SG10201801584QA - Wide lipseal for electroplating - Google Patents

Wide lipseal for electroplating

Info

Publication number
SG10201801584QA
SG10201801584QA SG10201801584QA SG10201801584QA SG10201801584QA SG 10201801584Q A SG10201801584Q A SG 10201801584QA SG 10201801584Q A SG10201801584Q A SG 10201801584QA SG 10201801584Q A SG10201801584Q A SG 10201801584QA SG 10201801584Q A SG10201801584Q A SG 10201801584QA
Authority
SG
Singapore
Prior art keywords
lipseal
electroplating
semiconductor substrate
wide
protrusion
Prior art date
Application number
SG10201801584QA
Other languages
English (en)
Inventor
Thorkelsson Kari
Berke Aaron
Kumar Santosh
Rash Robert
Peng Chua Lee
Buckalew Bryan
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG10201801584QA publication Critical patent/SG10201801584QA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
SG10201801584QA 2017-03-01 2018-02-27 Wide lipseal for electroplating SG10201801584QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15/446,631 US20180251907A1 (en) 2017-03-01 2017-03-01 Wide lipseal for electroplating

Publications (1)

Publication Number Publication Date
SG10201801584QA true SG10201801584QA (en) 2018-10-30

Family

ID=63357279

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201801584QA SG10201801584QA (en) 2017-03-01 2018-02-27 Wide lipseal for electroplating

Country Status (6)

Country Link
US (1) US20180251907A1 (zh)
JP (1) JP2018145524A (zh)
KR (2) KR20180100488A (zh)
CN (1) CN108531953B (zh)
SG (1) SG10201801584QA (zh)
TW (1) TW201841301A (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7132135B2 (ja) * 2019-01-23 2022-09-06 上村工業株式会社 ワーク保持治具及び電気めっき装置
JP7132134B2 (ja) * 2019-01-23 2022-09-06 上村工業株式会社 ワーク保持治具及び電気めっき装置
JP7132136B2 (ja) * 2019-01-23 2022-09-06 上村工業株式会社 ワーク保持治具及び電気めっき装置
US20220220627A1 (en) * 2019-05-17 2022-07-14 Lam Research Corporation Substrate sticking and breakage mitigation
US11352711B2 (en) * 2019-07-16 2022-06-07 Applied Materials, Inc. Fluid recovery in semiconductor processing
JP2023504033A (ja) * 2019-11-27 2023-02-01 ラム リサーチ コーポレーション レジストによるめっきのためのエッジ除去
CN115135618A (zh) * 2021-10-18 2022-09-30 株式会社荏原制作所 镀覆方法及镀覆装置
TWI803026B (zh) * 2021-10-25 2023-05-21 日商荏原製作所股份有限公司 鍍覆方法及鍍覆裝置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6755946B1 (en) * 2001-11-30 2004-06-29 Novellus Systems, Inc. Clamshell apparatus with dynamic uniformity control
US7033465B1 (en) * 2001-11-30 2006-04-25 Novellus Systems, Inc. Clamshell apparatus with crystal shielding and in-situ rinse-dry
US7985325B2 (en) * 2007-10-30 2011-07-26 Novellus Systems, Inc. Closed contact electroplating cup assembly
US8172992B2 (en) * 2008-12-10 2012-05-08 Novellus Systems, Inc. Wafer electroplating apparatus for reducing edge defects
US9228270B2 (en) * 2011-08-15 2016-01-05 Novellus Systems, Inc. Lipseals and contact elements for semiconductor electroplating apparatuses
JP6745103B2 (ja) * 2014-11-26 2020-08-26 ノベラス・システムズ・インコーポレーテッドＮｏｖｅｌｌｕｓ Ｓｙｓｔｅｍｓ Ｉｎｃｏｒｐｏｒａｔｅｄ 半導体電気メッキ装置用のリップシールおよび接触要素

Also Published As

Publication number Publication date
KR20180100488A (ko) 2018-09-11
TW201841301A (zh) 2018-11-16
US20180251907A1 (en) 2018-09-06
CN108531953B (zh) 2022-07-12
KR20230153982A (ko) 2023-11-07
CN108531953A (zh) 2018-09-14
JP2018145524A (ja) 2018-09-20

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