SG105487A1 - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method

Info

Publication number
SG105487A1
SG105487A1 SG200101604A SG200101604A SG105487A1 SG 105487 A1 SG105487 A1 SG 105487A1 SG 200101604 A SG200101604 A SG 200101604A SG 200101604 A SG200101604 A SG 200101604A SG 105487 A1 SG105487 A1 SG 105487A1
Authority
SG
Singapore
Prior art keywords
substrate processing
processing apparatus
processing method
substrate
processing
Prior art date
Application number
SG200101604A
Other languages
English (en)
Inventor
Kitano Takahiro
Matsuyama Yuji
Kitano Junichi
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG105487A1 publication Critical patent/SG105487A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
SG200101604A 2000-03-30 2001-03-15 Substrate processing apparatus and substrate processing method SG105487A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000093757 2000-03-30

Publications (1)

Publication Number Publication Date
SG105487A1 true SG105487A1 (en) 2004-08-27

Family

ID=18608898

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200101604A SG105487A1 (en) 2000-03-30 2001-03-15 Substrate processing apparatus and substrate processing method

Country Status (4)

Country Link
US (1) US6633022B2 (ko)
KR (1) KR100628584B1 (ko)
SG (1) SG105487A1 (ko)
TW (1) TW523784B (ko)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3590328B2 (ja) * 2000-05-11 2004-11-17 東京エレクトロン株式会社 塗布現像処理方法及び塗布現像処理システム
DE10216786C5 (de) * 2002-04-15 2009-10-15 Ers Electronic Gmbh Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden
KR101018259B1 (ko) * 2002-09-10 2011-03-03 액셀리스 테크놀로지스, 인크. 일정 온도 척을 사용하여 가변 온도 프로세스로 기판을 가열하는 방법
KR100571841B1 (ko) * 2004-06-21 2006-04-17 삼성전자주식회사 베이크 시스템
WO2006025183A1 (ja) * 2004-08-30 2006-03-09 Daikin Industries, Ltd. ウェハ温度調整装置及びウェハ温度調整方法
DE102004044176A1 (de) * 2004-09-13 2006-03-30 BSH Bosch und Siemens Hausgeräte GmbH Trocknungsverfahren für ein Haushaltsgerät und Haushaltsgerät zur Durchführung des Trocknungsverfahren
US7255747B2 (en) 2004-12-22 2007-08-14 Sokudo Co., Ltd. Coat/develop module with independent stations
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
JP5055756B2 (ja) * 2005-09-21 2012-10-24 東京エレクトロン株式会社 熱処理装置及び記憶媒体
KR100671170B1 (ko) * 2005-09-23 2007-01-19 태화일렉트론(주) 포토레지스트 건조/경화 장치 및 그 방법
JP4527670B2 (ja) * 2006-01-25 2010-08-18 東京エレクトロン株式会社 加熱処理装置、加熱処理方法、制御プログラムおよびコンピュータ読取可能な記憶媒体
JP5109376B2 (ja) * 2007-01-22 2012-12-26 東京エレクトロン株式会社 加熱装置、加熱方法及び記憶媒体
JP2008235315A (ja) * 2007-03-16 2008-10-02 Tokyo Electron Ltd 基板処理装置、基板処理方法および記録媒体
US8596336B2 (en) * 2008-06-03 2013-12-03 Applied Materials, Inc. Substrate support temperature control
US10240867B2 (en) 2012-02-01 2019-03-26 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US11713924B2 (en) 2012-02-01 2023-08-01 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US9644891B2 (en) 2012-02-01 2017-05-09 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US9970708B2 (en) 2012-02-01 2018-05-15 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US9513053B2 (en) 2013-03-14 2016-12-06 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
CN107024078B (zh) 2012-02-01 2021-03-26 振兴电子有限责任公司 用于干燥电子装置的方法和设备
US10876792B2 (en) 2012-02-01 2020-12-29 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US10690413B2 (en) 2012-02-01 2020-06-23 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
CA3009047A1 (en) 2014-12-23 2016-06-30 Revive Electronics, LLC Apparatuses and methods for controlling power to electronic devices
TW201639063A (zh) * 2015-01-22 2016-11-01 應用材料股份有限公司 批量加熱和冷卻腔室或負載鎖定裝置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5002010A (en) * 1989-10-18 1991-03-26 Varian Associates, Inc. Vacuum vessel
JPH04192324A (ja) * 1990-11-24 1992-07-10 Sony Corp イオン注入装置
DE4200038A1 (de) * 1991-04-11 1992-10-22 Mitsubishi Electric Corp Verfahren und vorrichtung zum brennen einer photolackschicht

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01248529A (ja) 1988-03-30 1989-10-04 Ushio Inc Ｓｏｇ膜の硬化方法
TW464944B (en) 1997-01-16 2001-11-21 Tokyo Electron Ltd Baking apparatus and baking method
US6280790B1 (en) * 1997-06-30 2001-08-28 Applied Materials, Inc. Reducing the deposition rate of volatile contaminants onto an optical component of a substrate processing system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5002010A (en) * 1989-10-18 1991-03-26 Varian Associates, Inc. Vacuum vessel
JPH04192324A (ja) * 1990-11-24 1992-07-10 Sony Corp イオン注入装置
DE4200038A1 (de) * 1991-04-11 1992-10-22 Mitsubishi Electric Corp Verfahren und vorrichtung zum brennen einer photolackschicht

Also Published As

Publication number Publication date
KR100628584B1 (ko) 2006-09-26
TW523784B (en) 2003-03-11
KR20010094981A (ko) 2001-11-03
US6633022B2 (en) 2003-10-14
US20010025431A1 (en) 2001-10-04

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