SG11201401251TA - Slurry and method for producing slurry - Google Patents
Slurry and method for producing slurryInfo
- Publication number
- SG11201401251TA SG11201401251TA SG11201401251TA SG11201401251TA SG11201401251TA SG 11201401251T A SG11201401251T A SG 11201401251TA SG 11201401251T A SG11201401251T A SG 11201401251TA SG 11201401251T A SG11201401251T A SG 11201401251TA SG 11201401251T A SG11201401251T A SG 11201401251TA
- Authority
- SG
- Singapore
- Prior art keywords
- slurry
- producing
- producing slurry
- Prior art date
Links
- 239000002002 slurry Substances 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1472—Non-aqueous liquid suspensions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/007—Use, recovery or regeneration of abrasive mediums
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011235924A JP5594273B2 (ja) | 2011-10-27 | 2011-10-27 | スラリー及びスラリーの製造方法 |
PCT/JP2012/006377 WO2013061519A1 (ja) | 2011-10-27 | 2012-10-04 | スラリー及びスラリーの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201401251TA true SG11201401251TA (en) | 2014-08-28 |
Family
ID=48167376
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201401251TA SG11201401251TA (en) | 2011-10-27 | 2012-10-04 | Slurry and method for producing slurry |
Country Status (8)
Country | Link |
---|---|
US (1) | US9260643B2 (ko) |
JP (1) | JP5594273B2 (ko) |
KR (1) | KR101887874B1 (ko) |
CN (1) | CN103906601B (ko) |
DE (1) | DE112012003990B4 (ko) |
SG (1) | SG11201401251TA (ko) |
TW (1) | TWI500478B (ko) |
WO (1) | WO2013061519A1 (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6432453B2 (ja) * | 2015-06-23 | 2018-12-05 | 株式会社Sumco | ワイヤーソー装置およびワークの切断方法 |
JP6604313B2 (ja) | 2016-11-10 | 2019-11-13 | 株式会社Sumco | 砥粒の評価方法並びにウェーハの製造方法 |
CN106914804A (zh) * | 2017-03-28 | 2017-07-04 | 安庆机床有限公司 | 一体化磨球机 |
CN109530061B (zh) * | 2018-12-07 | 2020-11-03 | 徐州徐薯薯业科技有限公司 | 小麦研磨装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1143923A (en) | 1965-04-06 | 1969-02-26 | Rank Xerox Ltd | Improvements in polishing and polishing materials |
JPS63114865A (ja) | 1986-10-30 | 1988-05-19 | Shin Etsu Chem Co Ltd | 超精密研磨用研磨材 |
US6046110A (en) | 1995-06-08 | 2000-04-04 | Kabushiki Kaisha Toshiba | Copper-based metal polishing solution and method for manufacturing a semiconductor device |
JPH09314459A (ja) * | 1996-05-29 | 1997-12-09 | Sanyo Chem Ind Ltd | 水性ラップ液組成物 |
US6602439B1 (en) * | 1997-02-24 | 2003-08-05 | Superior Micropowders, Llc | Chemical-mechanical planarization slurries and powders and methods for using same |
US6383991B1 (en) * | 1998-04-03 | 2002-05-07 | Kao Corporation | Cutting oil composition |
JP4248895B2 (ja) | 2003-02-27 | 2009-04-02 | Sumco Techxiv株式会社 | スラリ再生方法及びワイヤソーシステム |
JP2006224266A (ja) * | 2005-02-18 | 2006-08-31 | Sumco Corp | ワイヤソーを用いたインゴット切断方法 |
JP5352872B2 (ja) * | 2007-03-15 | 2013-11-27 | 国立大学法人宇都宮大学 | 研磨用複合粒子の製造方法 |
CN102369268A (zh) | 2009-03-31 | 2012-03-07 | 出光兴产株式会社 | 脆性材料用加工液以及硬质材料用加工液 |
JP4605298B1 (ja) * | 2009-07-03 | 2011-01-05 | 横浜ゴム株式会社 | 空気入りタイヤ |
JP2011171689A (ja) * | 2009-07-07 | 2011-09-01 | Kao Corp | シリコンウエハ用研磨液組成物 |
JP5499324B2 (ja) * | 2010-04-28 | 2014-05-21 | 旭硝子株式会社 | 情報記録媒体用ガラス基板及びその製造のための研磨用コロイダルシリカスラリー、並びに情報記録媒体 |
-
2011
- 2011-10-27 JP JP2011235924A patent/JP5594273B2/ja active Active
-
2012
- 2012-10-04 WO PCT/JP2012/006377 patent/WO2013061519A1/ja active Application Filing
- 2012-10-04 SG SG11201401251TA patent/SG11201401251TA/en unknown
- 2012-10-04 KR KR1020147010957A patent/KR101887874B1/ko active IP Right Grant
- 2012-10-04 CN CN201280051638.7A patent/CN103906601B/zh active Active
- 2012-10-04 DE DE112012003990.4T patent/DE112012003990B4/de active Active
- 2012-10-04 US US14/349,276 patent/US9260643B2/en active Active
- 2012-10-25 TW TW101139497A patent/TWI500478B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR101887874B1 (ko) | 2018-08-14 |
TW201336627A (zh) | 2013-09-16 |
DE112012003990T5 (de) | 2014-06-12 |
WO2013061519A1 (ja) | 2013-05-02 |
JP5594273B2 (ja) | 2014-09-24 |
TWI500478B (zh) | 2015-09-21 |
KR20140103907A (ko) | 2014-08-27 |
US9260643B2 (en) | 2016-02-16 |
JP2013091141A (ja) | 2013-05-16 |
CN103906601A (zh) | 2014-07-02 |
CN103906601B (zh) | 2017-06-20 |
US20150000208A1 (en) | 2015-01-01 |
DE112012003990B4 (de) | 2021-07-08 |
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