SG10201910941UA - Temperature adjusting device and polishing device - Google Patents
Temperature adjusting device and polishing deviceInfo
- Publication number
- SG10201910941UA SG10201910941UA SG10201910941UA SG10201910941UA SG10201910941UA SG 10201910941U A SG10201910941U A SG 10201910941UA SG 10201910941U A SG10201910941U A SG 10201910941UA SG 10201910941U A SG10201910941U A SG 10201910941UA SG 10201910941U A SG10201910941U A SG 10201910941UA
- Authority
- SG
- Singapore
- Prior art keywords
- temperature adjusting
- polishing
- adjusting device
- polishing device
- temperature
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/015—Temperature control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018222266A JP7066599B2 (en) | 2018-11-28 | 2018-11-28 | Temperature control device and polishing device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201910941UA true SG10201910941UA (en) | 2020-06-29 |
Family
ID=70770285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201910941UA SG10201910941UA (en) | 2018-11-28 | 2019-11-21 | Temperature adjusting device and polishing device |
Country Status (6)
Country | Link |
---|---|
US (1) | US11577357B2 (en) |
JP (1) | JP7066599B2 (en) |
KR (1) | KR102512402B1 (en) |
CN (1) | CN111230726B (en) |
SG (1) | SG10201910941UA (en) |
TW (1) | TWI800697B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112405333B (en) * | 2020-12-04 | 2022-08-16 | 华海清科(北京)科技有限公司 | Chemical mechanical polishing device and polishing method |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS492433B1 (en) | 1968-02-12 | 1974-01-21 | ||
JP4902433B2 (en) * | 2007-06-13 | 2012-03-21 | 株式会社荏原製作所 | Polishing surface heating and cooling device for polishing equipment |
JP5547472B2 (en) * | 2009-12-28 | 2014-07-16 | 株式会社荏原製作所 | Substrate polishing apparatus, substrate polishing method, and polishing pad surface temperature control apparatus for substrate polishing apparatus |
JP5628067B2 (en) | 2011-02-25 | 2014-11-19 | 株式会社荏原製作所 | Polishing apparatus provided with temperature adjustment mechanism of polishing pad |
CN202462201U (en) * | 2012-03-05 | 2012-10-03 | 中芯国际集成电路制造(上海)有限公司 | Grinding temperature control system and grinding device |
JP6161999B2 (en) * | 2013-08-27 | 2017-07-12 | 株式会社荏原製作所 | Polishing method and polishing apparatus |
JP6340205B2 (en) * | 2014-02-20 | 2018-06-06 | 株式会社荏原製作所 | Polishing pad conditioning method and apparatus |
JP6263092B2 (en) | 2014-06-23 | 2018-01-17 | 株式会社荏原製作所 | Temperature control system for polishing pad and substrate processing apparatus provided with the same |
JP6580939B2 (en) * | 2015-10-20 | 2019-09-25 | 株式会社荏原製作所 | Polishing equipment |
JP6929072B2 (en) | 2016-02-22 | 2021-09-01 | 株式会社荏原製作所 | Equipment and methods for adjusting the surface temperature of the polishing pad |
US10414018B2 (en) * | 2016-02-22 | 2019-09-17 | Ebara Corporation | Apparatus and method for regulating surface temperature of polishing pad |
JP6925715B2 (en) * | 2017-05-16 | 2021-08-25 | 株式会社ディスコ | Processing equipment |
KR101966952B1 (en) * | 2017-07-06 | 2019-04-18 | 주식회사 케이씨텍 | Slurry supply unit and apparatus for polishing substrate having the slurry supply device |
CN207915274U (en) * | 2018-03-16 | 2018-09-28 | 湘潭大学 | a kind of polishing liquid supply system |
JP7162465B2 (en) * | 2018-08-06 | 2022-10-28 | 株式会社荏原製作所 | Polishing device and polishing method |
-
2018
- 2018-11-28 JP JP2018222266A patent/JP7066599B2/en active Active
-
2019
- 2019-11-21 SG SG10201910941UA patent/SG10201910941UA/en unknown
- 2019-11-22 US US16/692,710 patent/US11577357B2/en active Active
- 2019-11-25 KR KR1020190152019A patent/KR102512402B1/en active IP Right Grant
- 2019-11-27 TW TW108143111A patent/TWI800697B/en active
- 2019-11-28 CN CN201911191166.5A patent/CN111230726B/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR102512402B1 (en) | 2023-03-22 |
CN111230726A (en) | 2020-06-05 |
JP2020082295A (en) | 2020-06-04 |
CN111230726B (en) | 2023-06-23 |
TW202037452A (en) | 2020-10-16 |
KR20200063993A (en) | 2020-06-05 |
US11577357B2 (en) | 2023-02-14 |
JP7066599B2 (en) | 2022-05-13 |
TWI800697B (en) | 2023-05-01 |
US20200164480A1 (en) | 2020-05-28 |
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