SG10201802923WA - Cutting apparatus - Google Patents

Cutting apparatus

Info

Publication number
SG10201802923WA
SG10201802923WA SG10201802923WA SG10201802923WA SG10201802923WA SG 10201802923W A SG10201802923W A SG 10201802923WA SG 10201802923W A SG10201802923W A SG 10201802923WA SG 10201802923W A SG10201802923W A SG 10201802923WA SG 10201802923W A SG10201802923W A SG 10201802923WA
Authority
SG
Singapore
Prior art keywords
elastic wave
processing
wave data
idling
section configured
Prior art date
Application number
SG10201802923WA
Inventor
Tsuno Takahiko
Miyakawa Saki
Sugiyama Tomoaki
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201802923WA publication Critical patent/SG10201802923WA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/09Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool
    • B23Q17/0952Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool during machining
    • B23Q17/0971Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool during machining by measuring mechanical vibrations of parts of the machine
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/005Computer numerical control means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/12Arrangements for observing, indicating or measuring on machine tools for indicating or measuring vibration
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/023Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q2717/00Arrangements for indicating or measuring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Forests & Forestry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Machine Tool Sensing Apparatuses (AREA)

Abstract

CUTTING APPARATUS Disclosed herein is a cutting apparatus having a cutting blade for cutting a workpiece held on a chuck table. The cutting apparatus includes an elastic wave detecting sensor for detecting an elastic wave due to the rotation of the cutting blade, a reference data storing section configured to store reference data as a set of reference processing elastic wave data detected in previously processing the workpiece and reference idling elastic wave data detected in the condition where the cutting blade is idling before processing, a threshold value storing section configured to store a threshold value set on the basis of the reference processing elastic wave data, a ratio calculating section configured to calculate the ratio of idling elastic wave data detected at the time just before actually processing the workpiece to the reference idling elastic wave data, and a determining section configured to divide processing elastic wave data detected during the actual processing by the ratio calculated by the ratio calculating section to thereby obtain a corrected value and then determine that the actual processing is abnormal when the corrected value is greater than the threshold value. (Figure 3)
SG10201802923WA 2017-04-21 2018-04-06 Cutting apparatus SG10201802923WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017084104A JP6866217B2 (en) 2017-04-21 2017-04-21 Cutting equipment

Publications (1)

Publication Number Publication Date
SG10201802923WA true SG10201802923WA (en) 2018-11-29

Family

ID=63852544

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201802923WA SG10201802923WA (en) 2017-04-21 2018-04-06 Cutting apparatus

Country Status (6)

Country Link
US (1) US10688616B2 (en)
JP (1) JP6866217B2 (en)
KR (1) KR102287129B1 (en)
CN (1) CN108724492B (en)
SG (1) SG10201802923WA (en)
TW (1) TWI752191B (en)

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US10679908B2 (en) * 2017-01-23 2020-06-09 Globalwafers Co., Ltd. Cleave systems, mountable cleave monitoring systems, and methods for separating bonded wafer structures
JP6629816B2 (en) * 2017-10-31 2020-01-15 ファナック株式会社 Diagnostic device and diagnostic method
JP7379064B2 (en) * 2019-10-07 2023-11-14 株式会社ディスコ cutting equipment
JP7396848B2 (en) * 2019-10-11 2023-12-12 ファナック株式会社 Detection device and program
JP7394712B2 (en) * 2020-06-24 2023-12-08 Towa株式会社 Cutting device and method for manufacturing cut products

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Also Published As

Publication number Publication date
CN108724492B (en) 2021-07-09
KR20180118522A (en) 2018-10-31
TW201843006A (en) 2018-12-16
TWI752191B (en) 2022-01-11
JP6866217B2 (en) 2021-04-28
US20180304429A1 (en) 2018-10-25
KR102287129B1 (en) 2021-08-05
US10688616B2 (en) 2020-06-23
JP2018176394A (en) 2018-11-15
CN108724492A (en) 2018-11-02

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