SG10202006006UA - Method, apparatus, and system for determining optimum operation recipe for optical film-thickness measuringdevice - Google Patents
Method, apparatus, and system for determining optimum operation recipe for optical film-thickness measuringdeviceInfo
- Publication number
- SG10202006006UA SG10202006006UA SG10202006006UA SG10202006006UA SG10202006006UA SG 10202006006U A SG10202006006U A SG 10202006006UA SG 10202006006U A SG10202006006U A SG 10202006006UA SG 10202006006U A SG10202006006U A SG 10202006006UA SG 10202006006U A SG10202006006U A SG 10202006006UA
- Authority
- SG
- Singapore
- Prior art keywords
- measuringdevice
- thickness
- optical film
- optimum operation
- determining optimum
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
- B24B49/05—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation including the measurement of a first workpiece already machined and of another workpiece being machined and to be matched with the first one
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/18—Manufacturability analysis or optimisation for manufacturability
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Geometry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Engineering & Computer Science (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Evolutionary Computation (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019119895A JP7253458B2 (ja) | 2019-06-27 | 2019-06-27 | 光学式膜厚測定装置の最適な動作レシピを決定する方法、装置、およびシステム |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202006006UA true SG10202006006UA (en) | 2021-01-28 |
Family
ID=74042708
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202006006UA SG10202006006UA (en) | 2019-06-27 | 2020-06-23 | Method, apparatus, and system for determining optimum operation recipe for optical film-thickness measuringdevice |
Country Status (5)
Country | Link |
---|---|
US (1) | US11648643B2 (zh) |
JP (1) | JP7253458B2 (zh) |
KR (1) | KR20210001972A (zh) |
SG (1) | SG10202006006UA (zh) |
TW (1) | TW202103845A (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022108789A (ja) * | 2021-01-14 | 2022-07-27 | 株式会社荏原製作所 | 研磨装置、研磨方法、および基板の膜厚分布の可視化情報を出力する方法 |
US20220371152A1 (en) * | 2021-05-20 | 2022-11-24 | Applied Materials, Inc. | Fourier filtering of spectral data for measuring layer thickness during substrate processing |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4542324B2 (ja) | 2002-10-17 | 2010-09-15 | 株式会社荏原製作所 | 研磨状態監視装置及びポリッシング装置 |
US7226339B2 (en) * | 2005-08-22 | 2007-06-05 | Applied Materials, Inc. | Spectrum based endpointing for chemical mechanical polishing |
JP2010093147A (ja) | 2008-10-10 | 2010-04-22 | Ebara Corp | 研磨進捗監視方法および研磨装置 |
JP5376293B2 (ja) * | 2008-11-17 | 2013-12-25 | 株式会社ニコン | 終点検出装置および研磨装置 |
JP5728239B2 (ja) | 2010-03-02 | 2015-06-03 | 株式会社荏原製作所 | 研磨監視方法、研磨方法、研磨監視装置、および研磨装置 |
US8666665B2 (en) * | 2010-06-07 | 2014-03-04 | Applied Materials, Inc. | Automatic initiation of reference spectra library generation for optical monitoring |
JP6005467B2 (ja) | 2011-10-26 | 2016-10-12 | 株式会社荏原製作所 | 研磨方法および研磨装置 |
US20130245985A1 (en) * | 2012-03-14 | 2013-09-19 | Kla-Tencor Corporation | Calibration Of An Optical Metrology System For Critical Dimension Application Matching |
JP6595987B2 (ja) | 2014-04-22 | 2019-10-23 | 株式会社荏原製作所 | 研磨方法 |
US10032681B2 (en) | 2016-03-02 | 2018-07-24 | Lam Research Corporation | Etch metric sensitivity for endpoint detection |
JP6971664B2 (ja) | 2017-07-05 | 2021-11-24 | 株式会社荏原製作所 | 基板研磨装置及び方法 |
US10572697B2 (en) * | 2018-04-06 | 2020-02-25 | Lam Research Corporation | Method of etch model calibration using optical scatterometry |
-
2019
- 2019-06-27 JP JP2019119895A patent/JP7253458B2/ja active Active
-
2020
- 2020-06-22 KR KR1020200075604A patent/KR20210001972A/ko unknown
- 2020-06-22 TW TW109121040A patent/TW202103845A/zh unknown
- 2020-06-23 SG SG10202006006UA patent/SG10202006006UA/en unknown
- 2020-06-23 US US16/909,013 patent/US11648643B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2021003789A (ja) | 2021-01-14 |
TW202103845A (zh) | 2021-02-01 |
US11648643B2 (en) | 2023-05-16 |
US20200406422A1 (en) | 2020-12-31 |
JP7253458B2 (ja) | 2023-04-06 |
CN112223104A (zh) | 2021-01-15 |
KR20210001972A (ko) | 2021-01-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3767890A4 (en) | METHOD AND DEVICE FOR SERVICE QUALITY MONITORING | |
EP3792660A4 (en) | METHOD, DEVICE AND SYSTEM FOR MEASURING DISTANCE | |
EP3726766A4 (en) | METHOD, DEVICE AND SYSTEM FOR CONFIGURATION OF A REFERENCE SIGNAL | |
EP3883313A4 (en) | METHOD AND APPARATUS FOR DETERMINING QUASI-COLLOCATION REFERENCE SIGNAL | |
EP3917082A4 (en) | CONFIGURATION RESOURCE DETERMINATION METHOD AND APPARATUS | |
GB2587042B (en) | Method for optical measurement | |
EP3849136A4 (en) | METHOD, DEVICE AND SYSTEM FOR MONITORING THE QUALITY OF SERVICE | |
EP4020315A4 (en) | METHOD, DEVICE AND SYSTEM FOR DETERMINING LABELS | |
EP3911031A4 (en) | REFERENCE SIGNAL MANAGEMENT METHOD, DEVICE AND SYSTEM | |
EP3620007A4 (en) | INTERFERENCE MEASUREMENT METHOD AND APPARATUS USING A BEAM MANAGEMENT REFERENCE SIGNAL | |
EP3618512A4 (en) | METHOD AND DEVICE FOR DETERMINING A PATH LOSS | |
EP4027716A4 (en) | METHODS AND DEVICES FOR DETERMINING THE REFERENCE SIGNAL CONFIGURATION | |
EP3941004A4 (en) | METHOD AND APPARATUS FOR DETERMINING A FORWARDING PATH | |
EP3757780A4 (en) | SERVICE MANAGEMENT PROCESS AND APPARATUS | |
EP3908820A4 (en) | APPARATUS, SYSTEM AND METHOD FOR DETERMINING ONE OR MORE PARAMETERS OF A LENS | |
IL281300A (en) | Optical system, metrological device and method related thereto | |
EP3955535A4 (en) | REFERENCE SIGNAL GENERATION METHOD AND DEVICE, REFERENCE SIGNAL DETECTION METHOD AND COMMUNICATION DEVICE | |
EP4044688A4 (en) | METHOD, SYSTEM AND APPARATUS FOR DETERMINING A STRATEGY | |
EP3961999A4 (en) | METHOD FOR DETERMINING A SERVICE, DEVICE, AND SYSTEM TRANSMISSION REQUIREMENT | |
EP3826355A4 (en) | MEASUREMENT DISPLAY METHOD, DEVICE AND SYSTEM | |
EP3987651A4 (en) | HYBRID POWER DEVICE, SYSTEM AND METHOD THEREOF | |
SG10202006006UA (en) | Method, apparatus, and system for determining optimum operation recipe for optical film-thickness measuringdevice | |
EP3962157A4 (en) | METHOD, DEVICE AND SYSTEM FOR MDBV DETERMINATION | |
EP4029198A4 (en) | METHOD AND DEVICE FOR SERVICE ADMINISTRATION | |
EP3893571A4 (en) | METHOD AND DEVICE FOR DETERMINING A COMMUNICATION RESOURCE |