SG10201506817WA - Thin 3d fan-out embedded wafer level package (ewlb) for application processor and memory integration - Google Patents

Thin 3d fan-out embedded wafer level package (ewlb) for application processor and memory integration

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Publication number
SG10201506817WA
SG10201506817WA SG10201506817WA SG10201506817WA SG10201506817WA SG 10201506817W A SG10201506817W A SG 10201506817WA SG 10201506817W A SG10201506817W A SG 10201506817WA SG 10201506817W A SG10201506817W A SG 10201506817WA SG 10201506817W A SG10201506817W A SG 10201506817WA
Authority
SG
Singapore
Prior art keywords
ewlb
fan
thin
application processor
wafer level
Prior art date
Application number
SG10201506817WA
Inventor
Rajendra D Pendse
Original Assignee
Stats Chippac Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stats Chippac Ltd filed Critical Stats Chippac Ltd
Publication of SG10201506817WA publication Critical patent/SG10201506817WA/en

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SG10201506817WA 2012-03-08 2013-02-25 Thin 3d fan-out embedded wafer level package (ewlb) for application processor and memory integration SG10201506817WA (en)

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