SG10202008945WA - Resin molding apparatus and resin molded product manufacturing method - Google Patents
Resin molding apparatus and resin molded product manufacturing methodInfo
- Publication number
- SG10202008945WA SG10202008945WA SG10202008945WA SG10202008945WA SG10202008945WA SG 10202008945W A SG10202008945W A SG 10202008945WA SG 10202008945W A SG10202008945W A SG 10202008945WA SG 10202008945W A SG10202008945W A SG 10202008945WA SG 10202008945W A SG10202008945W A SG 10202008945WA
- Authority
- SG
- Singapore
- Prior art keywords
- molded product
- molding apparatus
- resin
- product manufacturing
- resin molded
- Prior art date
Links
- 239000011347 resin Substances 0.000 title 2
- 229920005989 resin Polymers 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000465 moulding Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
- B29C45/021—Plunger drives; Pressure equalizing means for a plurality of transfer plungers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/03—Injection moulding apparatus
- B29C45/04—Injection moulding apparatus using movable moulds or mould halves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1742—Mounting of moulds; Mould supports
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/53—Means for plasticising or homogenising the moulding material or forcing it into the mould using injection ram or piston
- B29C45/531—Drive means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/58—Details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/64—Mould opening, closing or clamping devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/70—Means for plasticising or homogenising the moulding material or forcing it into the mould, combined with mould opening, closing or clamping devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C2037/90—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/84—Safety devices
- B29C2045/848—Safety devices detecting or preventing overload of an injection plunger
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/766—Measuring, controlling or regulating the setting or resetting of moulding conditions, e.g. before starting a cycle
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019221116A JP7203715B2 (ja) | 2019-12-06 | 2019-12-06 | 樹脂成形装置および樹脂成形品の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202008945WA true SG10202008945WA (en) | 2021-07-29 |
Family
ID=76162513
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202008945WA SG10202008945WA (en) | 2019-12-06 | 2020-09-14 | Resin molding apparatus and resin molded product manufacturing method |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7203715B2 (zh) |
KR (1) | KR102419758B1 (zh) |
CN (1) | CN112917812A (zh) |
SG (1) | SG10202008945WA (zh) |
TW (1) | TWI781465B (zh) |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL193526C (nl) * | 1991-02-26 | 2000-01-04 | Boschman Tech Bv | Inrichting voor het omhullen van elektronische onderdelen met een kunststof. |
JPH11260844A (ja) | 1998-03-12 | 1999-09-24 | Toshiba Corp | 半導体樹脂封止装置 |
JP2000343576A (ja) | 1999-06-09 | 2000-12-12 | Mitsubishi Electric Corp | 射出成形機、半導体封止装置、及び半導体装置の製造方法 |
JP2002018889A (ja) | 2000-07-07 | 2002-01-22 | Shibaura Mechatronics Corp | 半導体モールド装置の制御方法 |
JP2003347329A (ja) | 2002-05-29 | 2003-12-05 | Sainekkusu:Kk | 半導体樹脂封止装置 |
JP5039443B2 (ja) | 2007-06-18 | 2012-10-03 | アピックヤマダ株式会社 | トランスファ成型装置および半導体装置の製造方法 |
JP5151553B2 (ja) | 2008-02-29 | 2013-02-27 | 日本電気株式会社 | 樹脂射出装置、樹脂射出方法、樹脂射出プログラム及び記録媒体 |
JP5608523B2 (ja) | 2010-11-26 | 2014-10-15 | アピックヤマダ株式会社 | 樹脂封止装置 |
JP2013026360A (ja) * | 2011-07-20 | 2013-02-04 | Apic Yamada Corp | 樹脂封止装置 |
JP5944866B2 (ja) * | 2013-06-20 | 2016-07-05 | Towa株式会社 | 電子部品の圧縮樹脂封止方法及び圧縮樹脂封止装置 |
KR102324570B1 (ko) * | 2014-12-04 | 2021-11-09 | 익스트루드 투 필, 인크. | 사출 몰딩 시스템을 위한 노즐 차단 |
JP6546879B2 (ja) * | 2016-05-26 | 2019-07-17 | アピックヤマダ株式会社 | 樹脂成形金型および樹脂成形方法 |
WO2018146755A1 (ja) * | 2017-02-08 | 2018-08-16 | 信越エンジニアリング株式会社 | 樹脂封止装置及び樹脂封止方法 |
JP6482616B2 (ja) * | 2017-08-21 | 2019-03-13 | Towa株式会社 | 樹脂成形装置及び樹脂成形品製造方法 |
-
2019
- 2019-12-06 JP JP2019221116A patent/JP7203715B2/ja active Active
-
2020
- 2020-09-14 SG SG10202008945WA patent/SG10202008945WA/en unknown
- 2020-10-15 CN CN202011100354.5A patent/CN112917812A/zh active Pending
- 2020-10-21 TW TW109136356A patent/TWI781465B/zh active
- 2020-11-02 KR KR1020200144346A patent/KR102419758B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR102419758B1 (ko) | 2022-07-11 |
KR20210071823A (ko) | 2021-06-16 |
JP7203715B2 (ja) | 2023-01-13 |
JP2021091094A (ja) | 2021-06-17 |
CN112917812A (zh) | 2021-06-08 |
TWI781465B (zh) | 2022-10-21 |
TW202123351A (zh) | 2021-06-16 |
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