SG11201400363TA - Conductive resin composition and cured object using same - Google Patents

Conductive resin composition and cured object using same

Info

Publication number
SG11201400363TA
SG11201400363TA SG11201400363TA SG11201400363TA SG11201400363TA SG 11201400363T A SG11201400363T A SG 11201400363TA SG 11201400363T A SG11201400363T A SG 11201400363TA SG 11201400363T A SG11201400363T A SG 11201400363TA SG 11201400363T A SG11201400363T A SG 11201400363TA
Authority
SG
Singapore
Prior art keywords
same
resin composition
conductive resin
cured object
cured
Prior art date
Application number
SG11201400363TA
Other languages
English (en)
Inventor
Noritsuka Mizumura
Takashi Yamaguchi
Yoko Nagara
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of SG11201400363TA publication Critical patent/SG11201400363TA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/05—Polymer mixtures characterised by other features containing polymer components which can react with one another

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
SG11201400363TA 2011-09-05 2012-09-04 Conductive resin composition and cured object using same SG11201400363TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011193136 2011-09-05
PCT/JP2012/072441 WO2013035685A1 (ja) 2011-09-05 2012-09-04 導電性樹脂組成物及びそれを使用した硬化体

Publications (1)

Publication Number Publication Date
SG11201400363TA true SG11201400363TA (en) 2014-08-28

Family

ID=47832130

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201400363TA SG11201400363TA (en) 2011-09-05 2012-09-04 Conductive resin composition and cured object using same

Country Status (6)

Country Link
US (1) US9249294B2 (zh)
JP (1) JP5997697B2 (zh)
KR (1) KR101906644B1 (zh)
SG (1) SG11201400363TA (zh)
TW (1) TWI545173B (zh)
WO (1) WO2013035685A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6632618B2 (ja) * 2015-05-28 2020-01-22 タツタ電線株式会社 実装用導電性ペースト
CN109689824B (zh) * 2016-11-25 2021-06-18 株式会社Lg化学 可固化组合物
WO2018226710A1 (en) * 2017-06-09 2018-12-13 Hexion Inc. Epoxy resin systems for composites
EP3460959A1 (de) * 2017-09-20 2019-03-27 Siemens Aktiengesellschaft Elektrisches isolationsmaterial und/oder imprägnierharz für die wickelbandisolierung einer mittel- und/oder hochspannungsmaschine sowie ein isolationssystem daraus
US11542417B2 (en) 2018-10-29 2023-01-03 Namics Corporation Conductive resin composition, conductive adhesive, and semiconductor device
CN113429890B (zh) * 2021-07-14 2023-06-02 嘉兴蓉阳电子科技有限公司 复合型固化剂、胶黏剂、导电胶及其制备方法、应用

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62225537A (ja) * 1986-03-27 1987-10-03 Showa Highpolymer Co Ltd 繊維強化樹脂用硬化性組成物
JP3599149B2 (ja) 1996-08-21 2004-12-08 日立化成工業株式会社 導電ペースト、導電ペーストを用いた電気回路及び電気回路の製造法
JP2001181482A (ja) * 1999-12-27 2001-07-03 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JP2003119248A (ja) 2001-10-17 2003-04-23 Mitsui Chemicals Inc 液晶封止用樹脂組成物
EP1308434B1 (en) 2001-11-01 2006-03-15 Nippon Shokubai Co., Ltd. (Meth)acryloyl group-containing compound and method for producing the same
JP2006124531A (ja) * 2004-10-29 2006-05-18 Shin Etsu Chem Co Ltd 異方導電性接着剤
JP5098361B2 (ja) * 2006-03-08 2012-12-12 日立化成工業株式会社 ダイボンディング用樹脂ペースト、それを用いた半導体装置の製造方法及び半導体装置
US20070212551A1 (en) 2006-03-10 2007-09-13 Andrew Collins Adhesive composition
JP5484792B2 (ja) * 2009-05-29 2014-05-07 日立化成株式会社 接着剤組成物、接着シート及び半導体装置

Also Published As

Publication number Publication date
TWI545173B (zh) 2016-08-11
WO2013035685A1 (ja) 2013-03-14
US9249294B2 (en) 2016-02-02
KR101906644B1 (ko) 2018-10-10
JPWO2013035685A1 (ja) 2015-03-23
KR20140067087A (ko) 2014-06-03
US20140243453A1 (en) 2014-08-28
JP5997697B2 (ja) 2016-09-28
TW201317321A (zh) 2013-05-01

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