SG10201900129QA - Image sensors - Google Patents

Image sensors

Info

Publication number
SG10201900129QA
SG10201900129QA SG10201900129QA SG10201900129QA SG10201900129QA SG 10201900129Q A SG10201900129Q A SG 10201900129QA SG 10201900129Q A SG10201900129Q A SG 10201900129QA SG 10201900129Q A SG10201900129Q A SG 10201900129QA SG 10201900129Q A SG10201900129Q A SG 10201900129QA
Authority
SG
Singapore
Prior art keywords
color filter
image sensors
array
unit
color
Prior art date
Application number
SG10201900129QA
Inventor
Kim Bomi
Kim Bumsuk
KIM Jung-Saeng
Ki Lee Yun
Jung Taesub
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of SG10201900129QA publication Critical patent/SG10201900129QA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/1462Coatings
    • H01L27/14621Colour filter arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14603Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/1463Pixel isolation structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/1464Back illuminated imager structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14643Photodiode arrays; MOS imagers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685Process for coatings or optical elements
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14625Optical elements or arrangements associated with the device
    • H01L27/14627Microlenses

Abstract

Image sensors are provided. The image sensors may include a plurality of unit pixels and a color filter array on the plurality of unit pixels. The color filter array may include a color filter unit including four color filters that are arranged in a two-by-two array, and the color filter unit may include two yellow color filters, a cyan color filter, and one of a red color filter or a green color filter. FIG. 3
SG10201900129QA 2018-01-09 2019-01-07 Image sensors SG10201900129QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020180002920A KR102507474B1 (en) 2018-01-09 2018-01-09 Image sensor

Publications (1)

Publication Number Publication Date
SG10201900129QA true SG10201900129QA (en) 2019-08-27

Family

ID=64559483

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201900129QA SG10201900129QA (en) 2018-01-09 2019-01-07 Image sensors

Country Status (6)

Country Link
US (3) US10811450B2 (en)
EP (1) EP3509107B1 (en)
JP (1) JP7290418B2 (en)
KR (1) KR102507474B1 (en)
CN (1) CN110034138B (en)
SG (1) SG10201900129QA (en)

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JP2021068788A (en) * 2019-10-21 2021-04-30 キヤノン株式会社 Photoelectric conversion device, manufacturing method of the same, and imaging system
CN114902659B (en) * 2019-12-27 2023-08-15 株式会社索思未来 Image processing apparatus and image processing method
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KR20220001702A (en) * 2020-06-30 2022-01-06 삼성전자주식회사 Electronic device with Image sensor
KR20220073033A (en) * 2020-11-26 2022-06-03 삼성전자주식회사 Image sensor and image sensing system
KR20220087678A (en) * 2020-12-18 2022-06-27 삼성전자주식회사 Image sensor and image sensing circuit

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US6628331B1 (en) 1998-12-18 2003-09-30 Intel Corporation Cyan-magenta-yellow-blue color filter array
JP2002014223A (en) 2000-06-30 2002-01-18 Sumitomo Chem Co Ltd Color filter array having yellow filter layer and method for manufacturing the same
ATE400062T1 (en) 2005-06-30 2008-07-15 Suisse Electronique Microtech COLOR IMAGE RECORDING SENSOR
KR100929349B1 (en) * 2007-01-30 2009-12-03 삼성전자주식회사 Color pixels, image sensors, and color interpolation methods that do not include organic color filters
KR101356698B1 (en) * 2007-10-01 2014-01-29 삼성전자주식회사 Image sensor for reducing crosstalk effect inter-pixel, and color filter array and image pickup apparatus thereof
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Also Published As

Publication number Publication date
JP7290418B2 (en) 2023-06-13
US20210005657A1 (en) 2021-01-07
CN110034138B (en) 2023-11-14
US20230246046A1 (en) 2023-08-03
JP2019122045A (en) 2019-07-22
KR20190084780A (en) 2019-07-17
EP3509107A3 (en) 2019-09-04
EP3509107A2 (en) 2019-07-10
KR102507474B1 (en) 2023-03-10
CN110034138A (en) 2019-07-19
US20190214421A1 (en) 2019-07-11
US11631710B2 (en) 2023-04-18
EP3509107B1 (en) 2020-11-04
US10811450B2 (en) 2020-10-20

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