SG108274A1 - Laser processing device - Google Patents

Laser processing device

Info

Publication number
SG108274A1
SG108274A1 SG200105780A SG200105780A SG108274A1 SG 108274 A1 SG108274 A1 SG 108274A1 SG 200105780 A SG200105780 A SG 200105780A SG 200105780 A SG200105780 A SG 200105780A SG 108274 A1 SG108274 A1 SG 108274A1
Authority
SG
Singapore
Prior art keywords
processing device
laser processing
laser
processing
Prior art date
Application number
SG200105780A
Inventor
Horikoshi Satoshi
Ohta Koji
Original Assignee
Laserfront Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laserfront Technologies Inc filed Critical Laserfront Technologies Inc
Publication of SG108274A1 publication Critical patent/SG108274A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Lasers (AREA)
  • Laser Beam Processing (AREA)
SG200105780A 2000-09-25 2001-09-24 Laser processing device SG108274A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000290634A JP2002103066A (en) 2000-09-25 2000-09-25 Laser beam machining device

Publications (1)

Publication Number Publication Date
SG108274A1 true SG108274A1 (en) 2005-01-28

Family

ID=18773835

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200105780A SG108274A1 (en) 2000-09-25 2001-09-24 Laser processing device

Country Status (6)

Country Link
JP (1) JP2002103066A (en)
KR (1) KR100444919B1 (en)
CN (1) CN100407521C (en)
MY (1) MY124900A (en)
SG (1) SG108274A1 (en)
TW (1) TW504879B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100911365B1 (en) * 2007-08-02 2009-08-07 주식회사 파이컴 Laser trimming apparatus and method using image processing
JP5620669B2 (en) * 2009-10-26 2014-11-05 東芝機械株式会社 Laser dicing method and laser dicing apparatus
JP5452247B2 (en) * 2010-01-21 2014-03-26 東芝機械株式会社 Laser dicing equipment
JP5981094B2 (en) 2010-06-24 2016-08-31 東芝機械株式会社 Dicing method
JP5140198B1 (en) 2011-07-27 2013-02-06 東芝機械株式会社 Laser dicing method
JP2014011358A (en) 2012-06-29 2014-01-20 Toshiba Mach Co Ltd Laser dicing method
KR20150088296A (en) * 2012-11-26 2015-07-31 비아 메카닉스 가부시키가이샤 Laser machining device and laser machining method
KR101502770B1 (en) * 2014-02-27 2015-03-18 주식회사 이피코 Driving Control Circuit For Pulse Laser
CN104009385B (en) * 2014-06-04 2017-08-25 大族激光科技产业集团股份有限公司 Laser power control method and system
CN104765335B (en) * 2015-01-29 2016-01-27 深圳市创鑫激光股份有限公司 A kind of frequency pulse selector switch and system of selection
CN110798190B (en) * 2019-10-08 2021-07-20 南京航空航天大学 Electromagnetic interference prevention electronic switch system
KR102221082B1 (en) * 2020-02-13 2021-02-26 (주)엘트라글로벌 Method of generating multi laser pulse using multi Q-switching and Apparatus of generating multi laser pulse

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4461005A (en) * 1980-10-27 1984-07-17 Ward Ernest M High peak power, high PRF laser system
JPH0498801A (en) * 1990-08-16 1992-03-31 Matsushita Electric Ind Co Ltd Laser trimming device
DE4105451A1 (en) * 1990-12-12 1992-06-17 Baasel Carl Lasertech Pulsed laser with driver circuit - associated with beam chopper and phase shifter
WO1999065123A1 (en) * 1998-06-12 1999-12-16 General Scanning, Inc. Pulse control in laser systems
JP2001353585A (en) * 2000-06-09 2001-12-25 Nec Corp Laser beam irradiation device for laser beam trimming device and method of controlling laser pulse width

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3132555B2 (en) * 1997-05-12 2001-02-05 日本電気株式会社 Laser processing equipment
JPH11354876A (en) * 1998-06-12 1999-12-24 Nec Corp Ultrasonic q-switch device and q-switched laser output device
JP4003996B2 (en) * 1998-09-21 2007-11-07 ミヤチテクノス株式会社 Q-switch type laser device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4461005A (en) * 1980-10-27 1984-07-17 Ward Ernest M High peak power, high PRF laser system
JPH0498801A (en) * 1990-08-16 1992-03-31 Matsushita Electric Ind Co Ltd Laser trimming device
DE4105451A1 (en) * 1990-12-12 1992-06-17 Baasel Carl Lasertech Pulsed laser with driver circuit - associated with beam chopper and phase shifter
WO1999065123A1 (en) * 1998-06-12 1999-12-16 General Scanning, Inc. Pulse control in laser systems
JP2001353585A (en) * 2000-06-09 2001-12-25 Nec Corp Laser beam irradiation device for laser beam trimming device and method of controlling laser pulse width

Also Published As

Publication number Publication date
KR20020024549A (en) 2002-03-30
JP2002103066A (en) 2002-04-09
CN100407521C (en) 2008-07-30
TW504879B (en) 2002-10-01
KR100444919B1 (en) 2004-08-18
MY124900A (en) 2006-07-31
CN1347176A (en) 2002-05-01

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