14 on the carrier 13 side (to the extent that the semiconductor wafer W does not protrude from the groove 14).

A pair of left and right insertion portions 21 are provided on the bottom wall 2 of the container body 1 on the flat portion 6 of the lid 5.
A plurality of pressing members 22 each having a downward Y-shape are inserted and fixed to the respective insertion portions 21 so as to face each other. The holding body 22
As in the case of the support 19 described above, V-grooves 23 are formed at both ends of the Y-shape so that the semiconductor wafer W can be held in the V-grooves 23 and the whole has flexibility.

Next, an example of use of the semiconductor wafer transport container configured as described above will be described. The carrier 13 is removed from the container body 1, and a plurality of semiconductor wafers W are provided in the carrier 13.
Respectively. When the semiconductor wafer W is placed in the container body 1 together with the carrier 13, the V-groove 20 of the support 19 provided on the bottom 2 of the container body 1 holds the semiconductor wafer W housed in each groove 14 of the carrier 13. The semiconductor wafer W is held slightly floating from the groove 14 on the 13th side. Then, when the lid 5 is mounted on the upper part of the container body 1, the V-groove part 23 of the pressing body 22 provided on the flat part 6 of the lid 5 holds the upper part of the semiconductor wafer W.

As described above, the lower portion of the semiconductor wafer W is held by the flexible support 19 provided on the bottom wall 2 of the container body 1 so as to slightly float from the groove 14 on the carrier 13 side. By holding the upper portion of the semiconductor wafer W by the flexible pressing body 22 provided in the portion 6, for example, when the container body 1 and the lid 5 receive an impact force from the outside, the impact force is directly applied to the semiconductor wafer W. The semiconductor wafer W is prevented from being transmitted, that is, the impact force is absorbed by the flexible supporting body 19 or the pressing body 22.
To reduce the impact force transmitted to Accordingly, when the semiconductor wafer W is stored in the semiconductor wafer transfer container and transferred, damage to the semiconductor wafer W can be significantly reduced.

[0012]

According to the present invention, the lower part of the semiconductor wafer is held by the flexible support and the upper part of the semiconductor wafer is held by the flexible holder, so that the container body and the lid can be impacted from the outside. Even if a force is applied, the impact force transmitted to the semiconductor wafer by the support or the pressing body can be reduced. Therefore, breakage of the semiconductor wafer during transport of the semiconductor wafer can be significantly reduced.
In addition, since the semiconductor wafer can be prevented from being damaged to some extent due to an impact force received from the outside, it is not necessary to perform the work with meticulous attention as in the past, and the work can be easily performed. Can be

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a semiconductor wafer transfer container according to the present invention as viewed from the front.

FIG. 2 is a partial cross-sectional view of the semiconductor wafer transfer container according to the present invention as viewed from the side.

FIG. 3 is an exploded perspective view of the semiconductor wafer transport container according to the present invention;

FIG. 4 is a perspective view showing a support of the semiconductor wafer transfer container according to the present invention;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Container main body, 2 ... Bottom wall, 3 ... Side wall, 4 ... Handle piece, 5 ...
Lid, 6: flat part, 7: side part, 8: packing, 9: hole, 10: hooked body, 11: concave part, 12: projection part, 13 ...
Carrier, 14 groove, 15 side wall, 16 connection wall, 1
7 ... connecting plate, 18 ... insertion part, 19 ... support body, 20 ... V groove part, 21 ... insertion part, 22 ... holding body, 23 ... V groove part, W ...
Semiconductor wafer.

Claims (1)

(57) [Scope of request for utility model registration] 1. A container body 1 having an upper part opening from a bottom wall 2 and a side wall 3, a lid 5 mounted on the upper part of the container body 1, a semiconductor wafer provided detachably inside the container body 1. A carrier 13 formed with a groove 14 capable of accommodating the outer peripheral edge of the W; and a semiconductor wafer W provided on the bottom wall 2 of the container body 1 so that the semiconductor wafer W slightly floats from the groove 14 of the carrier 13. A flexible supporting body 19 for holding a lower portion of the semiconductor wafer W, and a pressing body 22 provided below the lid 5 and having a flexibility for holding an upper portion of the semiconductor wafer W. container.