SG11201401972WA - Solar wafer electrostatic chuck - Google Patents
Solar wafer electrostatic chuckInfo
- Publication number
- SG11201401972WA SG11201401972WA SG11201401972WA SG11201401972WA SG11201401972WA SG 11201401972W A SG11201401972W A SG 11201401972WA SG 11201401972W A SG11201401972W A SG 11201401972WA SG 11201401972W A SG11201401972W A SG 11201401972WA SG 11201401972W A SG11201401972W A SG 11201401972WA
- Authority
- SG
- Singapore
- Prior art keywords
- electrostatic chuck
- solar wafer
- wafer electrostatic
- solar
- chuck
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/16—Vessels
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161554457P | 2011-11-01 | 2011-11-01 | |
| PCT/US2012/063114 WO2013067218A1 (en) | 2011-11-01 | 2012-11-01 | Solar wafer electrostatic chuck |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201401972WA true SG11201401972WA (en) | 2014-09-26 |
Family
ID=48171199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201401972WA SG11201401972WA (en) | 2011-11-01 | 2012-11-01 | Solar wafer electrostatic chuck |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20130105087A1 (en) |
| JP (1) | JP2014532994A (en) |
| CN (1) | CN104221272A (en) |
| SG (1) | SG11201401972WA (en) |
| TW (1) | TW201334213A (en) |
| WO (1) | WO2013067218A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014039655A1 (en) * | 2012-09-07 | 2014-03-13 | Applied Materials, Inc. | Portable electrostatic chuck carrier for thin substrates |
| JP6425184B2 (en) * | 2012-11-22 | 2018-11-21 | 株式会社クリエイティブテクノロジー | Power supply system |
| US20170335459A1 (en) * | 2016-05-17 | 2017-11-23 | Applied Materials, Inc. | Non-shadow frame plasma processing chamber |
| US10770270B2 (en) | 2016-06-07 | 2020-09-08 | Applied Materials, Inc. | High power electrostatic chuck with aperture-reducing plug in a gas hole |
| US10138546B2 (en) * | 2016-08-10 | 2018-11-27 | Corning Incorporated | Apparatus and method to coat glass substrates with electrostatic chuck and van der waals forces |
| US10854772B2 (en) * | 2017-07-19 | 2020-12-01 | Intevac, Inc. | Multi-piece substrate holder and alignment mechanism |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5055964A (en) * | 1990-09-07 | 1991-10-08 | International Business Machines Corporation | Electrostatic chuck having tapered electrodes |
| US5463525A (en) * | 1993-12-20 | 1995-10-31 | International Business Machines Corporation | Guard ring electrostatic chuck |
| US5452510A (en) * | 1993-12-20 | 1995-09-26 | International Business Machines Corporation | Method of making an electrostatic chuck with oxide insulator |
| US5535090A (en) * | 1994-03-03 | 1996-07-09 | Sherman; Arthur | Electrostatic chuck |
| US5886863A (en) * | 1995-05-09 | 1999-03-23 | Kyocera Corporation | Wafer support member |
| US6529362B2 (en) * | 1997-03-06 | 2003-03-04 | Applied Materials Inc. | Monocrystalline ceramic electrostatic chuck |
| US5905626A (en) * | 1998-04-12 | 1999-05-18 | Dorsey Gage, Inc. | Electrostatic chuck with ceramic pole protection |
| US6259592B1 (en) * | 1998-11-19 | 2001-07-10 | Applied Materials, Inc. | Apparatus for retaining a workpiece upon a workpiece support and method of manufacturing same |
| JP4402862B2 (en) * | 1999-07-08 | 2010-01-20 | ラム リサーチ コーポレーション | Electrostatic chuck and manufacturing method thereof |
| US6673636B2 (en) * | 2001-05-18 | 2004-01-06 | Applied Materails Inc. | Method of real-time plasma charging voltage measurement on powered electrode with electrostatic chuck in plasma process chambers |
| US20050163598A1 (en) * | 2002-02-27 | 2005-07-28 | Tokyou Electron Limited | Method for carrying substrate |
| JP2007134575A (en) * | 2005-11-11 | 2007-05-31 | Canon Inc | Reticle cassette and exposure device using it |
| JP5063520B2 (en) * | 2008-08-01 | 2012-10-31 | 東京エレクトロン株式会社 | Plasma processing method and plasma processing apparatus |
-
2012
- 2012-10-31 TW TW101140300A patent/TW201334213A/en unknown
- 2012-11-01 JP JP2014540097A patent/JP2014532994A/en active Pending
- 2012-11-01 US US13/666,917 patent/US20130105087A1/en not_active Abandoned
- 2012-11-01 WO PCT/US2012/063114 patent/WO2013067218A1/en active Application Filing
- 2012-11-01 SG SG11201401972WA patent/SG11201401972WA/en unknown
- 2012-11-01 CN CN201280059895.5A patent/CN104221272A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013067218A1 (en) | 2013-05-10 |
| TW201334213A (en) | 2013-08-16 |
| JP2014532994A (en) | 2014-12-08 |
| US20130105087A1 (en) | 2013-05-02 |
| CN104221272A (en) | 2014-12-17 |
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