SG10201802923WA - Cutting apparatus - Google Patents
Cutting apparatusInfo
- Publication number
- SG10201802923WA SG10201802923WA SG10201802923WA SG10201802923WA SG10201802923WA SG 10201802923W A SG10201802923W A SG 10201802923WA SG 10201802923W A SG10201802923W A SG 10201802923WA SG 10201802923W A SG10201802923W A SG 10201802923WA SG 10201802923W A SG10201802923W A SG 10201802923WA
- Authority
- SG
- Singapore
- Prior art keywords
- elastic wave
- processing
- wave data
- idling
- section configured
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/09—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool
- B23Q17/0952—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool during machining
- B23Q17/0971—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool during machining by measuring mechanical vibrations of parts of the machine
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/005—Computer numerical control means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/12—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring vibration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q2717/00—Arrangements for indicating or measuring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Forests & Forestry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Machine Tool Sensing Apparatuses (AREA)
Abstract
CUTTING APPARATUS Disclosed herein is a cutting apparatus having a cutting blade for cutting a workpiece held on a chuck table. The cutting apparatus includes an elastic wave detecting sensor for detecting an elastic wave due to the rotation of the cutting blade, a reference data storing section configured to store reference data as a set of reference processing elastic wave data detected in previously processing the workpiece and reference idling elastic wave data detected in the condition where the cutting blade is idling before processing, a threshold value storing section configured to store a threshold value set on the basis of the reference processing elastic wave data, a ratio calculating section configured to calculate the ratio of idling elastic wave data detected at the time just before actually processing the workpiece to the reference idling elastic wave data, and a determining section configured to divide processing elastic wave data detected during the actual processing by the ratio calculated by the ratio calculating section to thereby obtain a corrected value and then determine that the actual processing is abnormal when the corrected value is greater than the threshold value. (Figure 3)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017084104A JP6866217B2 (en) | 2017-04-21 | 2017-04-21 | Cutting equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201802923WA true SG10201802923WA (en) | 2018-11-29 |
Family
ID=63852544
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201802923WA SG10201802923WA (en) | 2017-04-21 | 2018-04-06 | Cutting apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US10688616B2 (en) |
JP (1) | JP6866217B2 (en) |
KR (1) | KR102287129B1 (en) |
CN (1) | CN108724492B (en) |
SG (1) | SG10201802923WA (en) |
TW (1) | TWI752191B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10679908B2 (en) * | 2017-01-23 | 2020-06-09 | Globalwafers Co., Ltd. | Cleave systems, mountable cleave monitoring systems, and methods for separating bonded wafer structures |
JP6629816B2 (en) * | 2017-10-31 | 2020-01-15 | ファナック株式会社 | Diagnostic device and diagnostic method |
JP7379064B2 (en) * | 2019-10-07 | 2023-11-14 | 株式会社ディスコ | cutting equipment |
JP7396848B2 (en) * | 2019-10-11 | 2023-12-12 | ファナック株式会社 | Detection device and program |
JP7394712B2 (en) * | 2020-06-24 | 2023-12-08 | Towa株式会社 | Cutting device and method for manufacturing cut products |
Family Cites Families (46)
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JPS474816Y1 (en) | 1967-03-30 | 1972-02-21 | ||
US3548648A (en) * | 1968-04-15 | 1970-12-22 | Gen Electric | Sonic worn cutting tool detector |
US3841149A (en) * | 1973-01-08 | 1974-10-15 | Interactive Systems | Tool wear detector |
US4087801A (en) * | 1974-12-20 | 1978-05-02 | Tokyo Shibaura Electric Co., Ltd. | Apparatus for detecting damages of cutting tools |
JPS5818183B2 (en) * | 1978-05-30 | 1983-04-12 | 株式会社小松製作所 | Milling cutter chip breakage detection device |
JPS5828451A (en) * | 1981-08-07 | 1983-02-19 | Sumitomo Electric Ind Ltd | Method of sensing failures at the tip of cutting tool |
JPS58186550A (en) * | 1982-04-23 | 1983-10-31 | Yoshiaki Kakino | Tool break preventive device |
US4658245A (en) * | 1983-04-29 | 1987-04-14 | The Warner & Swasey Company | Tool condition and failure monitoring apparatus and method |
US4636779A (en) * | 1984-10-24 | 1987-01-13 | General Electric Company | Acoustic detection of tool break events in machine tool operations |
SU1411640A1 (en) * | 1985-09-19 | 1988-07-23 | Красноярский Политехнический Институт | Method of determining resistance strength of cutting tool |
US4736625A (en) * | 1986-11-05 | 1988-04-12 | The Warner & Swasey Company | Method and apparatus for monitoring the cutting condition of a machine tool during machining of a workpiece |
RU1785832C (en) * | 1989-09-25 | 1993-01-07 | Институт машиноведения и металлургии Дальневосточного отделения АН СССР | Method of checking cutting tool wear |
JPH03202253A (en) * | 1989-12-29 | 1991-09-04 | Nachi Fujikoshi Corp | Rotary tool holding device with abnormality detector |
JP2810489B2 (en) * | 1990-05-30 | 1998-10-15 | 株式会社ノリタケカンパニーリミテド | Grinding wheel |
JPH06218655A (en) * | 1993-01-26 | 1994-08-09 | Sumitomo Metal Ind Ltd | Monitoring of tool fault and device therefor |
JP2000049120A (en) * | 1998-07-27 | 2000-02-18 | Disco Abrasive Syst Ltd | Cutting device |
JP2003094289A (en) * | 2001-09-25 | 2003-04-03 | Fuji Mach Mfg Co Ltd | Main spindle belt monitoring program, main spindle belt monitoring device, and cnc machine tool with main spindle belt monitoring device |
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JP6255238B2 (en) * | 2013-12-27 | 2017-12-27 | 株式会社ディスコ | Cutting equipment |
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JP6223237B2 (en) | 2014-03-07 | 2017-11-01 | 株式会社ディスコ | Cutting equipment |
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-
2017
- 2017-04-21 JP JP2017084104A patent/JP6866217B2/en active Active
-
2018
- 2018-03-14 TW TW107108532A patent/TWI752191B/en active
- 2018-04-06 SG SG10201802923WA patent/SG10201802923WA/en unknown
- 2018-04-06 KR KR1020180040225A patent/KR102287129B1/en active IP Right Grant
- 2018-04-16 CN CN201810338098.XA patent/CN108724492B/en active Active
- 2018-04-18 US US15/956,105 patent/US10688616B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN108724492B (en) | 2021-07-09 |
KR20180118522A (en) | 2018-10-31 |
TW201843006A (en) | 2018-12-16 |
TWI752191B (en) | 2022-01-11 |
JP6866217B2 (en) | 2021-04-28 |
US20180304429A1 (en) | 2018-10-25 |
KR102287129B1 (en) | 2021-08-05 |
US10688616B2 (en) | 2020-06-23 |
JP2018176394A (en) | 2018-11-15 |
CN108724492A (en) | 2018-11-02 |
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