SG10201506082UA - Substrate edge tuning with retaining ring - Google Patents

Substrate edge tuning with retaining ring

Info

Publication number
SG10201506082UA
SG10201506082UA SG10201506082UA SG10201506082UA SG10201506082UA SG 10201506082U A SG10201506082U A SG 10201506082UA SG 10201506082U A SG10201506082U A SG 10201506082UA SG 10201506082U A SG10201506082U A SG 10201506082UA SG 10201506082U A SG10201506082U A SG 10201506082UA
Authority
SG
Singapore
Prior art keywords
retaining ring
substrate edge
edge tuning
tuning
substrate
Prior art date
Application number
SG10201506082UA
Other languages
English (en)
Inventor
Hung Chih Chen
Samuel Chu-Chiang Hsu
Yin Yuan
Huanbo Zhang
Gautam Shashank Dandavate
Mario David Silvetti
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG10201506082UA publication Critical patent/SG10201506082UA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG10201506082UA 2010-08-06 2011-08-05 Substrate edge tuning with retaining ring SG10201506082UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US37164410P 2010-08-06 2010-08-06
US201161479271P 2011-04-26 2011-04-26

Publications (1)

Publication Number Publication Date
SG10201506082UA true SG10201506082UA (en) 2015-09-29

Family

ID=45556486

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201506082UA SG10201506082UA (en) 2010-08-06 2011-08-05 Substrate edge tuning with retaining ring
SG2013009766A SG187782A1 (en) 2010-08-06 2011-08-05 Substrate edge tuning with retaining ring

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG2013009766A SG187782A1 (en) 2010-08-06 2011-08-05 Substrate edge tuning with retaining ring

Country Status (8)

Country Link
US (5) US8721391B2 (ja)
EP (2) EP2601677B1 (ja)
JP (2) JP6073222B2 (ja)
KR (3) KR101882708B1 (ja)
CN (2) CN103252715B (ja)
SG (2) SG10201506082UA (ja)
TW (2) TWI574785B (ja)
WO (1) WO2012019144A2 (ja)

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US20130102152A1 (en) * 2011-10-20 2013-04-25 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
JP5976522B2 (ja) 2012-05-31 2016-08-23 株式会社荏原製作所 研磨装置および研磨方法
US10702972B2 (en) 2012-05-31 2020-07-07 Ebara Corporation Polishing apparatus
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WO2014163735A1 (en) * 2013-03-13 2014-10-09 Applied Materials, Inc. Reinforcement ring for carrier head
JP6403981B2 (ja) * 2013-11-13 2018-10-10 株式会社荏原製作所 基板保持装置、研磨装置、研磨方法、およびリテーナリング
KR102173323B1 (ko) * 2014-06-23 2020-11-04 삼성전자주식회사 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법
JP2016155188A (ja) * 2015-02-24 2016-09-01 株式会社荏原製作所 リテーナリング、基板保持装置、研磨装置およびリテーナリングのメンテナンス方法
US9488218B2 (en) 2015-03-30 2016-11-08 Honeywell International Inc. Pilot ring with controlled axial roll
JP6392193B2 (ja) * 2015-10-14 2018-09-19 株式会社荏原製作所 基板保持装置および基板研磨装置ならびに基板保持装置の製造方法
US10029346B2 (en) * 2015-10-16 2018-07-24 Applied Materials, Inc. External clamp ring for a chemical mechanical polishing carrier head
US10160091B2 (en) 2015-11-16 2018-12-25 Taiwan Semiconductor Manufacturing Company, Ltd. CMP polishing head design for improving removal rate uniformity
CN108885984B (zh) * 2016-04-01 2024-03-08 姜準模 形成有基板容纳部件的化学机械研磨装置用载体头
JP7021863B2 (ja) * 2017-03-30 2022-02-17 富士紡ホールディングス株式会社 保持具
CN109551365B (zh) * 2019-01-15 2023-12-08 合肥哈工普利世智能装备有限公司 等离子抛光夹持组件、等离子抛光机及其抛光方法
WO2020176385A1 (en) * 2019-02-28 2020-09-03 Applied Materials, Inc. Retainer for chemical mechanical polishing carrier head
US11325223B2 (en) 2019-08-23 2022-05-10 Applied Materials, Inc. Carrier head with segmented substrate chuck
US11511390B2 (en) 2019-08-30 2022-11-29 Applied Materials, Inc. Pivotable substrate retaining ring
US11780049B2 (en) 2020-06-29 2023-10-10 Applied Materials, Inc. Polishing carrier head with multiple angular pressurizable zones
US20220055181A1 (en) * 2020-08-21 2022-02-24 Applied Materials, Inc. Retaining ring design
US11440159B2 (en) * 2020-09-28 2022-09-13 Applied Materials, Inc. Edge load ring
US11623321B2 (en) * 2020-10-14 2023-04-11 Applied Materials, Inc. Polishing head retaining ring tilting moment control
JP2022074321A (ja) * 2020-11-04 2022-05-18 株式会社荏原製作所 研磨ヘッドおよび研磨装置
US11660721B2 (en) 2021-02-18 2023-05-30 Applied Materials, Inc. Dual loading retaining ring
KR102556166B1 (ko) 2022-01-28 2023-07-19 지앤에스건설 주식회사 플로팅 인테리어 계단 시공방법 및 그 방법으로 시공된 플로팅 인테리어 계단
US20230356354A1 (en) * 2022-05-03 2023-11-09 Applied Materials, Inc. Compliant inner ring for a chemical mechanical polishing system
US20230381915A1 (en) * 2022-05-27 2023-11-30 Applied Materials, Inc. Operation of clamping retainer for chemical mechanical polishing
KR102630907B1 (ko) 2022-08-24 2024-01-30 임형남 이중나선계단 다가구주택

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US7727055B2 (en) * 2006-11-22 2010-06-01 Applied Materials, Inc. Flexible membrane for carrier head
US7654888B2 (en) * 2006-11-22 2010-02-02 Applied Materials, Inc. Carrier head with retaining ring and carrier ring
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US20130102152A1 (en) * 2011-10-20 2013-04-25 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

Also Published As

Publication number Publication date
CN103098182A (zh) 2013-05-08
EP2601677B1 (en) 2018-07-04
WO2012019144A2 (en) 2012-02-09
KR20130093111A (ko) 2013-08-21
US10022837B2 (en) 2018-07-17
KR20130093618A (ko) 2013-08-22
US20130149942A1 (en) 2013-06-13
EP2601677A2 (en) 2013-06-12
US8721391B2 (en) 2014-05-13
TW201323153A (zh) 2013-06-16
TWI540021B (zh) 2016-07-01
TWI574785B (zh) 2017-03-21
KR101814185B1 (ko) 2018-01-02
WO2012019144A3 (en) 2012-06-07
EP3406402B1 (en) 2021-06-30
CN103098182B (zh) 2016-11-02
EP2601677A4 (en) 2015-05-27
TW201221294A (en) 2012-06-01
JP5924739B2 (ja) 2016-05-25
US20160082571A1 (en) 2016-03-24
KR101882708B1 (ko) 2018-07-27
KR101701870B1 (ko) 2017-02-02
CN103252715A (zh) 2013-08-21
US11173579B2 (en) 2021-11-16
US8840446B2 (en) 2014-09-23
US20120034849A1 (en) 2012-02-09
JP6073222B2 (ja) 2017-02-01
CN103252715B (zh) 2016-06-22
JP2013243373A (ja) 2013-12-05
SG187782A1 (en) 2013-03-28
US20120034848A1 (en) 2012-02-09
JP2013536578A (ja) 2013-09-19
US20180304441A1 (en) 2018-10-25
EP3406402A1 (en) 2018-11-28
KR20180004298A (ko) 2018-01-10

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