SG10201807788QA - System and method for automating user interaction for semiconductor manufacturing equipment - Google Patents

System and method for automating user interaction for semiconductor manufacturing equipment

Info

Publication number
SG10201807788QA
SG10201807788QA SG10201807788QA SG10201807788QA SG10201807788QA SG 10201807788Q A SG10201807788Q A SG 10201807788QA SG 10201807788Q A SG10201807788Q A SG 10201807788QA SG 10201807788Q A SG10201807788Q A SG 10201807788QA SG 10201807788Q A SG10201807788Q A SG 10201807788QA
Authority
SG
Singapore
Prior art keywords
semiconductor manufacturing
user interaction
manufacturing equipment
state
processing tool
Prior art date
Application number
SG10201807788QA
Other languages
English (en)
Inventor
Unterguggenberger Rainer
Chan Henry
Huang Chung-Ho
Wong Vincent
Hemker David
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG10201807788QA publication Critical patent/SG10201807788QA/en

Links

Classifications

    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Program-control systems
    • G05B19/02Program-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0451Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/0265Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric the criterion being a learning criterion
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Program-control systems
    • G05B19/02Program-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604Process monitoring, e.g. flow or thickness monitoring
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612Production flow monitoring, e.g. for increasing throughput
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/20Pc systems
    • G05B2219/25Pc structure of the system
    • G05B2219/25236Detail, detect presence of operator to wake up system
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/20Pc systems
    • G05B2219/26Pc applications
    • G05B2219/2602Wafer processing
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32128Gui graphical user interface
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/36Nc in input of data, input key till input tape
    • G05B2219/36039Learning task dynamics, process
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/36Nc in input of data, input key till input tape
    • G05B2219/36297Machining plan, indicate order of machining as function of presence of operator
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/45Nc applications
    • G05B2219/45031Manufacturing semiconductor wafers
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00Testing or monitoring of control systems or parts thereof
    • G05B23/02Electric testing or monitoring
    • G05B23/0205Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0259Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
    • G05B23/0267Fault communication, e.g. human machine interface [HMI]
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00Testing or monitoring of control systems or parts thereof
    • G05B23/02Electric testing or monitoring
    • G05B23/0205Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0259Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
    • G05B23/0283Predictive maintenance, e.g. involving the monitoring of a system and, based on the monitoring results, taking decisions on the maintenance schedule of the monitored system; Estimating remaining useful life [RUL]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • Health & Medical Sciences (AREA)
  • Medical Informatics (AREA)
  • Software Systems (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • General Factory Administration (AREA)
  • User Interface Of Digital Computer (AREA)
SG10201807788QA 2017-09-11 2018-09-10 System and method for automating user interaction for semiconductor manufacturing equipment SG10201807788QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762556733P 2017-09-11 2017-09-11
US16/119,202 US10747210B2 (en) 2017-09-11 2018-08-31 System and method for automating user interaction for semiconductor manufacturing equipment

Publications (1)

Publication Number Publication Date
SG10201807788QA true SG10201807788QA (en) 2019-04-29

Family

ID=63720456

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201807788QA SG10201807788QA (en) 2017-09-11 2018-09-10 System and method for automating user interaction for semiconductor manufacturing equipment

Country Status (7)

Country Link
US (1) US10747210B2 (https=)
EP (1) EP3454141B1 (https=)
JP (1) JP7311253B2 (https=)
KR (1) KR102637272B1 (https=)
CN (1) CN109637947B (https=)
SG (1) SG10201807788QA (https=)
TW (1) TWI782085B (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3200037A1 (en) 2016-01-26 2017-08-02 Basf Se System and method for risk based control of a process performed by production equipment
US11133204B2 (en) * 2019-01-29 2021-09-28 Applied Materials, Inc. Chamber matching with neural networks in semiconductor equipment tools
WO2020205339A1 (en) * 2019-03-29 2020-10-08 Lam Research Corporation Model-based scheduling for substrate processing systems
JP7244367B2 (ja) * 2019-06-20 2023-03-22 ファナック株式会社 加工指令改良システム及び加工指令改良方法
TWI767398B (zh) * 2019-11-04 2022-06-11 美商瓦特洛威電子製造公司 用於監測半導體處理系統之系統及方法
US11782397B2 (en) * 2019-11-27 2023-10-10 Johnson Controls Tyco IP Holdings LLP Operator automation system
CN113642819B (zh) * 2020-05-11 2024-12-20 上海华力集成电路制造有限公司 连环许容时间区段站点异常时产品自动调度装置和方法
US11901204B2 (en) * 2020-05-22 2024-02-13 Applied Materials, Inc. Predictive wafer scheduling for multi-chamber semiconductor equipment
US12020961B2 (en) * 2020-06-22 2024-06-25 Lavorro, Inc. Automated assistance in a semiconductor manufacturing environment
US11545379B2 (en) * 2020-07-31 2023-01-03 Nanya Technology Corporation System and method for controlling semiconductor manufacturing equipment
US12593646B2 (en) 2021-04-28 2026-03-31 Tel Manufacturing And Engineering Of America, Inc. Automated fault detection in microfabrication
JP2022183039A (ja) * 2021-05-27 2022-12-08 東京エレクトロン株式会社 基板処理装置及びリカバリ処理方法
US20220384223A1 (en) * 2021-05-27 2022-12-01 Tokyo Electron Limited Board processing equipment and recovery processing method
US20230113095A1 (en) * 2021-10-13 2023-04-13 Applied Materials, Inc. Verification for improving quality of maintenance of manufacturing equipment
KR102587791B1 (ko) * 2021-12-30 2023-10-12 한국세라믹기술원 미세채널을 갖거나 다공성재질을 갖는 피증착물에 대한 원자층증착 시뮬레이션 방법
KR102737299B1 (ko) * 2022-03-10 2024-12-02 한국수력원자력 주식회사 인공지능을 이용하여 플랜트의 이상상태에 대한 조치사항을 제공하는 방법
JP7575432B2 (ja) * 2022-08-26 2024-10-29 株式会社アルバック 情報処理装置、情報処理方法およびプログラム
EP4730055A1 (en) * 2024-10-17 2026-04-22 Abb Schweiz Ag System and method for extracting events and operating procedures from process data

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6122566A (en) * 1998-03-03 2000-09-19 Applied Materials Inc. Method and apparatus for sequencing wafers in a multiple chamber, semiconductor wafer processing system
KR100672632B1 (ko) * 2001-11-06 2007-02-09 엘지.필립스 엘시디 주식회사 액정표시소자의 약액교환방법 및 그 장치
JP4367621B2 (ja) * 2003-09-18 2009-11-18 スズキ株式会社 シフト操作制御装置
US8821099B2 (en) * 2005-07-11 2014-09-02 Brooks Automation, Inc. Load port module
DE102006004408B4 (de) * 2006-01-31 2010-03-18 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Analysieren von standardmäßigen Anlagennachrichten in einer Fertigungsumgebung
US20070260420A1 (en) * 2006-05-03 2007-11-08 Data I/O Corporation Automated calibration system
US7801635B2 (en) * 2007-01-30 2010-09-21 Tokyo Electron Limited Real-time parameter tuning for etch processes
US7642102B2 (en) * 2007-01-30 2010-01-05 Tokyo Electron Limited Real-time parameter tuning using wafer thickness
US7571074B2 (en) * 2007-01-30 2009-08-04 Tokyo Electron Limited Method of using a wafer-thickness-dependant profile library
WO2008137544A1 (en) * 2007-05-02 2008-11-13 Mks Instruments, Inc. Automated model building and model updating
US8396582B2 (en) * 2008-03-08 2013-03-12 Tokyo Electron Limited Method and apparatus for self-learning and self-improving a semiconductor manufacturing tool
US8078552B2 (en) 2008-03-08 2011-12-13 Tokyo Electron Limited Autonomous adaptive system and method for improving semiconductor manufacturing quality
US8723869B2 (en) * 2011-03-21 2014-05-13 Tokyo Electron Limited Biologically based chamber matching
US8501499B2 (en) * 2011-03-28 2013-08-06 Tokyo Electron Limited Adaptive recipe selector
JP5808605B2 (ja) * 2011-08-17 2015-11-10 株式会社日立製作所 異常検知・診断方法、および異常検知・診断システム
US9727049B2 (en) * 2012-09-04 2017-08-08 Taiwan Semiconductor Manufacturing Company, Ltd. Qualitative fault detection and classification system for tool condition monitoring and associated methods
US9471873B1 (en) 2012-09-20 2016-10-18 Amazon Technologies, Inc. Automating user patterns on a user device
US9396443B2 (en) * 2013-12-05 2016-07-19 Tokyo Electron Limited System and method for learning and/or optimizing manufacturing processes
JP6250406B2 (ja) * 2014-01-15 2017-12-20 株式会社荏原製作所 基板処理装置の異常検出装置、及び基板処理装置
US9673071B2 (en) * 2014-10-23 2017-06-06 Lam Research Corporation Buffer station for thermal control of semiconductor substrates transferred therethrough and method of transferring semiconductor substrates
US11569138B2 (en) * 2015-06-16 2023-01-31 Kla Corporation System and method for monitoring parameters of a semiconductor factory automation system
JP6603600B2 (ja) * 2015-06-30 2019-11-06 パナソニック インテレクチュアル プロパティ コーポレーション オブ アメリカ 需要予測方法、需要予測装置及び需要予測プログラムを記録したコンピュータ読み取り可能な記録媒体
CN106815115B (zh) * 2017-01-13 2020-02-21 苏州浪潮智能科技有限公司 一种服务器运行状态监控系统

Also Published As

Publication number Publication date
US20190079503A1 (en) 2019-03-14
EP3454141B1 (en) 2023-11-15
JP2019083309A (ja) 2019-05-30
KR102637272B1 (ko) 2024-02-15
JP7311253B2 (ja) 2023-07-19
CN109637947A (zh) 2019-04-16
US10747210B2 (en) 2020-08-18
TWI782085B (zh) 2022-11-01
EP3454141A1 (en) 2019-03-13
KR20190029465A (ko) 2019-03-20
CN109637947B (zh) 2023-06-20
TW201921241A (zh) 2019-06-01

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