SG10201610943TA - Use of vacuum chucks to hold a wafer or wafer sub-stack - Google Patents
Use of vacuum chucks to hold a wafer or wafer sub-stackInfo
- Publication number
- SG10201610943TA SG10201610943TA SG10201610943TA SG10201610943TA SG10201610943TA SG 10201610943T A SG10201610943T A SG 10201610943TA SG 10201610943T A SG10201610943T A SG 10201610943TA SG 10201610943T A SG10201610943T A SG 10201610943TA SG 10201610943T A SG10201610943T A SG 10201610943TA
- Authority
- SG
- Singapore
- Prior art keywords
- wafer
- stack
- hold
- vacuum chucks
- sub
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1858—Handling of layers or the laminate using vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2551/00—Optical elements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Bakery Products And Manufacturing Methods Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261667659P | 2012-07-03 | 2012-07-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201610943TA true SG10201610943TA (en) | 2017-02-27 |
Family
ID=49882364
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201610943TA SG10201610943TA (en) | 2012-07-03 | 2013-06-28 | Use of vacuum chucks to hold a wafer or wafer sub-stack |
SG10201800482RA SG10201800482RA (en) | 2012-07-03 | 2013-06-28 | Use of vacuum chucks to hold a wafer or wafer sub-stack |
SG11201408451WA SG11201408451WA (en) | 2012-07-03 | 2013-06-28 | Use of vacuum chucks to hold a wafer or wafer sub-stack |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201800482RA SG10201800482RA (en) | 2012-07-03 | 2013-06-28 | Use of vacuum chucks to hold a wafer or wafer sub-stack |
SG11201408451WA SG11201408451WA (en) | 2012-07-03 | 2013-06-28 | Use of vacuum chucks to hold a wafer or wafer sub-stack |
Country Status (5)
Country | Link |
---|---|
US (2) | US9793152B2 (en) |
CN (1) | CN104471695B (en) |
SG (3) | SG10201610943TA (en) |
TW (1) | TWI591753B (en) |
WO (1) | WO2014007758A1 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10014228B2 (en) * | 2014-11-24 | 2018-07-03 | Rudolph Technologies, Inc. | Method and apparatus to assist the processing of deformed substrates |
US10886420B2 (en) * | 2016-04-08 | 2021-01-05 | Ams Sensors Singapore Pte. Ltd. | Thin optoelectronic modules with apertures and their manufacture |
JP6510461B2 (en) * | 2016-05-25 | 2019-05-08 | 日本特殊陶業株式会社 | Substrate holding device |
CN106129028B (en) * | 2016-07-13 | 2018-10-19 | 京东方科技集团股份有限公司 | A kind of diode displaying array and preparation method thereof, wearable device |
CN108074848B (en) * | 2016-11-10 | 2020-07-03 | 致茂电子(苏州)有限公司 | Gasket, wafer stacking structure, adsorption type moving device and wafer moving method |
TWI628134B (en) * | 2017-02-18 | 2018-07-01 | 捷惠自動機械有限公司 | Plate and spacer moving stacking method and structure thereof |
US10879102B2 (en) * | 2017-08-07 | 2020-12-29 | Boston Process Technologies, Inc | Flux-free solder ball mount arrangement |
US10254214B1 (en) | 2018-02-20 | 2019-04-09 | Nanotronics Imaging, Inc. | Systems, devices, and methods for combined wafer and photomask inspection |
US20220045247A1 (en) * | 2018-12-20 | 2022-02-10 | Ams Sensors Singapore Pte. Ltd. | Optoelectronic modules including an optical emitter and optical receiver |
EP3924999A4 (en) | 2019-02-15 | 2022-11-02 | Kulicke & Soffa Netherlands B.V. | Dynamic release tapes for assembly of discrete components |
EP4078662A4 (en) * | 2019-12-17 | 2024-05-29 | Kulicke & Soffa Netherlands B V | Adhesive tapes for receiving discrete components |
CN111085954A (en) * | 2019-12-24 | 2020-05-01 | 深圳市华星光电半导体显示技术有限公司 | Substrate adsorption device |
US11794314B2 (en) | 2021-08-30 | 2023-10-24 | Kla Corporation | Quick swap chuck with vacuum holding interchangeable top plate |
CN113715466B (en) * | 2021-08-31 | 2023-06-06 | 艾尔玛科技股份有限公司 | Manufacturing device and process of nano texture transfer printing decoration panel |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07169660A (en) * | 1993-09-09 | 1995-07-04 | Xerox Corp | Equipment and method for joining wafer pair |
US6164633A (en) | 1999-05-18 | 2000-12-26 | International Business Machines Corporation | Multiple size wafer vacuum chuck |
JP2006054286A (en) * | 2004-08-11 | 2006-02-23 | Seiko Epson Corp | Vacuum chuck jig, vacuum chuck method, and manufacturing method of liquid-droplet discharging head |
US20070216049A1 (en) | 2006-03-20 | 2007-09-20 | Heptagon Oy | Method and tool for manufacturing optical elements |
TW200937642A (en) * | 2007-12-19 | 2009-09-01 | Heptagon Oy | Wafer stack, integrated optical device and method for fabricating the same |
JP2011516658A (en) | 2008-03-31 | 2011-05-26 | ヘンケル コーポレイション | Multilayer UV curable adhesive film |
CN102209622B (en) | 2008-09-18 | 2014-05-28 | 数字光学东方公司 | Recessed optical surfaces |
US9159595B2 (en) | 2010-02-09 | 2015-10-13 | Suss Microtec Lithography Gmbh | Thin wafer carrier |
-
2013
- 2013-06-28 SG SG10201610943TA patent/SG10201610943TA/en unknown
- 2013-06-28 SG SG10201800482RA patent/SG10201800482RA/en unknown
- 2013-06-28 CN CN201380035447.6A patent/CN104471695B/en active Active
- 2013-06-28 WO PCT/SG2013/000269 patent/WO2014007758A1/en active Application Filing
- 2013-06-28 US US14/408,890 patent/US9793152B2/en active Active
- 2013-06-28 SG SG11201408451WA patent/SG11201408451WA/en unknown
- 2013-07-02 TW TW102123684A patent/TWI591753B/en active
-
2017
- 2017-09-08 US US15/698,991 patent/US9899251B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2014007758A1 (en) | 2014-01-09 |
US9899251B2 (en) | 2018-02-20 |
SG10201800482RA (en) | 2018-03-28 |
US20150340265A1 (en) | 2015-11-26 |
CN104471695B (en) | 2017-09-19 |
SG11201408451WA (en) | 2015-01-29 |
US20180005864A1 (en) | 2018-01-04 |
CN104471695A (en) | 2015-03-25 |
US9793152B2 (en) | 2017-10-17 |
TWI591753B (en) | 2017-07-11 |
TW201409606A (en) | 2014-03-01 |
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