SG10201706696VA - Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules - Google Patents

Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules

Info

Publication number
SG10201706696VA
SG10201706696VA SG10201706696VA SG10201706696VA SG10201706696VA SG 10201706696V A SG10201706696V A SG 10201706696VA SG 10201706696V A SG10201706696V A SG 10201706696VA SG 10201706696V A SG10201706696V A SG 10201706696VA SG 10201706696V A SG10201706696V A SG 10201706696VA
Authority
SG
Singapore
Prior art keywords
modules
shielding
fabrication methods
optoelectronic
stray light
Prior art date
Application number
SG10201706696VA
Other languages
English (en)
Inventor
Hartmut Rudmann
Simon Gubser
Susanne Westenhofer
Stephan Heimgartner
Jens Geiger
Sonja Hanselmann
Christoph Friese
Xu Yi
Thng Chong Kim
John A Vidallon
Ji Wang
Qi Chuan Yu
Kam Wah Leong
Original Assignee
Heptagon Micro Optics Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heptagon Micro Optics Pte Ltd filed Critical Heptagon Micro Optics Pte Ltd
Publication of SG10201706696VA publication Critical patent/SG10201706696VA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00278—Lenticular sheets
    • B29D11/00307—Producing lens wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14687—Wafer level processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
SG10201706696VA 2013-07-30 2014-07-25 Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules SG10201706696VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361859828P 2013-07-30 2013-07-30
US201361915193P 2013-12-12 2013-12-12

Publications (1)

Publication Number Publication Date
SG10201706696VA true SG10201706696VA (en) 2017-09-28

Family

ID=52426849

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201706696VA SG10201706696VA (en) 2013-07-30 2014-07-25 Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules
SG11201600343TA SG11201600343TA (en) 2013-07-30 2014-07-25 Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201600343TA SG11201600343TA (en) 2013-07-30 2014-07-25 Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules

Country Status (7)

Country Link
US (3) US9543354B2 (ja)
EP (2) EP3028303B1 (ja)
KR (1) KR102280613B1 (ja)
CN (1) CN105474392B (ja)
SG (2) SG10201706696VA (ja)
TW (2) TWI678828B (ja)
WO (1) WO2015016775A1 (ja)

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US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
US10177527B2 (en) 2015-05-28 2019-01-08 Vixar Inc. VCSELS and VCSEL arrays designed for improved performance as illumination sources and sensors
US20170047362A1 (en) * 2015-08-13 2017-02-16 Heptagon Micro Optics Pte. Ltd. Optoelectronic module with customizable spacers
DE102015113438B4 (de) * 2015-08-14 2021-07-01 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Trägersubstrat für ein optoelektronisches Halbleiterbauteil
TWI708316B (zh) * 2015-10-07 2020-10-21 新加坡商海特根微光學公司 模製的電路基板
CN105353567B (zh) * 2015-12-02 2019-01-15 深圳市华星光电技术有限公司 采用无黑色矩阵技术的va型液晶显示面板及其制作方法
US10109753B2 (en) * 2016-02-19 2018-10-23 X-Celeprint Limited Compound micro-transfer-printed optical filter device
CN114137672A (zh) * 2016-04-15 2022-03-04 赫普塔冈微光有限公司 具有对准间隔件的光电子模块和用于组装所述光电子模块的方法
US20180017741A1 (en) * 2016-07-15 2018-01-18 Advanced Semiconductor Engineering, Inc. Semiconductor package device and method of manufacturing the same
WO2018053778A1 (en) 2016-09-23 2018-03-29 Shenzhen Xpectvision Technology Co.,Ltd. Packaging of semiconductor x-ray detectors
US20180315894A1 (en) * 2017-04-26 2018-11-01 Advanced Semiconductor Engineering, Inc. Semiconductor device package and a method of manufacturing the same
US11171249B2 (en) * 2017-07-25 2021-11-09 Ams Sensors Singapore Pte. Ltd. Wafer-level methods for manufacturing uniform layers of material on optoelectronic modules
EP3707750A4 (en) * 2017-11-07 2021-09-01 AMS Sensors Singapore Pte. Ltd. OPTOELECTRONIC MODULES CONTAINING LOCKING ASSEMBLIES AND THEIR MANUFACTURING PROCESSES
US11894658B2 (en) * 2017-11-29 2024-02-06 Vixar, Inc. Power monitoring approach for VCSELS and VCSEL arrays
CN112074760A (zh) * 2017-12-27 2020-12-11 ams传感器新加坡私人有限公司 光电模块及其操作方法
FR3081366B1 (fr) * 2018-05-28 2021-11-05 Beam Dispositif et procede de detection de la position d'un faisceau laser
CN112969572A (zh) * 2018-11-02 2021-06-15 ams传感器新加坡私人有限公司 制造光学元件模块的方法
DE102018129346A1 (de) * 2018-11-21 2020-05-28 Osram Opto Semiconductors Gmbh Halbleiterlaser und herstellungsverfahren für einen halbleiterlaser
WO2020147958A1 (en) * 2019-01-17 2020-07-23 Osram Opto Semiconductors Gmbh Method for obtaining electronic devices and electronic devices
WO2021038707A1 (ja) * 2019-08-27 2021-03-04 三菱電機株式会社 光センサモジュールおよび光センサモジュールの製造方法
US11244996B2 (en) 2020-04-27 2022-02-08 Facebook Technologies, Llc Micro OLEDs having narrow bezel

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Also Published As

Publication number Publication date
US9859327B2 (en) 2018-01-02
US20180102394A1 (en) 2018-04-12
US20170084663A1 (en) 2017-03-23
TWI678828B (zh) 2019-12-01
TWI638470B (zh) 2018-10-11
US9543354B2 (en) 2017-01-10
WO2015016775A1 (en) 2015-02-05
US10199426B2 (en) 2019-02-05
TW201841409A (zh) 2018-11-16
SG11201600343TA (en) 2016-02-26
KR20160039645A (ko) 2016-04-11
EP3028303A4 (en) 2017-03-08
CN105474392B (zh) 2021-06-25
TW201519479A (zh) 2015-05-16
US20150034975A1 (en) 2015-02-05
EP3028303A1 (en) 2016-06-08
EP3028303B1 (en) 2018-08-22
CN105474392A (zh) 2016-04-06
EP3454371A1 (en) 2019-03-13
KR102280613B1 (ko) 2021-07-22
EP3454371B1 (en) 2021-03-31

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