SG11201400840UA - Microelectronic substrate cleaning compositions having copper/azole polymer inhibition - Google Patents
Microelectronic substrate cleaning compositions having copper/azole polymer inhibitionInfo
- Publication number
- SG11201400840UA SG11201400840UA SG11201400840UA SG11201400840UA SG11201400840UA SG 11201400840U A SG11201400840U A SG 11201400840UA SG 11201400840U A SG11201400840U A SG 11201400840UA SG 11201400840U A SG11201400840U A SG 11201400840UA SG 11201400840U A SG11201400840U A SG 11201400840UA
- Authority
- SG
- Singapore
- Prior art keywords
- copper
- cleaning compositions
- substrate cleaning
- microelectronic substrate
- azole polymer
- Prior art date
Links
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 title 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 238000004140 cleaning Methods 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 230000005764 inhibitory process Effects 0.000 title 1
- 238000004377 microelectronic Methods 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 229920000642 polymer Polymers 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0073—Anticorrosion compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3281—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/34—Organic compounds containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/263—Ethers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Emergency Medicine (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Detergent Compositions (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161626915P | 2011-10-05 | 2011-10-05 | |
| PCT/US2012/058976 WO2013052809A1 (en) | 2011-10-05 | 2012-10-05 | Microelectronic substrate cleaning compositions having copper/azole polymer inhibition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201400840UA true SG11201400840UA (en) | 2014-04-28 |
Family
ID=48044188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201400840UA SG11201400840UA (en) | 2011-10-05 | 2012-10-05 | Microelectronic substrate cleaning compositions having copper/azole polymer inhibition |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US10133180B2 (zh) |
| EP (1) | EP2764079A4 (zh) |
| JP (1) | JP6033314B2 (zh) |
| KR (1) | KR101999641B1 (zh) |
| CN (1) | CN103975052B (zh) |
| IL (1) | IL231874A0 (zh) |
| MY (1) | MY172099A (zh) |
| SG (1) | SG11201400840UA (zh) |
| WO (1) | WO2013052809A1 (zh) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9441115B2 (en) * | 2011-11-14 | 2016-09-13 | Tantz Environmental Technologies Ltd. | Aqueous phase pore sealing agent imroving PCB coating oxidation-resistant and corrosion-resistant properties and method for using same |
| TWI518467B (zh) * | 2013-11-15 | 2016-01-21 | 達興材料股份有限公司 | 光阻脫除劑和電子元件及其製造方法 |
| KR101976885B1 (ko) * | 2014-11-07 | 2019-05-10 | 삼성에스디아이 주식회사 | 유기막 연마 후 세정조성물 및 이를 이용한 세정방법 |
| US10233413B2 (en) * | 2015-09-23 | 2019-03-19 | Versum Materials Us, Llc | Cleaning formulations |
| WO2018100595A1 (ja) * | 2016-11-29 | 2018-06-07 | パナソニックＩｐマネジメント株式会社 | レジスト剥離液 |
| CN108235741B (zh) * | 2016-12-28 | 2019-05-28 | 松下知识产权经营株式会社 | 抗蚀剂剥离液 |
| CN114008181A (zh) * | 2019-06-19 | 2022-02-01 | 弗萨姆材料美国有限责任公司 | 用于半导体衬底的清洁组合物 |
| US11214762B2 (en) * | 2019-08-05 | 2022-01-04 | Chem-Trend Limited Partnership | Compositions and methods for cleaning urethane molds |
| CN114502708A (zh) * | 2019-09-30 | 2022-05-13 | 弗萨姆材料美国有限责任公司 | 光致抗蚀剂去除剂 |
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| US7135445B2 (en) * | 2001-12-04 | 2006-11-14 | Ekc Technology, Inc. | Process for the use of bis-choline and tris-choline in the cleaning of quartz-coated polysilicon and other materials |
| US6413923B2 (en) * | 1999-11-15 | 2002-07-02 | Arch Specialty Chemicals, Inc. | Non-corrosive cleaning composition for removing plasma etching residues |
| EP1138726B1 (en) | 2000-03-27 | 2005-01-12 | Shipley Company LLC | Polymer remover |
| US6455479B1 (en) * | 2000-08-03 | 2002-09-24 | Shipley Company, L.L.C. | Stripping composition |
| US6558879B1 (en) * | 2000-09-25 | 2003-05-06 | Ashland Inc. | Photoresist stripper/cleaner compositions containing aromatic acid inhibitors |
| KR100438015B1 (ko) * | 2001-10-10 | 2004-06-30 | 엘지.필립스 엘시디 주식회사 | 구리용 레지스트 제거용 조성물 |
| JP2003129089A (ja) | 2001-10-24 | 2003-05-08 | Daikin Ind Ltd | 洗浄用組成物 |
| WO2003064581A1 (en) | 2002-01-28 | 2003-08-07 | Ekc Technology, Inc. | Methods and compositions for chemically treating a substrate using foam technology |
| US20040055621A1 (en) | 2002-09-24 | 2004-03-25 | Air Products And Chemicals, Inc. | Processing of semiconductor components with dense processing fluids and ultrasonic energy |
| EP1505146A1 (en) | 2003-08-05 | 2005-02-09 | Air Products And Chemicals, Inc. | Processing of substrates with dense fluids comprising acetylenic diols and/or alcohols |
| US20050032657A1 (en) | 2003-08-06 | 2005-02-10 | Kane Sean Michael | Stripping and cleaning compositions for microelectronics |
| US7384900B2 (en) | 2003-08-27 | 2008-06-10 | Lg Display Co., Ltd. | Composition and method for removing copper-compatible resist |
| US7767636B2 (en) | 2004-03-01 | 2010-08-03 | Mallinckrodt Baker, Inc. | Nanoelectronic and microelectronic cleaning compositions |
| US8030263B2 (en) * | 2004-07-01 | 2011-10-04 | Air Products And Chemicals, Inc. | Composition for stripping and cleaning and use thereof |
| PL1787168T3 (pl) | 2004-07-15 | 2010-11-30 | Avantor Performance Mat Inc | Zawierające fruktozę, niewodne kompozycje do czyszczenia mikroelektroniki |
| US20060094612A1 (en) * | 2004-11-04 | 2006-05-04 | Mayumi Kimura | Post etch cleaning composition for use with substrates having aluminum |
| KR20060064441A (ko) | 2004-12-08 | 2006-06-13 | 말린크로트 베이커, 인코포레이티드 | 비수성 비부식성 마이크로전자 세정 조성물 |
| ATE463763T1 (de) | 2004-12-10 | 2010-04-15 | Mallinckrodt Baker Inc | Wasserfreie nicht korrosive mikroelektronische reinigungsverbindungen mit polymerischen corrosionsinhibitoren |
| EP1701218A3 (en) | 2005-03-11 | 2008-10-15 | Rohm and Haas Electronic Materials LLC | Polymer remover |
| WO2006110645A2 (en) | 2005-04-11 | 2006-10-19 | Advanced Technology Materials, Inc. | Fluoride liquid cleaners with polar and non-polar solvent mixtures for cleaning low-k-containing microelectronic devices |
| CN101233456B (zh) | 2005-06-07 | 2013-01-02 | 高级技术材料公司 | 金属和电介质相容的牺牲性抗反射涂层清洗及去除组合物 |
| JP4741315B2 (ja) | 2005-08-11 | 2011-08-03 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | ポリマー除去組成物 |
| WO2007036728A1 (en) | 2005-09-30 | 2007-04-05 | Peratech Limited | Fabric bag including control device |
| KR20080059429A (ko) | 2005-10-05 | 2008-06-27 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | 게이트 스페이서 산화물 재료를 선택적으로 에칭하기 위한조성물 및 방법 |
| EP1932174A4 (en) | 2005-10-05 | 2009-09-23 | Advanced Tech Materials | AQUEOUS OXIDIZING CLEANER FOR REMOVING RESIDUES AFTER A PLASMA ATTACK |
| EP1945748A4 (en) | 2005-10-13 | 2009-01-07 | Advanced Tech Materials | PHOTORESIN REMOVAL AND / OR SACRIFICIAL ANTIREFLECTION COATING COMPOSITION COMPATIBLE WITH METALS |
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| US7960328B2 (en) | 2005-11-09 | 2011-06-14 | Advanced Technology Materials, Inc. | Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon |
| US20080139436A1 (en) * | 2006-09-18 | 2008-06-12 | Chris Reid | Two step cleaning process to remove resist, etch residue, and copper oxide from substrates having copper and low-K dielectric material |
| US20080076688A1 (en) | 2006-09-21 | 2008-03-27 | Barnes Jeffrey A | Copper passivating post-chemical mechanical polishing cleaning composition and method of use |
| US8685909B2 (en) | 2006-09-21 | 2014-04-01 | Advanced Technology Materials, Inc. | Antioxidants for post-CMP cleaning formulations |
| WO2008039730A1 (en) | 2006-09-25 | 2008-04-03 | Advanced Technology Materials, Inc. | Compositions and methods for the removal of photoresist for a wafer rework application |
| US20080125342A1 (en) | 2006-11-07 | 2008-05-29 | Advanced Technology Materials, Inc. | Formulations for cleaning memory device structures |
| JP5072091B2 (ja) * | 2006-12-08 | 2012-11-14 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP5237300B2 (ja) | 2006-12-21 | 2013-07-17 | アドバンスド テクノロジー マテリアルズ，インコーポレイテッド | エッチング後残留物を除去するための液体洗浄剤 |
| SG166102A1 (en) | 2007-03-31 | 2010-11-29 | Advanced Tech Materials | Methods for stripping material for wafer reclamation |
| MY162607A (en) * | 2007-05-17 | 2017-06-30 | Entegris Inc | New antioxidants for post-cmp cleaning formulations |
| US7933350B2 (en) | 2007-10-30 | 2011-04-26 | Telefonaktiebolaget Lm Ericsson (Publ) | Channel-dependent frequency-domain scheduling in an orthogonal frequency division multiplexing communications system |
| KR20090072546A (ko) | 2007-12-28 | 2009-07-02 | 삼성전자주식회사 | 포토레지스트 제거용 조성물 및 이를 이용한 어레이 기판의제조 방법 |
| US8110535B2 (en) * | 2009-08-05 | 2012-02-07 | Air Products And Chemicals, Inc. | Semi-aqueous stripping and cleaning formulation for metal substrate and methods for using same |
| TWI548738B (zh) * | 2010-07-16 | 2016-09-11 | 安堤格里斯公司 | 用於移除蝕刻後殘餘物之水性清潔劑 |
-
2012
- 2012-10-05 EP EP12838061.5A patent/EP2764079A4/en not_active Withdrawn
- 2012-10-05 US US14/348,955 patent/US10133180B2/en active Active
- 2012-10-05 JP JP2014534771A patent/JP6033314B2/ja active Active
- 2012-10-05 CN CN201280059946.4A patent/CN103975052B/zh active Active
- 2012-10-05 MY MYPI2014000926A patent/MY172099A/en unknown
- 2012-10-05 KR KR1020147010619A patent/KR101999641B1/ko active IP Right Grant
- 2012-10-05 SG SG11201400840UA patent/SG11201400840UA/en unknown
- 2012-10-05 WO PCT/US2012/058976 patent/WO2013052809A1/en active Application Filing
-
2014
- 2014-04-02 IL IL231874A patent/IL231874A0/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US10133180B2 (en) | 2018-11-20 |
| MY172099A (en) | 2019-11-13 |
| KR101999641B1 (ko) | 2019-07-12 |
| WO2013052809A1 (en) | 2013-04-11 |
| CN103975052B (zh) | 2016-11-09 |
| EP2764079A4 (en) | 2015-06-03 |
| JP2014534627A (ja) | 2014-12-18 |
| KR20140082713A (ko) | 2014-07-02 |
| IL231874A0 (en) | 2014-05-28 |
| CN103975052A (zh) | 2014-08-06 |
| US20140249065A1 (en) | 2014-09-04 |
| JP6033314B2 (ja) | 2016-11-30 |
| EP2764079A1 (en) | 2014-08-13 |
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