SG10201608348SA - Method For Impedance Matching Of Plasma Processing Apparatus - Google Patents
Method For Impedance Matching Of Plasma Processing ApparatusInfo
- Publication number
- SG10201608348SA SG10201608348SA SG10201608348SA SG10201608348SA SG10201608348SA SG 10201608348S A SG10201608348S A SG 10201608348SA SG 10201608348S A SG10201608348S A SG 10201608348SA SG 10201608348S A SG10201608348S A SG 10201608348SA SG 10201608348S A SG10201608348S A SG 10201608348SA
- Authority
- SG
- Singapore
- Prior art keywords
- processing apparatus
- plasma processing
- impedance matching
- impedance
- matching
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
- H01J37/32183—Matching circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
- H01J37/32155—Frequency modulation
- H01J37/32165—Plural frequencies
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/38—Impedance-matching networks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H2242/00—Auxiliary systems
- H05H2242/20—Power circuits
- H05H2242/26—Matching networks
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015198314A JP6541540B2 (en) | 2015-10-06 | 2015-10-06 | Method for impedance matching of plasma processing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201608348SA true SG10201608348SA (en) | 2017-05-30 |
Family
ID=58448180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201608348SA SG10201608348SA (en) | 2015-10-06 | 2016-10-05 | Method For Impedance Matching Of Plasma Processing Apparatus |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9736921B2 (en) |
| JP (1) | JP6541540B2 (en) |
| KR (1) | KR20170041142A (en) |
| CN (1) | CN106941067B (en) |
| SG (1) | SG10201608348SA (en) |
| TW (1) | TWI711083B (en) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11615941B2 (en) | 2009-05-01 | 2023-03-28 | Advanced Energy Industries, Inc. | System, method, and apparatus for controlling ion energy distribution in plasma processing systems |
| US9685297B2 (en) | 2012-08-28 | 2017-06-20 | Advanced Energy Industries, Inc. | Systems and methods for monitoring faults, anomalies, and other characteristics of a switched mode ion energy distribution system |
| JP7209483B2 (en) * | 2017-10-10 | 2023-01-20 | 東京エレクトロン株式会社 | Plasma processing equipment and measurement circuit |
| US10903049B2 (en) | 2017-10-10 | 2021-01-26 | Tokyo Electron Limited | Plasma processing apparatus and measurement circuit |
| US11437221B2 (en) | 2017-11-17 | 2022-09-06 | Advanced Energy Industries, Inc. | Spatial monitoring and control of plasma processing environments |
| TWI767088B (en) * | 2017-11-17 | 2022-06-11 | 新加坡商Ａｅｓ全球公司 | Plasma processing system, control method for modulating supplies therein and related plasma processing control system |
| TW202329762A (en) | 2017-11-17 | 2023-07-16 | 新加坡商Aes 全球公司 | Systems and methods for spatially and temporally controlling plasma processing on substrates and related computer-readable medium |
| EP3711080B1 (en) | 2017-11-17 | 2023-06-21 | AES Global Holdings, Pte. Ltd. | Synchronized pulsing of plasma processing source and substrate bias |
| US10269540B1 (en) * | 2018-01-25 | 2019-04-23 | Advanced Energy Industries, Inc. | Impedance matching system and method of operating the same |
| JP2019186098A (en) * | 2018-04-12 | 2019-10-24 | 東京エレクトロン株式会社 | Method of generating plasma |
| CN110504149B (en) * | 2018-05-17 | 2022-04-22 | 北京北方华创微电子装备有限公司 | Pulse modulation system and method of radio frequency power supply |
| DE102018116637A1 (en) * | 2018-07-10 | 2020-01-16 | TRUMPF Hüttinger GmbH + Co. KG | Power supply facility and operating procedures therefor |
| JP7154119B2 (en) | 2018-12-06 | 2022-10-17 | 東京エレクトロン株式会社 | Control method and plasma processing apparatus |
| CN111293022B (en) * | 2018-12-07 | 2023-01-24 | 中微半导体设备(上海)股份有限公司 | Impedance matching method and device for pulsed radio frequency plasma |
| JP2022541004A (en) | 2019-07-12 | 2022-09-21 | エーイーエス グローバル ホールディングス， プライベート リミテッド | Bias supply device with single controlled switch |
| US11315757B2 (en) * | 2019-08-13 | 2022-04-26 | Mks Instruments, Inc. | Method and apparatus to enhance sheath formation, evolution and pulse to pulse stability in RF powered plasma applications |
| JP2021108413A (en) | 2019-12-27 | 2021-07-29 | 株式会社ダイヘン | Impedance adjustment device and impedance adjustment method |
| JP7466377B2 (en) * | 2020-05-21 | 2024-04-12 | 東京エレクトロン株式会社 | Substrate Processing Equipment |
| JP7479255B2 (en) * | 2020-09-14 | 2024-05-08 | 東京エレクトロン株式会社 | Plasma Processing Equipment |
| JP7479256B2 (en) * | 2020-09-15 | 2024-05-08 | 東京エレクトロン株式会社 | Plasma Processing Equipment |
| US11670487B1 (en) | 2022-01-26 | 2023-06-06 | Advanced Energy Industries, Inc. | Bias supply control and data processing |
| US11942309B2 (en) | 2022-01-26 | 2024-03-26 | Advanced Energy Industries, Inc. | Bias supply with resonant switching |
| US11978613B2 (en) | 2022-09-01 | 2024-05-07 | Advanced Energy Industries, Inc. | Transition control in a bias supply |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03122618A (en) | 1989-10-05 | 1991-05-24 | Nec Corp | Thin film two-terminal type active matrix liquid crystal display device |
| JP3122618B2 (en) * | 1996-08-23 | 2001-01-09 | 東京エレクトロン株式会社 | Plasma processing equipment |
| JP4286404B2 (en) * | 1999-10-15 | 2009-07-01 | 東京エレクトロン株式会社 | Matching device and plasma processing apparatus |
| US7794615B2 (en) * | 2005-03-31 | 2010-09-14 | Tokyo Electron Limited | Plasma processing method and apparatus, and autorunning program for variable matching unit |
| JP4887197B2 (en) * | 2006-12-29 | 2012-02-29 | 株式会社ダイヘン | High frequency equipment |
| JP5484375B2 (en) * | 2011-02-17 | 2014-05-07 | 三菱電機株式会社 | Plasma film forming apparatus and plasma film forming method |
| JP5867701B2 (en) * | 2011-12-15 | 2016-02-24 | 東京エレクトロン株式会社 | Plasma processing equipment |
| JP5808012B2 (en) * | 2011-12-27 | 2015-11-10 | 東京エレクトロン株式会社 | Plasma processing equipment |
| US9197196B2 (en) * | 2012-02-22 | 2015-11-24 | Lam Research Corporation | State-based adjustment of power and frequency |
| JP2013250231A (en) * | 2012-06-04 | 2013-12-12 | Daihen Corp | Phase difference detection device, phase difference detection program, and plasma processing system using phase difference detection device |
| JP6144917B2 (en) * | 2013-01-17 | 2017-06-07 | 東京エレクトロン株式会社 | Plasma processing apparatus and method of operating plasma processing apparatus |
| KR20150087702A (en) * | 2014-01-22 | 2015-07-30 | 삼성전자주식회사 | Plasma generating apparatus |
-
2015
- 2015-10-06 JP JP2015198314A patent/JP6541540B2/en active Active
-
2016
- 2016-09-30 CN CN201610873947.2A patent/CN106941067B/en active Active
- 2016-10-03 TW TW105131831A patent/TWI711083B/en active
- 2016-10-04 KR KR1020160127704A patent/KR20170041142A/en not_active Application Discontinuation
- 2016-10-04 US US15/284,681 patent/US9736921B2/en active Active
- 2016-10-05 SG SG10201608348SA patent/SG10201608348SA/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW201719751A (en) | 2017-06-01 |
| US20170099723A1 (en) | 2017-04-06 |
| CN106941067A (en) | 2017-07-11 |
| JP6541540B2 (en) | 2019-07-10 |
| KR20170041142A (en) | 2017-04-14 |
| TWI711083B (en) | 2020-11-21 |
| US9736921B2 (en) | 2017-08-15 |
| JP2017073247A (en) | 2017-04-13 |
| CN106941067B (en) | 2019-01-15 |
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