SG11201404174SA - Stacked integrated component media insert for an ophthalmic device - Google Patents

Stacked integrated component media insert for an ophthalmic device

Info

Publication number
SG11201404174SA
SG11201404174SA SG11201404174SA SG11201404174SA SG11201404174SA SG 11201404174S A SG11201404174S A SG 11201404174SA SG 11201404174S A SG11201404174S A SG 11201404174SA SG 11201404174S A SG11201404174S A SG 11201404174SA SG 11201404174S A SG11201404174S A SG 11201404174SA
Authority
SG
Singapore
Prior art keywords
ophthalmic device
integrated component
media insert
stacked integrated
component media
Prior art date
Application number
SG11201404174SA
Other languages
English (en)
Inventor
Randall B Pugh
Frederick A Flitsch
Daniel B Otts
James Daniel Riall
Adam Toner
Original Assignee
Johnson & Johnson Vision Care
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/358,575 external-priority patent/US9889615B2/en
Application filed by Johnson & Johnson Vision Care filed Critical Johnson & Johnson Vision Care
Publication of SG11201404174SA publication Critical patent/SG11201404174SA/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C7/00—Optical parts
    • G02C7/02—Lenses; Lens systems ; Methods of designing lenses
    • G02C7/04—Contact lenses for the eyes
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C7/00—Optical parts
    • G02C7/02—Lenses; Lens systems ; Methods of designing lenses
    • G02C7/08—Auxiliary lenses; Arrangements for varying focal length
    • G02C7/081—Ophthalmic lenses with variable focal length
    • G02C7/083—Electrooptic lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Eyeglasses (AREA)
  • Prostheses (AREA)
SG11201404174SA 2012-01-26 2013-01-25 Stacked integrated component media insert for an ophthalmic device SG11201404174SA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US13/358,575 US9889615B2 (en) 2011-03-18 2012-01-26 Stacked integrated component media insert for an ophthalmic device
US13/358,571 US9233513B2 (en) 2011-03-18 2012-01-26 Apparatus for manufacturing stacked integrated component media inserts for ophthalmic devices
US13/358,577 US9914273B2 (en) 2011-03-18 2012-01-26 Method for using a stacked integrated component media insert in an ophthalmic device
PCT/US2013/023182 WO2013112862A1 (en) 2012-01-26 2013-01-25 Stacked integrated component media insert for an ophthalmic device

Publications (1)

Publication Number Publication Date
SG11201404174SA true SG11201404174SA (en) 2014-10-30

Family

ID=47741261

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201404174SA SG11201404174SA (en) 2012-01-26 2013-01-25 Stacked integrated component media insert for an ophthalmic device

Country Status (12)

Country Link
EP (1) EP2807518A1 (pt)
JP (1) JP6312605B2 (pt)
KR (1) KR20140117618A (pt)
CN (1) CN104204914B (pt)
AU (1) AU2013211968B2 (pt)
BR (1) BR112014018456A8 (pt)
CA (1) CA2862666A1 (pt)
HK (1) HK1204680A1 (pt)
RU (1) RU2629902C2 (pt)
SG (1) SG11201404174SA (pt)
TW (1) TWI616325B (pt)
WO (1) WO2013112862A1 (pt)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102248847B1 (ko) * 2015-06-01 2021-05-06 삼성전자주식회사 에너지 수확부를 구비한 콘택트 렌즈
US20170086676A1 (en) * 2015-09-24 2017-03-30 Johnson & Johnson Vision Care, Inc. Quantum-dot spectrometers for use in biomedical devices and methods of use
CN108205207A (zh) * 2016-12-16 2018-06-26 江苏海伦隐形眼镜有限公司 一种智能隐形眼镜的制作方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0837190A (ja) * 1994-07-22 1996-02-06 Nec Corp 半導体装置
US6217171B1 (en) * 1998-05-26 2001-04-17 Novartis Ag Composite ophthamic lens
JP4172566B2 (ja) * 2000-09-21 2008-10-29 Ｔｄｋ株式会社 セラミック多層基板の表面電極構造及び表面電極の製造方法
KR20050025624A (ko) * 2002-08-09 2005-03-14 이-비젼 엘엘씨 전기-활성 콘택트 렌즈 시스템
EP1760515A3 (en) * 2003-10-03 2011-08-31 Invisia Ltd. Multifocal ophthalmic lens
US20070090869A1 (en) * 2005-10-26 2007-04-26 Motorola, Inc. Combined power source and printed transistor circuit apparatus and method
CN101395520A (zh) * 2006-01-10 2009-03-25 E-视觉有限公司 包含可机械弯曲集成插件的电激活眼镜镜片的改进制造装置和方法
JP5011820B2 (ja) * 2006-05-24 2012-08-29 オムロン株式会社 積層デバイス、およびその製造方法
AR064985A1 (es) * 2007-01-22 2009-05-06 E Vision Llc Lente electroactivo flexible
US8215770B2 (en) * 2007-02-23 2012-07-10 E-A Ophthalmics Ophthalmic dynamic aperture
US20100076553A1 (en) * 2008-09-22 2010-03-25 Pugh Randall B Energized ophthalmic lens
US9296158B2 (en) * 2008-09-22 2016-03-29 Johnson & Johnson Vision Care, Inc. Binder of energized components in an ophthalmic lens
US8348424B2 (en) * 2008-09-30 2013-01-08 Johnson & Johnson Vision Care, Inc. Variable focus ophthalmic device
US9427920B2 (en) * 2008-09-30 2016-08-30 Johnson & Johnson Vision Care, Inc. Energized media for an ophthalmic device
US9375886B2 (en) * 2008-10-31 2016-06-28 Johnson & Johnson Vision Care Inc. Ophthalmic device with embedded microcontroller
JP5694947B2 (ja) * 2008-12-11 2015-04-01 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 医療用途のための伸張性電子部品を使用する装置
US8137148B2 (en) * 2009-09-30 2012-03-20 General Electric Company Method of manufacturing monolithic parallel interconnect structure
JP2013534847A (ja) * 2010-06-20 2013-09-09 エレンザ， インコーポレイテッド 特定用途向け集積回路を備える眼科デバイスおよび方法

Also Published As

Publication number Publication date
CN104204914A (zh) 2014-12-10
BR112014018456A8 (pt) 2017-07-11
AU2013211968B2 (en) 2016-09-29
RU2629902C2 (ru) 2017-09-04
WO2013112862A1 (en) 2013-08-01
RU2014134722A (ru) 2016-03-20
JP2015510143A (ja) 2015-04-02
AU2013211968A1 (en) 2014-09-11
KR20140117618A (ko) 2014-10-07
JP6312605B2 (ja) 2018-04-18
TWI616325B (zh) 2018-03-01
CN104204914B (zh) 2018-06-15
TW201341165A (zh) 2013-10-16
BR112014018456A2 (pt) 2017-06-20
EP2807518A1 (en) 2014-12-03
CA2862666A1 (en) 2013-08-01
HK1204680A1 (en) 2015-11-27

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