SG10201900129QA - Image sensors - Google Patents

Image sensors

Info

Publication number
SG10201900129QA
SG10201900129QA SG10201900129QA SG10201900129QA SG10201900129QA SG 10201900129Q A SG10201900129Q A SG 10201900129QA SG 10201900129Q A SG10201900129Q A SG 10201900129QA SG 10201900129Q A SG10201900129Q A SG 10201900129QA SG 10201900129Q A SG10201900129Q A SG 10201900129QA
Authority
SG
Singapore
Prior art keywords
color filter
image sensors
array
unit
color
Prior art date
Application number
SG10201900129QA
Other languages
English (en)
Inventor
Kim Bomi
Kim Bumsuk
KIM Jung-Saeng
Ki Lee Yun
Jung Taesub
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of SG10201900129QA publication Critical patent/SG10201900129QA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/1462Coatings
    • H01L27/14621Colour filter arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14603Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/1463Pixel isolation structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/1464Back illuminated imager structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14643Photodiode arrays; MOS imagers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685Process for coatings or optical elements
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14625Optical elements or arrangements associated with the device
    • H01L27/14627Microlenses

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Color Television Image Signal Generators (AREA)
  • Optical Filters (AREA)
  • Color Image Communication Systems (AREA)
  • Spectrometry And Color Measurement (AREA)
SG10201900129QA 2018-01-09 2019-01-07 Image sensors SG10201900129QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020180002920A KR102507474B1 (ko) 2018-01-09 2018-01-09 이미지 센서

Publications (1)

Publication Number Publication Date
SG10201900129QA true SG10201900129QA (en) 2019-08-27

Family

ID=64559483

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201900129QA SG10201900129QA (en) 2018-01-09 2019-01-07 Image sensors

Country Status (6)

Country Link
US (3) US10811450B2 (fr)
EP (1) EP3509107B1 (fr)
JP (1) JP7290418B2 (fr)
KR (1) KR102507474B1 (fr)
CN (1) CN110034138B (fr)
SG (1) SG10201900129QA (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021068788A (ja) * 2019-10-21 2021-04-30 キヤノン株式会社 光電変換装置、光電変換装置の製造方法、および撮像システム
JPWO2021131859A1 (fr) * 2019-12-27 2021-07-01
KR20220143013A (ko) 2020-02-19 2022-10-24 소니그룹주식회사 화상 처리 방법, 센서 장치
KR20220001702A (ko) * 2020-06-30 2022-01-06 삼성전자주식회사 이미지 센서를 포함하는 전자 장치
KR20220073033A (ko) * 2020-11-26 2022-06-03 삼성전자주식회사 이미지 센서 및 이미지 센싱 시스템
KR20220087678A (ko) * 2020-12-18 2022-06-27 삼성전자주식회사 이미지 센서 및 이미지 센싱 회로

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JPS5037044B2 (fr) 1973-04-19 1975-11-29
US6628331B1 (en) 1998-12-18 2003-09-30 Intel Corporation Cyan-magenta-yellow-blue color filter array
JP2002014223A (ja) 2000-06-30 2002-01-18 Sumitomo Chem Co Ltd 黄色フィルタ層を有する色フィルタアレイおよびその製造方法
EP1739751B1 (fr) 2005-06-30 2008-07-02 CSEM Centre Suisse d'Electronique et de Microtechnique SA Detecteur d'images en couleur
KR100929349B1 (ko) * 2007-01-30 2009-12-03 삼성전자주식회사 유기물 컬러 필터를 포함하지 않는 컬러 픽셀, 이미지 센서, 및 컬러 보간방법
KR101356698B1 (ko) 2007-10-01 2014-01-29 삼성전자주식회사 화소 간 크로스토크의 영향을 저감하는 이미지 센서, 컬러필터 어레이, 및 촬상 장치
KR101411548B1 (ko) 2007-11-05 2014-07-07 삼성전자주식회사 이미지 센서, 컬러 필터 어레이, 및 촬상 장치
US7990445B2 (en) 2008-05-30 2011-08-02 Omnivision Technologies, Inc. Image sensor having differing wavelength filters
JP2012169530A (ja) * 2011-02-16 2012-09-06 Sony Corp 固体撮像装置、および、その製造方法、電子機器
KR20130134292A (ko) * 2012-05-30 2013-12-10 삼성전자주식회사 이미지 센서, 상기 이미지 센서를 포함하는 이미지 처리 시스템 및 상기 이미지 센서의 제조 방법
KR102219199B1 (ko) 2014-04-29 2021-02-23 삼성전자주식회사 이미지 센서의 픽셀 어레이 및 이미지 센서
KR102366416B1 (ko) * 2014-08-11 2022-02-23 삼성전자주식회사 Cmos 이미지 센서
KR102383649B1 (ko) * 2014-08-19 2022-04-08 삼성전자주식회사 Cmos 이미지 센서
KR102395775B1 (ko) 2015-03-02 2022-05-09 삼성전자주식회사 컬러 필터를 포함하는 이미지 센서 및 상기 이미지 센서의 제조 방법
US10349015B2 (en) * 2015-06-08 2019-07-09 Trustees Of Dartmouth College Image sensor color filter array pattern
KR102437162B1 (ko) * 2015-10-12 2022-08-29 삼성전자주식회사 이미지 센서
KR102547655B1 (ko) 2015-11-18 2023-06-23 삼성전자주식회사 이미지 센서 및 이를 포함하는 전자 장치
JP5952952B1 (ja) 2015-11-27 2016-07-13 トーア紡マテリアル株式会社 タフトカーペットの連続染色方法及び連続染色機
KR102491497B1 (ko) * 2015-11-30 2023-01-20 삼성전자주식회사 이미지 센서 및 이를 포함하는 전자 장치
TWI785618B (zh) 2016-01-27 2022-12-01 日商新力股份有限公司 固體攝像元件及電子機器
KR102661391B1 (ko) * 2016-10-12 2024-04-26 삼성전자주식회사 이미지 센서
KR20180077393A (ko) * 2016-12-28 2018-07-09 삼성전자주식회사 광센서

Also Published As

Publication number Publication date
US20210005657A1 (en) 2021-01-07
CN110034138A (zh) 2019-07-19
KR102507474B1 (ko) 2023-03-10
KR20190084780A (ko) 2019-07-17
US11631710B2 (en) 2023-04-18
EP3509107A3 (fr) 2019-09-04
US20230246046A1 (en) 2023-08-03
US20190214421A1 (en) 2019-07-11
JP2019122045A (ja) 2019-07-22
EP3509107A2 (fr) 2019-07-10
CN110034138B (zh) 2023-11-14
US10811450B2 (en) 2020-10-20
JP7290418B2 (ja) 2023-06-13
EP3509107B1 (fr) 2020-11-04

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