SG10201505770SA - Laser beam spot shape detection method - Google Patents
Laser beam spot shape detection methodInfo
- Publication number
- SG10201505770SA SG10201505770SA SG10201505770SA SG10201505770SA SG10201505770SA SG 10201505770S A SG10201505770S A SG 10201505770SA SG 10201505770S A SG10201505770S A SG 10201505770SA SG 10201505770S A SG10201505770S A SG 10201505770SA SG 10201505770S A SG10201505770S A SG 10201505770SA
- Authority
- SG
- Singapore
- Prior art keywords
- laser beam
- detection method
- beam spot
- shape detection
- spot shape
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/705—Beam measuring device
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014166050A JP6328521B2 (en) | 2014-08-18 | 2014-08-18 | Laser beam spot shape detection method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201505770SA true SG10201505770SA (en) | 2016-03-30 |
Family
ID=55301468
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201505770SA SG10201505770SA (en) | 2014-08-18 | 2015-07-24 | Laser beam spot shape detection method |
Country Status (7)
Country | Link |
---|---|
US (1) | US9789567B2 (en) |
JP (1) | JP6328521B2 (en) |
KR (1) | KR102178210B1 (en) |
CN (1) | CN105364302B (en) |
MY (1) | MY177490A (en) |
SG (1) | SG10201505770SA (en) |
TW (1) | TWI643691B (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6814588B2 (en) * | 2016-10-04 | 2021-01-20 | 株式会社ディスコ | Spot shape detection method for pulsed laser beam |
JP6799470B2 (en) * | 2017-01-24 | 2020-12-16 | 株式会社ディスコ | Spot shape detector |
JP6882045B2 (en) * | 2017-04-13 | 2021-06-02 | 株式会社ディスコ | Focus point position detection method |
JP6955932B2 (en) | 2017-08-25 | 2021-10-27 | 株式会社ディスコ | Laser beam profiler unit and laser processing equipment |
EP3450936A1 (en) | 2017-09-05 | 2019-03-06 | Renishaw PLC | Optical apparatus and method for assessing the beam profile of a non-contact tool setting apparatus |
CN109822231A (en) * | 2019-02-15 | 2019-05-31 | 英特尔产品(成都)有限公司 | Method and apparatus of the detection for the quality of the laser beam of Wafer Dicing |
CN112276344B (en) * | 2019-07-09 | 2022-11-22 | 大族激光科技产业集团股份有限公司 | Focus positioning method for ultrafast laser cutting of transparent material |
JP7386672B2 (en) | 2019-11-15 | 2023-11-27 | 株式会社ディスコ | Laser processing equipment and phase pattern adjustment method |
JP7336977B2 (en) | 2019-12-11 | 2023-09-01 | 株式会社ディスコ | Laser beam spot shape correction method |
CN113634877A (en) * | 2020-04-27 | 2021-11-12 | 大族激光科技产业集团股份有限公司 | Laser processing device and method |
CN112025088B (en) * | 2020-08-06 | 2022-04-15 | 武汉华工激光工程有限责任公司 | Laser beam astigmatism compensation method and laser processing system |
JP2022077223A (en) * | 2020-11-11 | 2022-05-23 | 株式会社ディスコ | Laser beam machining apparatus |
CN112834027B (en) * | 2020-12-30 | 2023-08-11 | 中国科学院微电子研究所 | Beam detection device and method of laser annealing equipment |
CN112859394A (en) * | 2020-12-31 | 2021-05-28 | 苏州科韵激光科技有限公司 | Laser processing light path system |
TWI777345B (en) * | 2020-12-31 | 2022-09-11 | 致茂電子股份有限公司 | Device for measuring optoelectronic units |
CN116765643B (en) * | 2023-07-10 | 2024-03-12 | 普希斯(广州)科技股份有限公司 | Light beam adjustment and light signal processing method and device based on welding detection light path |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06218570A (en) * | 1993-01-28 | 1994-08-09 | Hitachi Ltd | Laser beam machine |
US5951891A (en) * | 1997-03-24 | 1999-09-14 | International Business Machines Corporation | Optical apparatus for monitoring profiles of textured spots during a disk texturing process |
JP4733934B2 (en) | 2004-06-22 | 2011-07-27 | 株式会社ディスコ | Wafer processing method |
JP4684717B2 (en) | 2005-04-06 | 2011-05-18 | 株式会社ディスコ | Wafer laser processing method and laser processing apparatus |
JP2008170366A (en) * | 2007-01-15 | 2008-07-24 | Disco Abrasive Syst Ltd | Device of measuring workpiece held by chuck table, and laser beam processing machine |
CN101513692B (en) * | 2008-02-21 | 2011-09-07 | 富士迈半导体精密工业(上海)有限公司 | Method for cutting brittle materials by laser and device |
JP5117920B2 (en) * | 2008-04-28 | 2013-01-16 | 株式会社ディスコ | Laser processing equipment |
CN102165562B (en) * | 2008-09-29 | 2013-09-04 | 日立电脑机器株式会社 | Semiconductor manufacturing apparatus |
CN102141373B (en) * | 2010-12-15 | 2013-04-10 | 中国科学院等离子体物理研究所 | Light spot center real-time detection system and detection method |
JP5813959B2 (en) * | 2011-02-07 | 2015-11-17 | 株式会社ディスコ | Laser beam irradiation mechanism and laser processing apparatus |
CN202119410U (en) * | 2011-06-16 | 2012-01-18 | 中国科学技术大学 | Laser multi freedom simultaneous measuring device |
JP5797963B2 (en) | 2011-07-25 | 2015-10-21 | 株式会社ディスコ | Laser beam spot shape detection method |
JP5902490B2 (en) * | 2012-01-25 | 2016-04-13 | 株式会社ディスコ | Laser beam spot shape detection method and spot shape detection device |
-
2014
- 2014-08-18 JP JP2014166050A patent/JP6328521B2/en active Active
-
2015
- 2015-06-25 TW TW104120541A patent/TWI643691B/en active
- 2015-07-24 MY MYPI2015702433A patent/MY177490A/en unknown
- 2015-07-24 SG SG10201505770SA patent/SG10201505770SA/en unknown
- 2015-07-28 KR KR1020150106538A patent/KR102178210B1/en active IP Right Grant
- 2015-08-11 US US14/823,589 patent/US9789567B2/en active Active
- 2015-08-12 CN CN201510494227.0A patent/CN105364302B/en active Active
Also Published As
Publication number | Publication date |
---|---|
US9789567B2 (en) | 2017-10-17 |
KR102178210B1 (en) | 2020-11-12 |
CN105364302B (en) | 2018-10-12 |
CN105364302A (en) | 2016-03-02 |
MY177490A (en) | 2020-09-16 |
TWI643691B (en) | 2018-12-11 |
KR20160021714A (en) | 2016-02-26 |
US20160045980A1 (en) | 2016-02-18 |
JP6328521B2 (en) | 2018-05-23 |
JP2016041437A (en) | 2016-03-31 |
TW201607658A (en) | 2016-03-01 |
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