SG10201902673QA - Polishing apparatus - Google Patents

Polishing apparatus

Info

Publication number
SG10201902673QA
SG10201902673QA SG10201902673QA SG10201902673QA SG 10201902673Q A SG10201902673Q A SG 10201902673QA SG 10201902673Q A SG10201902673Q A SG 10201902673QA SG 10201902673Q A SG10201902673Q A SG 10201902673QA
Authority
SG
Singapore
Prior art keywords
slurry
inlet port
introducing
spindle
supply pipe
Prior art date
Application number
Inventor
Mamoru Kawana
Satoshi Yamanaka
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201902673QA publication Critical patent/SG10201902673QA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
    • B08B9/027—Cleaning the internal surfaces; Removal of blockages
    • B08B9/032—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polarising Elements (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Disintegrating Or Milling (AREA)

Abstract

POLISHING APPARATUS OF THE DISCLOSURE A polishing apparatus includes a polishing unit having a spindle having an axial bore defined therein, a housing by which the spindle is rotatably supported, a polishing pad mounted on an end of the spindle and having an opening defined therein that is held in fluid communication with the axial bore, a slurry supply pipe inserted in the axial bore in the spindle and having a supply port supplying a slurry to the workpiece held on the chuck table and an inlet port remote from the supply port, introducing the slurry into the slurry supply pipe, a slurry introducing unit connected to the inlet port of the slurry supply pipe, introducing the slurry into the inlet port, and a cleaning water introducing unit connected to the inlet port of the slurry supply pipe, introducing cleaning water into the inlet port. [Figure 2]
SG10201902673Q 2018-04-05 2019-03-26 Polishing apparatus SG10201902673QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018073222A JP7032217B2 (en) 2018-04-05 2018-04-05 Polishing equipment

Publications (1)

Publication Number Publication Date
SG10201902673QA true SG10201902673QA (en) 2019-11-28

Family

ID=67991606

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201902673Q SG10201902673QA (en) 2018-04-05 2019-03-26 Polishing apparatus

Country Status (7)

Country Link
US (1) US11279000B2 (en)
JP (1) JP7032217B2 (en)
KR (1) KR102678971B1 (en)
CN (1) CN110340800B (en)
DE (1) DE102019204883B4 (en)
SG (1) SG10201902673QA (en)
TW (1) TWI783136B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7108450B2 (en) 2018-04-13 2022-07-28 株式会社ディスコ Polishing equipment
JP2022074517A (en) * 2020-11-04 2022-05-18 株式会社ディスコ Grinding method for workpiece
CN115229592B (en) * 2022-08-09 2024-04-05 武汉宏海科技股份有限公司 Irregular disc bottom deburring device and method for processing air conditioner chassis

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0899265A (en) 1994-09-30 1996-04-16 Disco Abrasive Syst Ltd Polishing device
US5582540A (en) * 1996-01-22 1996-12-10 National Science Council Of R.O.C Hydrostatic and hydrodynamic polishing tool
JP3271551B2 (en) * 1997-05-26 2002-04-02 松下電工株式会社 Magnetic polishing equipment
JP2000288927A (en) * 1999-04-07 2000-10-17 Sony Corp Flatening polishing device and flatening polishing method
US7059948B2 (en) * 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US6722964B2 (en) * 2000-04-04 2004-04-20 Ebara Corporation Polishing apparatus and method
JP2003236752A (en) * 2002-02-18 2003-08-26 Disco Abrasive Syst Ltd Polisher
JP4163485B2 (en) * 2002-10-25 2008-10-08 不二越機械工業株式会社 Double-side polishing apparatus and polishing method using the same
US20040176017A1 (en) * 2003-02-25 2004-09-09 Aleksander Zelenski Apparatus and methods for abrading a work piece
JP2006216895A (en) * 2005-02-07 2006-08-17 Disco Abrasive Syst Ltd Semiconductor wafer polishing device
JP4790322B2 (en) * 2005-06-10 2011-10-12 株式会社ディスコ Processing apparatus and processing method
JP2007234882A (en) * 2006-03-01 2007-09-13 Dainippon Screen Mfg Co Ltd Substrate processing apparatus, and substrate handling method
JP2008044063A (en) * 2006-08-14 2008-02-28 Nikon Corp Polishing device
US8524035B2 (en) * 2009-11-30 2013-09-03 Corning Incorporated Method and apparatus for conformable polishing
JP2016119333A (en) 2014-12-18 2016-06-30 株式会社荏原製作所 Buff processing unit, and substrate processing apparatus
JP2016159376A (en) * 2015-02-27 2016-09-05 株式会社ディスコ Cutting device
JP6454599B2 (en) * 2015-05-14 2019-01-16 株式会社ディスコ Polishing equipment
JP6489973B2 (en) * 2015-07-30 2019-03-27 株式会社ディスコ Grinding equipment
JP6685707B2 (en) * 2015-12-01 2020-04-22 株式会社ディスコ Polishing equipment
CN206541804U (en) * 2016-05-03 2017-10-03 K.C.科技股份有限公司 Base plate processing system
JP6792363B2 (en) * 2016-07-22 2020-11-25 株式会社ディスコ Grinding device
JP6844970B2 (en) * 2016-08-18 2021-03-17 株式会社ディスコ Polishing equipment
US11135612B2 (en) * 2019-03-19 2021-10-05 The Boeing Company Rotating applicators having fluid dispensers

Also Published As

Publication number Publication date
US11279000B2 (en) 2022-03-22
TWI783136B (en) 2022-11-11
JP2019181603A (en) 2019-10-24
JP7032217B2 (en) 2022-03-08
CN110340800A (en) 2019-10-18
DE102019204883A1 (en) 2019-10-10
TW201944480A (en) 2019-11-16
DE102019204883B4 (en) 2022-12-29
US20190308296A1 (en) 2019-10-10
KR102678971B1 (en) 2024-06-26
KR20190116932A (en) 2019-10-15
CN110340800B (en) 2022-07-12

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