SG10201903646WA - Method for microwave processing of photosensitive polyimides - Google Patents

Method for microwave processing of photosensitive polyimides

Info

Publication number
SG10201903646WA
SG10201903646WA SG10201903646WA SG10201903646WA SG10201903646WA SG 10201903646W A SG10201903646W A SG 10201903646WA SG 10201903646W A SG10201903646W A SG 10201903646WA SG 10201903646W A SG10201903646W A SG 10201903646WA SG 10201903646W A SG10201903646W A SG 10201903646WA
Authority
SG
Singapore
Prior art keywords
pspi
film
curing
oxygen
microwave
Prior art date
Application number
SG10201903646WA
Other languages
English (en)
Inventor
Robert L Hubbard
Iftikhar Ahmad
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG10201903646WA publication Critical patent/SG10201903646WA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment
    • B05D3/029—After-treatment with microwaves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/123—Treatment by wave energy or particle radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
    • H10P14/6529—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to a gas or vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2505/00—Polyamides
    • B05D2505/50—Polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Plasma & Fusion (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Formation Of Insulating Films (AREA)
  • Materials For Photolithography (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG10201903646WA 2014-01-13 2015-01-13 Method for microwave processing of photosensitive polyimides SG10201903646WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201461964748P 2014-01-13 2014-01-13

Publications (1)

Publication Number Publication Date
SG10201903646WA true SG10201903646WA (en) 2019-05-30

Family

ID=53521286

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201903646WA SG10201903646WA (en) 2014-01-13 2015-01-13 Method for microwave processing of photosensitive polyimides
SG11201604992QA SG11201604992QA (en) 2014-01-13 2015-01-13 Method for microwave processing of photosensitive polyimides

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201604992QA SG11201604992QA (en) 2014-01-13 2015-01-13 Method for microwave processing of photosensitive polyimides

Country Status (6)

Country Link
US (2) US9519221B2 (https=)
JP (3) JP2017505464A (https=)
KR (1) KR101842691B1 (https=)
CN (2) CN105940347B (https=)
SG (2) SG10201903646WA (https=)
WO (1) WO2015106234A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9519221B2 (en) * 2014-01-13 2016-12-13 Applied Materials, Inc. Method for microwave processing of photosensitive polyimides
JP2019118626A (ja) * 2017-12-29 2019-07-22 株式会社三洋物産 遊技機
JP2019122460A (ja) * 2018-01-12 2019-07-25 株式会社三洋物産 遊技機
JP2019136396A (ja) * 2018-02-14 2019-08-22 株式会社三洋物産 遊技機
JP2019136397A (ja) * 2018-02-14 2019-08-22 株式会社三洋物産 遊技機
JP2019136395A (ja) * 2018-02-14 2019-08-22 株式会社三洋物産 遊技機
JP2019136398A (ja) * 2018-02-14 2019-08-22 株式会社三洋物産 遊技機
JP2019136399A (ja) * 2018-02-14 2019-08-22 株式会社三洋物産 遊技機
JP2019136401A (ja) * 2018-02-14 2019-08-22 株式会社三洋物産 遊技機
JP2019136400A (ja) * 2018-02-14 2019-08-22 株式会社三洋物産 遊技機
CN108582606B (zh) * 2018-04-13 2020-07-03 南京航空航天大学 大厚度复合材料微波固化工艺方法
US12048948B2 (en) * 2018-12-26 2024-07-30 Applied Materials, Inc. Methods for forming microwave tunable composited thin-film dielectric layer
KR20220079595A (ko) * 2019-10-04 2022-06-13 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 평탄화 방법 및 조성물

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4093461A (en) * 1975-07-18 1978-06-06 Gaf Corporation Positive working thermally stable photoresist composition, article and method of using
JP3031434B2 (ja) * 1991-08-07 2000-04-10 旭化成工業株式会社 ポリイミドのパターン形成方法
JPH05119478A (ja) * 1991-10-29 1993-05-18 Asahi Chem Ind Co Ltd ポリイミドパターンの製造方法
JPH05224419A (ja) * 1992-02-07 1993-09-03 Asahi Chem Ind Co Ltd ポリイミド微細パターンの形成方法
US6159666A (en) * 1998-01-14 2000-12-12 Fijitsu Limited Environmentally friendly removal of photoresists used in wet etchable polyimide processes
JP3844106B2 (ja) * 1999-06-09 2006-11-08 住友ベークライト株式会社 ポジ型感光性樹脂組成物の硬化方法及びその方法により製作された半導体装置
US6342333B1 (en) * 1999-09-23 2002-01-29 Hitachi Chemical Dupont Microsystems, L.L.C. Photosensitive resin composition, patterning method, and electronic components
JP4529566B2 (ja) * 2004-07-13 2010-08-25 日立化成デュポンマイクロシステムズ株式会社 マイクロ波硬化用ポジ型感光性樹脂組成物を用いたパターンの製造方法
JP3995253B2 (ja) * 2004-09-28 2007-10-24 Ｔｄｋ株式会社 感光性ポリイミドパターンの形成方法及び該パターンを有する電子素子
JP4618075B2 (ja) * 2004-09-29 2011-01-26 日立化成デュポンマイクロシステムズ株式会社 ネガ型感光性樹脂組成物及びパターン形成方法
JP5099979B2 (ja) * 2005-04-27 2012-12-19 日立化成デュポンマイクロシステムズ株式会社 ネガ型感光性樹脂組成物、パターンの製造方法及び電子部品
WO2007020726A1 (ja) * 2005-08-19 2007-02-22 Asahi Kasei Kabushiki Kaisha 積層体及びその製造方法
US8298747B2 (en) * 2007-03-12 2012-10-30 Hitachi Chemical Dupont Microsystems, Ltd. Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part
PT2221666E (pt) * 2007-11-12 2013-10-31 Hitachi Chemical Co Ltd Composição de resina fotossensível de tipo positivo, método para a produção de um padrão de revestimento fotossensível e dispositivo semicondutor
GB0817563D0 (en) * 2008-09-25 2008-11-05 Membrane Extraction Tech Ltd Membrane module
JP2012094600A (ja) * 2010-10-25 2012-05-17 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
JP2012216715A (ja) * 2011-04-01 2012-11-08 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
US9274422B2 (en) * 2011-06-15 2016-03-01 Hitachi Chemical Dupont Microsystems, Ltd. Photosensitive resin composition, method for forming pattern-cured film using photosensitive resin composition, and electronic component
JP5263424B2 (ja) * 2012-04-05 2013-08-14 日立化成株式会社 ポジ型感光性樹脂組成物、レジストパターンの製造方法及び電子デバイス
US9508616B2 (en) * 2012-05-11 2016-11-29 Applied Materials, Inc. Method for lower thermal budget multiple cures in semiconductor packaging
SG10201709161SA (en) * 2013-05-17 2017-12-28 Fujifilm Electronic Mat Usa Inc Novel polymer and thermosetting composition containing same
US9519221B2 (en) * 2014-01-13 2016-12-13 Applied Materials, Inc. Method for microwave processing of photosensitive polyimides

Also Published As

Publication number Publication date
US9519221B2 (en) 2016-12-13
JP7504595B2 (ja) 2024-06-24
KR101842691B1 (ko) 2018-03-27
JP2017505464A (ja) 2017-02-16
CN105940347A (zh) 2016-09-14
KR20160107282A (ko) 2016-09-13
CN111013967A (zh) 2020-04-17
CN105940347B (zh) 2019-12-13
US10139728B2 (en) 2018-11-27
US20150198890A1 (en) 2015-07-16
US20170090284A1 (en) 2017-03-30
JP2022113685A (ja) 2022-08-04
SG11201604992QA (en) 2016-07-28
WO2015106234A1 (en) 2015-07-16
JP2020074023A (ja) 2020-05-14

Similar Documents

Publication Publication Date Title
SG10201903646WA (en) Method for microwave processing of photosensitive polyimides
SG11202100920XA (en) Invoice Access Method And Apparatus Based On Blockchain, And Electronic Device
SG11202100711RA (en) Event processing method, apparatus and electronic device based on blockchain technology
EP4145248A4 (en) PAGE DISPLAY METHOD AND DEVICE FOR A THIRD PARTY APPLICATION AND ELECTRONIC DEVICE
EP3968180C0 (en) IMAGE PROCESSING METHOD AND APPARATUS, COMPUTER READABLE MEDIUM, AND ELECTRONIC DEVICE
SG11202101514SA (en) Method, apparatus, and electronic device for blockchain-based recordkeeping
MY171373A (en) Apparatus for chemically toughening glass and method of chemically toughening glass using the same
SG10201804322UA (en) Variable frequency microwave (vfm) processes and applications in semiconductor thin film fabrications
WO2012047449A3 (en) Processes and compositions for removing substances from substrates
GB2545621A (en) Labeling computing objects for improved threat detection
MX361190B (es) Revestimiento curable por radiacion con resistencia a altas temperaturas para sustratos metalicos.
HUE070272T2 (hu) Eljárás és berendezés elektronikus eszköz túlmelegedésének kezelésére
EP3742870A4 (en) FLEXIBLE SUBSTRATE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE
TW200633025A (en) Method for plasma doping
PT3461074T (pt) Plataforma e método de certificação de um contrato eletrónico para identificação eletrónica e serviços de confiança (eidas)
EP3876200A4 (en) COMPOSITION ANALYZER OF WASTE ELECTRONIC/ELECTRICAL EQUIPMENT PARTS, TREATMENT DEVICE OF WASTE ELECTRONIC/ELECTRICAL EQUIPMENT PARTS AND TREATMENT METHOD OF WASTE ELECTRONIC/ELECTRICAL EQUIPMENT PARTS
WO2016133677A3 (en) Systems and methods of forming an interfacial dipole layer
SG11202100919TA (en) Invoice Invalidation Method And Apparatus Based On Blockchain, And Electronic Device
EP3868124A4 (en) ELECTRONIC DEVICE WITH EARPHONE AND METHOD FOR CONTROLLING THE ELECTRONIC DEVICE
EP4117313A4 (en) AUDIO PROCESSING METHOD AND APPARATUS, READABLE MEDIUM AND ELECTRONIC DEVICE
TW201612643A (en) Pattern forming method, protective film forming composition, and manufacturing method of electronic device
EP2863259A3 (en) Method for manufacturing photomask blank
EP4089516A4 (en) ICON UPDATE METHOD AND DEVICE AND ELECTRONIC DEVICE
EP3489906A4 (en) ELECTRONIC DEVICE AND METHOD FOR CONTROLLING THE OPERATION OF AN ELECTRONIC DEVICE
EP4016985A4 (en) Image processing method and apparatus, electronic device, and computer-readable storage medium