SG10201910815QA - High durability solder terminals - Google Patents

High durability solder terminals

Info

Publication number
SG10201910815QA
SG10201910815QA SG10201910815QA SG10201910815QA SG10201910815QA SG 10201910815Q A SG10201910815Q A SG 10201910815QA SG 10201910815Q A SG10201910815Q A SG 10201910815QA SG 10201910815Q A SG10201910815Q A SG 10201910815QA SG 10201910815Q A SG10201910815Q A SG 10201910815QA
Authority
SG
Singapore
Prior art keywords
high durability
solder terminals
solder
terminals
durability
Prior art date
Application number
SG10201910815QA
Other languages
English (en)
Inventor
Yuji Yashiro
Toru Yamaji
Original Assignee
Skyworks Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Skyworks Solutions Inc filed Critical Skyworks Solutions Inc
Publication of SG10201910815QA publication Critical patent/SG10201910815QA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0504—Holders; Supports for bulk acoustic wave devices
    • H03H9/0514—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
    • H03H9/547—Notch filters, e.g. notch BAW or thin film resonator filters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
SG10201910815QA 2018-11-19 2019-11-18 High durability solder terminals SG10201910815QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201862769143P 2018-11-19 2018-11-19

Publications (1)

Publication Number Publication Date
SG10201910815QA true SG10201910815QA (en) 2020-06-29

Family

ID=69063226

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201910815QA SG10201910815QA (en) 2018-11-19 2019-11-18 High durability solder terminals

Country Status (8)

Country Link
US (2) US11470719B2 (de)
JP (1) JP2020088862A (de)
CN (1) CN111200905A (de)
CA (1) CA3061862A1 (de)
DE (1) DE102019217679B4 (de)
GB (1) GB2583552B (de)
SG (1) SG10201910815QA (de)
TW (1) TW202040780A (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220358280A1 (en) * 2021-05-04 2022-11-10 Adobe Inc. Context-aware font recommendation from text

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61177762A (ja) 1985-02-01 1986-08-09 Toshiba Corp 半導体装置
US5477086A (en) 1993-04-30 1995-12-19 Lsi Logic Corporation Shaped, self-aligning micro-bump structures
JP3982876B2 (ja) * 1997-06-30 2007-09-26 沖電気工業株式会社 弾性表面波装置
US7167688B2 (en) 2003-07-30 2007-01-23 Chi Mei Communication Systems, Inc. RF transceiver module formed in multi-layered ceramic
TWI232561B (en) * 2003-10-17 2005-05-11 Advanced Semiconductor Eng Substrate having bond pads for bonding redundant solder beads
JP2006210851A (ja) * 2005-01-31 2006-08-10 Toshiba Corp 回路基板
US7696594B2 (en) * 2005-12-22 2010-04-13 International Business Machines Corporation Attachment of a QFN to a PCB
US7841508B2 (en) * 2007-03-05 2010-11-30 International Business Machines Corporation Elliptic C4 with optimal orientation for enhanced reliability in electronic packages
WO2010052821A1 (ja) * 2008-11-04 2010-05-14 株式会社 村田製作所 弾性波フィルタ装置
US8558396B2 (en) * 2011-07-12 2013-10-15 Intersil Americas Inc. Bond pad configurations for semiconductor dies
US9425139B2 (en) * 2012-09-12 2016-08-23 Marvell World Trade Ltd. Dual row quad flat no-lead semiconductor package
US9548280B2 (en) * 2014-04-02 2017-01-17 Nxp Usa, Inc. Solder pad for semiconductor device package
AT516750B1 (de) * 2014-12-18 2016-08-15 Zizala Lichtsysteme Gmbh Verfahren zur Voidreduktion in Lötstellen
US9660609B2 (en) 2015-07-07 2017-05-23 Skyworks Solutions, Inc. Devices and methods related to stacked duplexers
US10192840B2 (en) * 2015-09-25 2019-01-29 Intel Corporation Ball pad with a plurality of lobes
WO2017110223A1 (ja) * 2015-12-24 2017-06-29 株式会社村田製作所 フィルタ装置

Also Published As

Publication number Publication date
GB2583552A (en) 2020-11-04
DE102019217679A1 (de) 2020-05-20
GB2583552B (en) 2022-12-21
JP2020088862A (ja) 2020-06-04
DE102019217679B4 (de) 2023-11-02
US20220304151A1 (en) 2022-09-22
US20200163212A1 (en) 2020-05-21
TW202040780A (zh) 2020-11-01
GB201916766D0 (en) 2020-01-01
CA3061862A1 (en) 2020-05-19
CN111200905A (zh) 2020-05-26
US11470719B2 (en) 2022-10-11

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