SG10202004874RA - Annular grindstone - Google Patents
Annular grindstoneInfo
- Publication number
- SG10202004874RA SG10202004874RA SG10202004874RA SG10202004874RA SG10202004874RA SG 10202004874R A SG10202004874R A SG 10202004874RA SG 10202004874R A SG10202004874R A SG 10202004874RA SG 10202004874R A SG10202004874R A SG 10202004874RA SG 10202004874R A SG10202004874R A SG 10202004874RA
- Authority
- SG
- Singapore
- Prior art keywords
- annular grindstone
- grindstone
- annular
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/16—Bushings; Mountings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019108506A JP7408232B2 (en) | 2019-06-11 | 2019-06-11 | Manufacturing method of circular grindstone |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202004874RA true SG10202004874RA (en) | 2021-01-28 |
Family
ID=73546995
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202004874RA SG10202004874RA (en) | 2019-06-11 | 2020-05-26 | Annular grindstone |
Country Status (7)
Country | Link |
---|---|
US (1) | US20200391351A1 (en) |
JP (1) | JP7408232B2 (en) |
KR (1) | KR20200141930A (en) |
CN (1) | CN112059933A (en) |
DE (1) | DE102020207131A1 (en) |
SG (1) | SG10202004874RA (en) |
TW (1) | TWI837380B (en) |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6021942B2 (en) * | 1978-06-27 | 1985-05-30 | 三井金属鉱業株式会社 | Metal-bonded diamond sintered body and its manufacturing method |
CN101066586A (en) * | 2007-06-05 | 2007-11-07 | 佛山市地天泰新材料技术有限公司 | Polishing diamond block with metal binder and its making process |
US20090017736A1 (en) * | 2007-07-10 | 2009-01-15 | Saint-Gobain Abrasives, Inc. | Single-use edging wheel for finishing glass |
WO2009027949A1 (en) * | 2007-08-31 | 2009-03-05 | Element Six (Production) (Pty) Ltd | Polycrystalline diamond composites |
KR101739943B1 (en) * | 2010-07-07 | 2017-05-25 | 삼성전자주식회사 | Wafer dicing blade and wafer dicing apparatus comprising the same |
JP2012086291A (en) * | 2010-10-18 | 2012-05-10 | Disco Corp | Cutting grinding wheel |
CN102285005A (en) * | 2011-09-14 | 2011-12-21 | 山东日能超硬材料有限公司 | Composite sharp tool bit |
JP5853946B2 (en) * | 2012-01-06 | 2016-02-09 | 信越化学工業株式会社 | Manufacturing method of outer peripheral cutting blade |
JP2014013812A (en) | 2012-07-04 | 2014-01-23 | Disco Abrasive Syst Ltd | SiC SUBSTRATE PROCESSING METHOD |
JP6151557B2 (en) | 2013-05-13 | 2017-06-21 | 株式会社ディスコ | Laser processing method |
JP5880652B2 (en) * | 2014-09-29 | 2016-03-09 | 信越化学工業株式会社 | Cemented carbide base plate outer peripheral cutting blade and manufacturing method thereof |
JP2016168655A (en) * | 2015-03-13 | 2016-09-23 | 株式会社ディスコ | Manufacturing method of electrodeposition grindstone |
JP2017087353A (en) * | 2015-11-10 | 2017-05-25 | 株式会社ディスコ | Method for production of electro-deposited grind stone |
JP2017164881A (en) * | 2016-03-18 | 2017-09-21 | 株式会社ディスコ | Cutting blade |
-
2019
- 2019-06-11 JP JP2019108506A patent/JP7408232B2/en active Active
-
2020
- 2020-05-26 KR KR1020200062891A patent/KR20200141930A/en unknown
- 2020-05-26 SG SG10202004874RA patent/SG10202004874RA/en unknown
- 2020-05-28 CN CN202010465911.7A patent/CN112059933A/en active Pending
- 2020-06-03 US US16/891,184 patent/US20200391351A1/en not_active Abandoned
- 2020-06-08 DE DE102020207131.4A patent/DE102020207131A1/en active Pending
- 2020-06-10 TW TW109119421A patent/TWI837380B/en active
Also Published As
Publication number | Publication date |
---|---|
KR20200141930A (en) | 2020-12-21 |
JP7408232B2 (en) | 2024-01-05 |
TW202112497A (en) | 2021-04-01 |
DE102020207131A1 (en) | 2020-12-17 |
US20200391351A1 (en) | 2020-12-17 |
CN112059933A (en) | 2020-12-11 |
TWI837380B (en) | 2024-04-01 |
JP2020199595A (en) | 2020-12-17 |
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