SG10201810894TA - Cooled process tool adapter for use in substrate processing chambers - Google Patents

Cooled process tool adapter for use in substrate processing chambers

Info

Publication number
SG10201810894TA
SG10201810894TA SG10201810894TA SG10201810894TA SG10201810894TA SG 10201810894T A SG10201810894T A SG 10201810894TA SG 10201810894T A SG10201810894T A SG 10201810894TA SG 10201810894T A SG10201810894T A SG 10201810894TA SG 10201810894T A SG10201810894T A SG 10201810894TA
Authority
SG
Singapore
Prior art keywords
process tool
annular body
substrate processing
processing chambers
cooled process
Prior art date
Application number
SG10201810894TA
Inventor
William R Fruchterman
Martin Lee Riker
Keith A Miller
Anthony Infante
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG10201810894TA publication Critical patent/SG10201810894TA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32522—Temperature
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3435—Applying energy to the substrate during sputtering
    • C23C14/345—Applying energy to the substrate during sputtering using substrate bias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3447—Collimators, shutters, apertures

Abstract

COOLED PROCESS TOOL ADAPTER FOR USE IN SUBSTRATE PROCESSING CHAMBERS Embodiments of cooled process tool adapters for use in substrate processing chambers are provided herein. In some embodiments, a cooled process tool adapter includes: an annular body surrounding a central opening; a coolant channel disposed in the annular body; one or more features to facilitate supporting a process tool within the central opening; an inlet and an outlet disposed in the annular body and fluidly coupled to the coolant channel; and a power connection coupled to the annular body having a terminal to couple the annular body to a bias power source. [Figure ] 22
SG10201810894TA 2014-06-06 2015-05-18 Cooled process tool adapter for use in substrate processing chambers SG10201810894TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462009153P 2014-06-06 2014-06-06
US14/713,386 US20150354054A1 (en) 2014-06-06 2015-05-15 Cooled process tool adapter for use in substrate processing chambers

Publications (1)

Publication Number Publication Date
SG10201810894TA true SG10201810894TA (en) 2019-01-30

Family

ID=54767174

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201810894TA SG10201810894TA (en) 2014-06-06 2015-05-18 Cooled process tool adapter for use in substrate processing chambers
SG11201609402TA SG11201609402TA (en) 2014-06-06 2015-05-18 Cooled process tool adapter for use in substrate processing chambers

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201609402TA SG11201609402TA (en) 2014-06-06 2015-05-18 Cooled process tool adapter for use in substrate processing chambers

Country Status (7)

Country Link
US (1) US20150354054A1 (en)
JP (1) JP6702952B2 (en)
KR (1) KR102391979B1 (en)
CN (1) CN106415786B (en)
SG (2) SG10201810894TA (en)
TW (1) TWI657520B (en)
WO (1) WO2015187354A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6105114B1 (en) * 2016-03-14 2017-03-29 株式会社東芝 Film forming apparatus, sputtering apparatus, and collimator
GB2550897B (en) * 2016-05-27 2020-12-23 Oxford Instruments Nanotechnology Tools Ltd Cryogenic cooling system
CN109390222B (en) * 2017-08-08 2021-01-05 宁波江丰电子材料股份有限公司 Collimator gauge and using method thereof
TWI765213B (en) * 2019-01-23 2022-05-21 大陸商北京北方華創微電子裝備有限公司 Lined cooling components, reaction chambers and semiconductor processing equipment
US11339466B2 (en) * 2020-03-20 2022-05-24 Applied Materials, Inc. Heated shield for physical vapor deposition chamber
CN111850501B (en) * 2020-07-20 2022-09-27 江苏集萃有机光电技术研究所有限公司 Substrate frame structure and vacuum evaporation device
US20230128611A1 (en) * 2021-10-22 2023-04-27 Applied Materials, Inc. Apparatus for Temperature Control in a Substrate Processing Chamber

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5690795A (en) * 1995-06-05 1997-11-25 Applied Materials, Inc. Screwless shield assembly for vacuum processing chambers
JPH1190762A (en) * 1997-05-27 1999-04-06 Chiron Werke Gmbh & Co Kg Machine tool
US5953827A (en) * 1997-11-05 1999-09-21 Applied Materials, Inc. Magnetron with cooling system for process chamber of processing system
US7134812B2 (en) * 2002-07-17 2006-11-14 Kevin Beckington Tool coolant application and direction assembly
US7686926B2 (en) * 2004-05-26 2010-03-30 Applied Materials, Inc. Multi-step process for forming a metal barrier in a sputter reactor
US9127362B2 (en) * 2005-10-31 2015-09-08 Applied Materials, Inc. Process kit and target for substrate processing chamber
US7846310B2 (en) * 2006-12-13 2010-12-07 Applied Materials, Inc. Encapsulated and water cooled electromagnet array
US7981262B2 (en) * 2007-01-29 2011-07-19 Applied Materials, Inc. Process kit for substrate processing chamber
US20080257263A1 (en) * 2007-04-23 2008-10-23 Applied Materials, Inc. Cooling shield for substrate processing chamber
JP4994164B2 (en) * 2007-09-07 2012-08-08 株式会社牧野フライス製作所 Method and apparatus for cooling moving body of machine tool
KR102025330B1 (en) * 2008-04-16 2019-09-25 어플라이드 머티어리얼스, 인코포레이티드 Wafer processing deposition shielding components
JP5448232B2 (en) * 2008-04-28 2014-03-19 コムコン・アーゲー Apparatus and method for pre-processing and coating an object
US20110036709A1 (en) * 2009-08-11 2011-02-17 Applied Materials, Inc. Process kit for rf physical vapor deposition
US9096927B2 (en) * 2011-09-02 2015-08-04 Applied Materials, Inc. Cooling ring for physical vapor deposition chamber target
US9605341B2 (en) * 2013-03-06 2017-03-28 Applied Materials, Inc. Physical vapor deposition RF plasma shield deposit control

Also Published As

Publication number Publication date
SG11201609402TA (en) 2016-12-29
TWI657520B (en) 2019-04-21
JP2017523313A (en) 2017-08-17
JP6702952B2 (en) 2020-06-03
TW201546937A (en) 2015-12-16
WO2015187354A1 (en) 2015-12-10
US20150354054A1 (en) 2015-12-10
KR102391979B1 (en) 2022-04-27
CN106415786B (en) 2019-11-22
KR20170015980A (en) 2017-02-10
CN106415786A (en) 2017-02-15

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