CN101066586A - Polishing diamond block with metal binder and its making process - Google Patents
Polishing diamond block with metal binder and its making process Download PDFInfo
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- CN101066586A CN101066586A CN 200710028432 CN200710028432A CN101066586A CN 101066586 A CN101066586 A CN 101066586A CN 200710028432 CN200710028432 CN 200710028432 CN 200710028432 A CN200710028432 A CN 200710028432A CN 101066586 A CN101066586 A CN 101066586A
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Abstract
The polishing diamond block with metal binder includes one grinding layer, one transition layer and one assembling layer, and features the grinding layer including metal binder and diamond crystal once formed integrally and with slots and holes, and the assembling layer in a tail structure. The present invention has no environmental pollution, low power consumption, high efficiency, long service life and stable product quality, and is suitable for grinding and polishing ceramic tile, stone and glass product.
Description
Technical field:
The present invention relates to a kind of pottery, stone material or glass processing technical field, especially relate to the poliss of the metal-bonded diamond that is used for pottery, stone material or glass processing.
Background technology:
At present for technologies such as the polishing of ceramic tile, stone material, glassware (containing devitrified glass), polishings, a large amount of common magnesia polisses of making abrasive material with carborundum that use, the major defect of such poliss is: consume big, discarded object is many, environmental pollution is big; Efficient is low, the product cost height of production; Cutting force is weak, energy consumption is high; Service life is short, replacing is frequent, labor intensity is big.
In order to overcome the deficiency of common magnesia poliss, people attempt adopting the metallic bond poliss.The preparation of polishing diamond block has dual mode in the prior art: (1) poliss is made up of grinding layer and supporter two parts, prepare the metal-bonded diamond cutter head earlier, several metal-bonded diamond cutter heads evenly are embedded in the resinoid bond Buddha's warrior attendant stone mill layer then, resinoid bond links up grinding layer and supporter becomes poliss, as patent CN2542402Y; (2) poliss is made up of base, connection steel plate, resin extender, metallic bond cutter head; Connect steel plate and be bound up between base and the cutter head, resin extender plates around cutter head; The metallic bond cutter head is welded on and connects on the steel plate, as patent CN2853285Y.The mode of above-mentioned existing preparation polishing diamond block is complicated, and production efficiency is low; Resin is used in the production of poliss, needs regelate, and the production cycle is long.And also easily with product to be processed mill flower, undercut, product breakages such as pottery are many for polishing diamond block with metal binder of the prior art, and it is also relatively more serious that poliss falls the cutter head phenomenon.
The Chinese patent notification number is that the patent of CN 1123819 has also provided a kind of metal-bonded diamond grinding block, and this grinding-material is to be abrasive particle with the diamond particles, constitutes bond by the powder of multiple metal or metallic compound, forms through high temperature sintering.Can be used to process various hard materials,, and can improve its machining accuracy as marble, granite, terrazzo etc.Embodiment points out that it is of a size of 24 * 10 * 10mm, clearly is the cutter head of mentioning among patent CN2542402Y, the patent CN2853285Y.Chinese patent application ZL03105384X discloses a kind of diamond grinding block sintering method, and it is diamond strip that processing cutting diamond blank is arranged; Batch mixing is with batch mixer or artificial batch mixing; Above-mentioned compound is added in the mould, together add diamond strip, vertically evenly being planted in of diamond strip filled above-mentioned compound, compacting on every side in the mould; Mould is put into sintering machine, and pressurization is heated, and the step of sintered body is taken out in die sinking.Diamond sintering grinding block is made up of sintered body and diamond, and described diamond is a strip structure, is distributed in the described sintered body.Belong to diamond segment equally.
Summary of the invention:
Main purpose of the present invention be to overcome the defective that prior art exists and a kind of environmentally safe is provided, energy consumption is low, efficient is high, the polishing diamond block with metal binder that is applicable to technologies such as the polishing of ceramic tile, stone material, glassware, polishing of long service life, constant product quality.
Another object of the present invention also is to provide a kind of method that production cost is low, efficient is high for preparing above-mentioned poliss.
For achieving the above object, polishing diamond block with metal binder of the present invention comprises grinding layer, the layer that is installed, the integral body that described grinding layer is made up of by one-shot forming metallic bond and diamond crystal.
As further specifying of such scheme, described metallic bond can be any metal or alloy that is fit to plate diamond crystal; Its grinding layer can be to be consolidated with the diamond segment that sinters by the lower metallic bond of fusing point to constitute; Include groove or circular hole on its grinding layer.This poliss also includes transition zone, transition zone at grinding layer, be installed between the layer, the layer that is installed is for the dovetail shaped structure; The layer that is installed is the dovetail shaped structure;
The present invention also provides the preparation method of this novel metal binding agent diamond poliss, its be with metallic bond with the diamond abrasive grain combination, comprising:
(a) take by weighing each component of aequum by the bond chemical composition, obtain the bond mixture of powders, this bond mixture of powders is mixed with diamond abrasive grain;
(b) according to the dimensional requirement designing mould of poliss
(C) use mould, materials such as grinding layer, the layer that is installed added mould respectively, under 200～800 ℃ to the mixture sintering of described metal dust and diamond abrasive grain.
In above-mentioned preparation method, the granularity of diamond abrasive grain, model, concentration are selected according to the material and the processing request of processing object.
As further specifying of said method, direct heat was molded after described grinding layer, transition zone, the layer that is installed were powder and add mould respectively.
Described grinding layer, transition zone, the layer that is installed are powder and add directly cold moudling behind the mould respectively, and be integral sintered after the demoulding.
Described grinding layer, transition zone are powder, with process be installed the layer add mould respectively after direct heat molded; Or directly cold moudling behind the adding mould, integral sintered after the demoulding.
Direct heat was molded after described grinding layer powder and the layer that is installed that processes added mould respectively; Or directly cold moudling behind the adding mould, integral sintered after the demoulding.
The present invention prepares polishing diamond block with metal binder by one-time formed mode, owing to adopt metallic bond, and the milled portion of poliss, be installed and transition zone partly is an integral body that forms by sintering, make the present invention have following beneficial effect: the poliss that (1) adopts the metallic bond sintering to form, grinding face hardness unanimity has solved multitool head poliss and has contacted problems such as the mill flower that produces, breakage with ceramic rigidity; (2) because the integral body that grinding layer itself is diamantiferous powder to be formed by sintering, not resinous composition, in preparation and the use to environment and operating personnel without any harm, be environmentally friendly machine; (3) grinding layer of poliss, be installed layer and transition zone are the combinations that forms by sintering, can not occur the diamond segment for preparing inlayed or be welded to that the preparation polishing diamond block produces on the matrix the cutter head problem, so working stability, product quality easily guarantees; (4) compare with a plurality of diamond segments being inlayed or be welded on the matrix preparation polishing diamond block technology, preparation process is easy, the production efficiency height; (5) poliss service life is more than 100 times of the common magnesia poliss of equal specification, has significantly reduced the replacing number of times of poliss, has reduced the work load that poliss is changed the workman to a great extent, makes and produces hommization more.
Description of drawings
The structural representation of Fig. 1 polishing diamond block with metal binder of the present invention;
Description of reference numerals:
1 grinding layer, 2 transition zones 3 layer that is installed
The specific embodiment
Polishing diamond block with metal binder of the present invention, by grinding layer, be installed the layer and transition zone three parts constitute the integral body that described grinding layer is made up of by one-shot forming metallic bond and diamond crystal; The layer that is installed is the dovetail shaped structure; Metallic bond can be any metal or alloy that is fit to plate diamond crystal; Its grinding layer can be to be consolidated with the diamond segment that sinters by the lower metallic bond of fusing point to constitute; Include groove or circular hole on its grinding layer, the pottery that its main purpose is ground when being grinding, stone material or glass chip can fall in groove or the circular hole.
Embodiment 1:
Bond is formed: Al:37% Cu:21% Ag:13%
Ti：10％ Zn：10％ Mg：4％
All the other materials 5%
Excessively layer is formed: Al:80% Cu:20%
Part is installed: Al:80% Cu:20%
Diamond: granularity 140/170, concentration 60%
Its preparation method is: according to above-mentioned bond composition and the diamond polishing block specifications corresponding powder of weighing respectively, add the diamond that requires concentration amounts, add an amount of paraffin after, on batch mixer, fully mixed 24 hours, standby; The powder of the transition zone and the part that is installed is mixed in proportion, standby.
The powder that 1000g the is mixed mould bottom of packing into is paved; Add 200g transition zone powder, pave; Add the 300g part powder that is installed, pave; Put into the sintering furnace hot pressed sintering of atmosphere protection, sintering temperature is 550 ℃, is incubated 30 minutes, and pressure is 12MPa.
After sintering was finished, the demoulding promptly obtained the aluminium base polishing diamond block that size is about 157 * 60 * 40mm.
Embodiment 2:
Bond is formed: Al:30% Mg:37% Ti:10%
Zn：10％ Cu：10％
All the other materials 3%
Excessively layer is formed: Al:80% Mg:20%
Part is installed: Al:80% Cu:20%
Diamond: granularity 140/170, concentration 60%
According to above-mentioned bond composition and the diamond polishing block specifications corresponding powder of weighing respectively, add the diamond that requires concentration amounts, add an amount of paraffin after, on batch mixer, fully mixed 24 hours, standby; The powder of the transition zone and the part that is installed is mixed in proportion, standby.
The powder that 600g the is mixed mould bottom of packing into is paved; Add 155g transition zone powder, pave; Add the 300g part powder that is installed, pave; Put into cold press at the 150MPa forming under the pressure, the demoulding, pressureless sintering in sintering furnace, sintering temperature is 650 ℃, is incubated 60 minutes, after sintering is finished, promptly obtains aluminium base polishing diamond block.
Embodiment 3:
Bond is formed: Al:50% Si:17% Ti:10%
Sn：10％ Cu：10％
All the other materials 3%
Excessively layer is formed: Al:80% Mg:20%
Part is installed: the LY12 alloy
Diamond: granularity 100/120, concentration 35%
According to above-mentioned bond composition and the diamond polishing block specifications corresponding powder of weighing respectively, add the diamond that requires concentration amounts, add an amount of paraffin after, on batch mixer, fully mixed 24 hours, standby; The transition zone powder is mixed in proportion, standby.
The powder that 600g is mixed is packed into and is paved with the mould bottom of protruding rib; Add 155g transition zone powder, pave; The LY12 alloy that the processes shape part that is installed; Put into press hot pressed sintering under 15MPa pressure, sintering temperature is 650 ℃, is incubated 60 minutes, after sintering is finished, promptly obtains the aluminium base polishing diamond block of with groove.
Embodiment 4:
Bond is formed: Cu:45% Ni:25%
Sn：25％ Ag：2％
All the other materials 3%
Excessively layer is formed: brass
Part is installed: brass
Diamond: granularity 120/140, concentration 55%
According to above-mentioned bond composition and the diamond polishing block specifications corresponding powder of weighing respectively, add the diamond that requires concentration amounts, add an amount of paraffin after, on batch mixer, fully mixed 24 hours, standby;
The powder that 1500g the is mixed mould bottom of packing into is paved; The brass alloys that the process shape part that is installed; Put into press hot pressed sintering under 15MPa pressure, sintering temperature is 750 ℃, is incubated 80 minutes, after sintering is finished, promptly obtains not having the copper base diamond poliss of transition zone.
Certainly; above-mentioned example only is enforcement of the present invention, and the present invention is not limited to above-mentioned several specific embodiment, and those skilled in the art also can do numerous modifications and variations on the basis of existing technology; do not breaking away under the spirit of the present invention, all in the claimed scope of the present invention.
Claims (10)
1, a kind of polishing diamond block with metal binder comprises grinding layer, the layer that is installed, and it is characterized in that: the integral body that described grinding layer is made up of by one-shot forming metallic bond and diamond crystal.
According to the described polishing diamond block with metal binder of claim 1, it is characterized in that 2, this poliss also includes transition zone, transition zone at grinding layer, be installed between the layer, the layer that is installed is for the dovetail shaped structure.
According to the described polishing diamond block with metal binder of claim 1, it is characterized in that 3, its grinding layer is to be consolidated with the diamond segment that sinters by the lower metallic bond of fusing point to constitute.
4, according to the described polishing diamond block with metal binder of claim 1, it is characterized in that, include groove or circular hole on its grinding layer.
5, polishing diamond block with metal binder according to claim 1 is characterized in that described metallic bond is the metal or alloy that is fit to plate diamond crystal.
6, a kind of preparation method who makes each described polishing diamond block with metal binder of claim 1-5 comprises following processing step:
(a) take by weighing each component powders of aequum by described metallic bond chemical composition, obtain the bond mixture of powders, this bond mixture of powders is mixed with diamond abrasive grain;
(b) according to the dimensional requirement designing mould of poliss;
(C) use mould, materials such as grinding layer, the layer that is installed added mould respectively, under 200～800 ℃ to the mixture sintering of described metal dust and diamond abrasive grain.
As preparation method as described in the claim 6, it is characterized in that 7, direct heat was molded after described grinding layer and be installed transition zone is arranged between the layer, grinding layer, transition zone, the layer that is installed were powder and add mould respectively.
8, as preparation method as described in the claim 6, it is characterized in that, described grinding layer and be installed and be connected with transition zone between the layer, grinding layer, transition zone, the layer that is installed are powder, and they add directly cold moudling behind the mould respectively, and are integral sintered after the demoulding.
9, as preparation method as described in the claim 6, it is characterized in that described grinding layer is connected with transition zone, grinding layer, transition zone are powder, and direct heat was molded after grinding layer, transition zone and the layer that is installed that processes added mould respectively; Or directly cold moudling behind the adding mould, integral sintered after the demoulding.
As preparation method as described in the claim 6, it is characterized in that 10, direct heat was molded after described grinding layer powder and the layer that is installed that processes added mould respectively; Or directly cold moudling behind the adding mould, integral sintered after the demoulding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710028432 CN101066586A (en) | 2007-06-05 | 2007-06-05 | Polishing diamond block with metal binder and its making process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710028432 CN101066586A (en) | 2007-06-05 | 2007-06-05 | Polishing diamond block with metal binder and its making process |
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| CN101066586A true CN101066586A (en) | 2007-11-07 |
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| CN 200710028432 Pending CN101066586A (en) | 2007-06-05 | 2007-06-05 | Polishing diamond block with metal binder and its making process |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102259310A (en) * | 2011-08-17 | 2011-11-30 | 桂林矿产地质研究院 | Ultrahard coated adhesive tool as well as manufacturing method and special napping equipment |
| CN106956223A (en) * | 2016-01-12 | 2017-07-18 | 蓝思科技（长沙）有限公司 | A kind of metallic bond and its diamond abrasive tool and diamond abrasive tool preparation method |
| CN107009289A (en) * | 2017-05-10 | 2017-08-04 | 上海科弗新材料科技有限公司 | Frotton and preparation method thereof |
| CN112059933A (en) * | 2019-06-11 | 2020-12-11 | 株式会社迪思科 | Ring-shaped grinding tool |
| CN113103159A (en) * | 2021-03-31 | 2021-07-13 | 珠海市世创金刚石工具制造有限公司 | Grinding wheel for machining hard materials and preparation method thereof |
-
2007
- 2007-06-05 CN CN 200710028432 patent/CN101066586A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102259310A (en) * | 2011-08-17 | 2011-11-30 | 桂林矿产地质研究院 | Ultrahard coated adhesive tool as well as manufacturing method and special napping equipment |
| CN106956223A (en) * | 2016-01-12 | 2017-07-18 | 蓝思科技（长沙）有限公司 | A kind of metallic bond and its diamond abrasive tool and diamond abrasive tool preparation method |
| CN106956223B (en) * | 2016-01-12 | 2019-03-26 | 蓝思科技（长沙）有限公司 | A kind of metallic bond and its diamond abrasive tool and diamond abrasive tool preparation method |
| CN107009289A (en) * | 2017-05-10 | 2017-08-04 | 上海科弗新材料科技有限公司 | Frotton and preparation method thereof |
| CN112059933A (en) * | 2019-06-11 | 2020-12-11 | 株式会社迪思科 | Ring-shaped grinding tool |
| CN113103159A (en) * | 2021-03-31 | 2021-07-13 | 珠海市世创金刚石工具制造有限公司 | Grinding wheel for machining hard materials and preparation method thereof |
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Application publication date: 20071107 |