SG10202006006UA - Method, apparatus, and system for determining optimum operation recipe for optical film-thickness measuringdevice - Google Patents
Method, apparatus, and system for determining optimum operation recipe for optical film-thickness measuringdeviceInfo
- Publication number
- SG10202006006UA SG10202006006UA SG10202006006UA SG10202006006UA SG10202006006UA SG 10202006006U A SG10202006006U A SG 10202006006UA SG 10202006006U A SG10202006006U A SG 10202006006UA SG 10202006006U A SG10202006006U A SG 10202006006UA SG 10202006006U A SG10202006006U A SG 10202006006UA
- Authority
- SG
- Singapore
- Prior art keywords
- measuringdevice
- thickness
- optical film
- optimum operation
- determining optimum
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
- B24B49/05—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation including the measurement of a first workpiece already machined and of another workpiece being machined and to be matched with the first one
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/18—Manufacturability analysis or optimisation for manufacturability
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Geometry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Engineering & Computer Science (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Evolutionary Computation (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019119895A JP7253458B2 (en) | 2019-06-27 | 2019-06-27 | Method, Apparatus, and System for Determining Optimal Operating Recipe for Optical Film Thickness Gauge |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202006006UA true SG10202006006UA (en) | 2021-01-28 |
Family
ID=74042708
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202006006UA SG10202006006UA (en) | 2019-06-27 | 2020-06-23 | Method, apparatus, and system for determining optimum operation recipe for optical film-thickness measuringdevice |
Country Status (5)
Country | Link |
---|---|
US (1) | US11648643B2 (en) |
JP (1) | JP7253458B2 (en) |
KR (1) | KR20210001972A (en) |
SG (1) | SG10202006006UA (en) |
TW (1) | TW202103845A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022108789A (en) * | 2021-01-14 | 2022-07-27 | 株式会社荏原製作所 | Polishing device, polishing method, and method for outputting visualized information on film thickness distribution of base plate |
US20220371152A1 (en) * | 2021-05-20 | 2022-11-24 | Applied Materials, Inc. | Fourier filtering of spectral data for measuring layer thickness during substrate processing |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4542324B2 (en) | 2002-10-17 | 2010-09-15 | 株式会社荏原製作所 | Polishing state monitoring device and polishing device |
US7226339B2 (en) * | 2005-08-22 | 2007-06-05 | Applied Materials, Inc. | Spectrum based endpointing for chemical mechanical polishing |
JP2010093147A (en) | 2008-10-10 | 2010-04-22 | Ebara Corp | Polishing progress monitoring method, and polishing device |
JP5376293B2 (en) * | 2008-11-17 | 2013-12-25 | 株式会社ニコン | End point detection device and polishing device |
JP5728239B2 (en) | 2010-03-02 | 2015-06-03 | 株式会社荏原製作所 | Polishing monitoring method, polishing method, polishing monitoring apparatus, and polishing apparatus |
US8666665B2 (en) * | 2010-06-07 | 2014-03-04 | Applied Materials, Inc. | Automatic initiation of reference spectra library generation for optical monitoring |
JP6005467B2 (en) | 2011-10-26 | 2016-10-12 | 株式会社荏原製作所 | Polishing method and polishing apparatus |
US20130245985A1 (en) * | 2012-03-14 | 2013-09-19 | Kla-Tencor Corporation | Calibration Of An Optical Metrology System For Critical Dimension Application Matching |
WO2015163164A1 (en) | 2014-04-22 | 2015-10-29 | 株式会社 荏原製作所 | Polishing method and polishing apparatus |
US10032681B2 (en) | 2016-03-02 | 2018-07-24 | Lam Research Corporation | Etch metric sensitivity for endpoint detection |
JP6971664B2 (en) | 2017-07-05 | 2021-11-24 | 株式会社荏原製作所 | Substrate polishing equipment and method |
US10572697B2 (en) * | 2018-04-06 | 2020-02-25 | Lam Research Corporation | Method of etch model calibration using optical scatterometry |
-
2019
- 2019-06-27 JP JP2019119895A patent/JP7253458B2/en active Active
-
2020
- 2020-06-22 TW TW109121040A patent/TW202103845A/en unknown
- 2020-06-22 KR KR1020200075604A patent/KR20210001972A/en unknown
- 2020-06-23 US US16/909,013 patent/US11648643B2/en active Active
- 2020-06-23 SG SG10202006006UA patent/SG10202006006UA/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP7253458B2 (en) | 2023-04-06 |
US20200406422A1 (en) | 2020-12-31 |
TW202103845A (en) | 2021-02-01 |
KR20210001972A (en) | 2021-01-06 |
JP2021003789A (en) | 2021-01-14 |
US11648643B2 (en) | 2023-05-16 |
CN112223104A (en) | 2021-01-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3767890A4 (en) | Method and apparatus for monitoring service quality | |
EP3792660A4 (en) | Method, apparatus and system for measuring distance | |
EP3726766A4 (en) | Method, apparatus and system for configuring reference signal | |
EP3883313A4 (en) | Method and apparatus for determining quasi-co-location reference signal | |
EP3917082A4 (en) | Method and apparatus for determining configuration resource | |
GB2587042B (en) | Method for optical measurement | |
EP3849136A4 (en) | Service quality monitoring method, apparatus, and system | |
EP4020315A4 (en) | Method, apparatus and system for determining label | |
EP3911031A4 (en) | Reference signal management method, apparatus and system | |
EP3620007A4 (en) | Method and apparatus for interference measurement using beam management reference signal | |
EP3618512A4 (en) | Method and apparatus for determining path loss | |
EP4027716A4 (en) | Determination method and apparatus for reference signal configuration | |
EP3941004A4 (en) | Method and apparatus for determining forwarding path | |
EP3757780A4 (en) | Method and apparatus for service management | |
EP3908820A4 (en) | Apparatus, system, and method of determining one or more parameters of a lens | |
IL281300A (en) | Optical system, metrology apparatus and associated method | |
EP3955535A4 (en) | Method for generating reference signal, method for detecting reference signal, and communication apparatus | |
EP4044688A4 (en) | Method, system and apparatus for determining strategy | |
EP3961999A4 (en) | Method for determining service transmission requirement, apparatus, and system | |
EP3826355A4 (en) | Measurement indication method, apparatus and system | |
EP3987651A4 (en) | Hybrid-energy apparatus, system, and method therefor | |
SG10202006006UA (en) | Method, apparatus, and system for determining optimum operation recipe for optical film-thickness measuringdevice | |
EP3962157A4 (en) | Mdbv determining method, apparatus, and system | |
EP4029198A4 (en) | Method and apparatus for service management | |
EP3893571A4 (en) | Method and apparatus for determining communication resource |