SG10201708724WA - Fine resist pattern-forming composition and pattern formation method using the same - Google Patents

Fine resist pattern-forming composition and pattern formation method using the same

Info

Publication number
SG10201708724WA
SG10201708724WA SG10201708724WA SG10201708724WA SG10201708724WA SG 10201708724W A SG10201708724W A SG 10201708724WA SG 10201708724W A SG10201708724W A SG 10201708724WA SG 10201708724W A SG10201708724W A SG 10201708724WA SG 10201708724W A SG10201708724W A SG 10201708724WA
Authority
SG
Singapore
Prior art keywords
same
formation method
forming composition
pattern
fine resist
Prior art date
Application number
SG10201708724WA
Inventor
Yamamoto Kazuma
Miyamoto Yoshihiro
Sekito Takashi
Nagahara Tatsuro
Original Assignee
Az Electronic Mat (Luxembourg) S A R L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Az Electronic Mat (Luxembourg) S A R L filed Critical Az Electronic Mat (Luxembourg) S A R L
Publication of SG10201708724WA publication Critical patent/SG10201708724WA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D139/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Coating compositions based on derivatives of such polymers
    • C09D139/02—Homopolymers or copolymers of vinylamine
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D139/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Coating compositions based on derivatives of such polymers
    • C09D139/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/325—Non-aqueous compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G03F7/405—Treatment with inorganic or organometallic reagents after imagewise removal
SG10201708724WA 2013-02-26 2014-02-26 Fine resist pattern-forming composition and pattern formation method using the same SG10201708724WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013036029A JP6239833B2 (en) 2013-02-26 2013-02-26 Composition for forming fine resist pattern and pattern forming method using the same

Publications (1)

Publication Number Publication Date
SG10201708724WA true SG10201708724WA (en) 2017-12-28

Family

ID=51428254

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201708724WA SG10201708724WA (en) 2013-02-26 2014-02-26 Fine resist pattern-forming composition and pattern formation method using the same
SG11201505632YA SG11201505632YA (en) 2013-02-26 2014-02-26 Fine resist pattern-forming composition and pattern forming method using same

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201505632YA SG11201505632YA (en) 2013-02-26 2014-02-26 Fine resist pattern-forming composition and pattern forming method using same

Country Status (9)

Country Link
US (1) US9921481B2 (en)
EP (1) EP2963499A4 (en)
JP (1) JP6239833B2 (en)
KR (1) KR101900660B1 (en)
CN (1) CN104995564B (en)
IL (1) IL240745B (en)
SG (2) SG10201708724WA (en)
TW (1) TWI616480B (en)
WO (1) WO2014132992A1 (en)

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JP6157151B2 (en) * 2013-03-05 2017-07-05 アーゼッド・エレクトロニック・マテリアルズ（ルクセンブルグ）ソシエテ・ア・レスポンサビリテ・リミテ Composition for forming fine resist pattern and pattern forming method using the same
US9448483B2 (en) * 2014-07-31 2016-09-20 Dow Global Technologies Llc Pattern shrink methods
EP3208659A1 (en) * 2014-10-14 2017-08-23 AZ Electronic Materials (Luxembourg) S.à.r.l. Composition for resist patterning and method for forming pattern using same
KR102609535B1 (en) * 2015-07-08 2023-12-04 주식회사 동진쎄미켐 Composition for coating photoresist pattern and method for forming fine pattern using the same
TWI738775B (en) 2016-05-13 2021-09-11 日商住友化學股份有限公司 Photoresist composition and method for producing photoresist pattern
JP6969889B2 (en) 2016-05-13 2021-11-24 住友化学株式会社 Method for manufacturing resist composition and resist pattern
JP7316022B2 (en) 2016-05-13 2023-07-27 住友化学株式会社 RESIST COMPOSITION AND RESIST PATTERN MANUFACTURING METHOD
TWI610392B (en) * 2016-09-05 2018-01-01 Daxin Mat Corp Method for preparing photovoltaic element
US11287740B2 (en) 2018-06-15 2022-03-29 Taiwan Semiconductor Manufacturing Co., Ltd. Photoresist composition and method of forming photoresist pattern
TW202016279A (en) 2018-10-17 2020-05-01 美商英培雅股份有限公司 Patterned organometallic photoresists and methods of patterning
TW202344939A (en) * 2019-04-12 2023-11-16 美商英培雅股份有限公司 Method for treating a developed patterned layer
WO2021178302A1 (en) 2020-03-02 2021-09-10 Inpria Corporation Process environment for inorganic resist patterning

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JP3071401B2 (en) 1996-07-05 2000-07-31 三菱電機株式会社 Fine pattern forming material, method of manufacturing semiconductor device using the same, and semiconductor device
JP2001228616A (en) * 2000-02-16 2001-08-24 Mitsubishi Electric Corp Fine pattern forming material and method for producing semiconductor device using the same
JP3662870B2 (en) 2001-07-05 2005-06-22 東京応化工業株式会社 Resin pattern refinement coating forming agent and fine resist pattern forming method using the same
SG129274A1 (en) * 2003-02-19 2007-02-26 Mitsubishi Gas Chemical Co Cleaaning solution and cleaning process using the solution
JP2005022282A (en) * 2003-07-03 2005-01-27 Fuji Photo Film Co Ltd Silica preliminary dispersion liquid, silica pulverized dispersion liquid, coating liquid for ink receiving layer and inkjet recording medium
KR100585138B1 (en) * 2004-04-08 2006-05-30 삼성전자주식회사 Mask pattern for manufacturing semiconductor device and method of forming the same and method of manufacturing semiconductor device having fine patterns
JP4485241B2 (en) 2004-04-09 2010-06-16 Ａｚエレクトロニックマテリアルズ株式会社 Water-soluble resin composition and pattern forming method using the same
KR100618850B1 (en) * 2004-07-22 2006-09-01 삼성전자주식회사 Mask pattern for manufacturing semiconductor device and method of forming the same and method of manufacturing semiconductor device having fine patterns
US7595141B2 (en) 2004-10-26 2009-09-29 Az Electronic Materials Usa Corp. Composition for coating over a photoresist pattern
JP4566862B2 (en) * 2005-08-25 2010-10-20 富士通株式会社 Resist pattern thickening material, resist pattern forming method, semiconductor device and manufacturing method thereof
JP4554665B2 (en) * 2006-12-25 2010-09-29 富士フイルム株式会社 PATTERN FORMATION METHOD, POSITIVE RESIST COMPOSITION FOR MULTIPLE DEVELOPMENT USED FOR THE PATTERN FORMATION METHOD, NEGATIVE DEVELOPMENT SOLUTION USED FOR THE PATTERN FORMATION METHOD, AND NEGATIVE DEVELOPMENT RINSE SOLUTION USED FOR THE PATTERN FORMATION METHOD
WO2008140119A1 (en) * 2007-05-15 2008-11-20 Fujifilm Corporation Method for pattern formation
JP5520590B2 (en) * 2009-10-06 2014-06-11 富士フイルム株式会社 Pattern forming method, chemically amplified resist composition, and resist film
JP5553210B2 (en) * 2010-04-01 2014-07-16 ブラザー工業株式会社 Treatment liquid for ink jet recording, ink set, and ink jet recording method
US8852848B2 (en) * 2010-07-28 2014-10-07 Z Electronic Materials USA Corp. Composition for coating over a photoresist pattern
JP5785121B2 (en) * 2011-04-28 2015-09-24 信越化学工業株式会社 Pattern formation method
JP5830273B2 (en) 2011-06-10 2015-12-09 東京応化工業株式会社 Resist pattern forming method
JP5705669B2 (en) * 2011-07-14 2015-04-22 メルクパフォーマンスマテリアルズＩｐ合同会社 Composition for forming a fine pattern and method for forming a fine pattern using the same
JP5846889B2 (en) * 2011-12-14 2016-01-20 東京応化工業株式会社 Resist composition, resist pattern forming method, compound

Also Published As

Publication number Publication date
JP6239833B2 (en) 2017-11-29
EP2963499A4 (en) 2017-08-02
IL240745A0 (en) 2015-10-29
EP2963499A1 (en) 2016-01-06
TW201439184A (en) 2014-10-16
IL240745B (en) 2018-05-31
TWI616480B (en) 2018-03-01
US20160002494A1 (en) 2016-01-07
JP2014164177A (en) 2014-09-08
CN104995564B (en) 2019-12-10
SG11201505632YA (en) 2015-08-28
KR20150125694A (en) 2015-11-09
CN104995564A (en) 2015-10-21
KR101900660B1 (en) 2018-09-21
WO2014132992A1 (en) 2014-09-04
US9921481B2 (en) 2018-03-20

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