CN109822231A - Method and apparatus of the detection for the quality of the laser beam of Wafer Dicing - Google Patents
Method and apparatus of the detection for the quality of the laser beam of Wafer Dicing Download PDFInfo
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Abstract
Method and apparatus the present disclosure describes detection for the quality of the laser beam of Wafer Dicing.According to one aspect of the disclosure, a kind of method of the quality of laser beam of detection for Wafer Dicing includes: to pre-process to the collected image for being radiated at the spot shape formed on wafer comprising the laser beam；The spot shape in pretreated image is detected, attribute information associated with the spot shape is obtained；And it is based on attribute information associated with the spot shape obtained, judge whether the spot shape meets predefined standard.
Description
Technical field
The disclosure relates generally to semiconductor fabrication process, and the laser light of Wafer Dicing is used for more particularly, to detection
The method and apparatus of the quality of beam.
Background technique
As one of most important invention of twentieth century, the appearance of semiconductor integrated circuit pushes mankind's technological progress
Every aspect.Wafer cutting is the important ring in semiconductor fabrication process.After semiconductor crystal wafer manufacture is completed, by cutting
The mode cut isolates tube core one by one from wafer, to be used for subsequent packaging and testing.With semiconductor fabrication process
It continues to develop, component integrated level is higher and higher and the mechanical performance of wafer itself is gradually decreasing, and has high-precision, high
Efficiency, it is contactless many advantages, such as laser scribing be developing progressively one of major way for wafer cutting.
Summary of the invention
In Summary, some concepts selected are introduced in simplified form, it will be in following specific implementation
Mode is further described in part.The Summary is not intended to identify any key of theme claimed
Feature or essential feature, nor to be used to aid in the range for determining theme claimed.
According to one aspect of the disclosure, a kind of side of quality for detecting the laser beam for Wafer Dicing is provided
Method, which comprises to it is collected comprising the laser beam be radiated at the image of the spot shape formed on wafer into
Row pretreatment；The spot shape in pretreated image is detected, attribute information associated with the spot shape is obtained；With
And it is based on attribute information associated with the spot shape obtained, it is predefined to judge whether the spot shape meets
Standard.
A kind of detection is used for setting for the quality of the laser beam of Wafer Dicing another aspect of the present disclosure provides
Standby, the equipment includes: memory, for storing instruction；And at least one processor, it is coupled to the memory,
Wherein, described instruction by least one described processor when being executed, so that at least one described processor: to collected packet
The image that the spot shape formed on wafer is radiated at containing the laser beam is pre-processed；It detects in pretreated image
Spot shape, obtain associated with spot shape attribute information；And based on the obtained and spot shape
Associated attribute information, judges whether the spot shape meets predefined standard.
A kind of dress of the quality of laser beam still another aspect of the present disclosure provides detection for Wafer Dicing
It sets, described device includes the module for executing method described in the disclosure.
According to the another aspect of the disclosure, a kind of computer readable storage medium is provided, is stored thereon with instruction, institute
Instruction is stated when being executed by least one processor, so that at least one described processor executes method described in the disclosure.
Detailed description of the invention
The form in exemplary fashion rather than limited, which is illustrated, to be realized to the disclosure in the accompanying drawings, it is similar in attached drawing
Appended drawing reference indicate same or similar component, in which:
Fig. 1 shows the exemplary wafer laser scribing system that can be implemented within some realizations of the disclosure；
Fig. 2 shows the flow charts according to the illustrative methods of some realizations of the disclosure；
Fig. 3 shows the flow chart of the illustrative methods of some realizations according to the disclosure；
Fig. 4 shows a specific example of some realizations according to the disclosure；
Fig. 5 shows a specific example of some realizations according to the disclosure；
Fig. 6 shows the block diagram of the exemplary means of some realizations according to the disclosure；And
Fig. 7 shows the block diagram of the example devices of some realizations according to the disclosure.
Specific embodiment
In the following description, for illustrative purposes, a large amount of details are elaborated.It is to be understood, however, that
The realization of the disclosure is implemented with without these details.In other examples, well known circuit, knot is not been shown in detail
Structure and technology, in order to avoid influence the understanding to specification.
Specification in the whole text in " one realization ", " realization ", " exemplary realization ", " some realizations ", " various realizations " etc.
Citation indicate that the realization of the described disclosure may include specific feature, structure or characteristic, however, being not to say that each
Realization all has to comprising these specific features, structure or characteristic.It is retouched in addition, some realizations can have for other realizations
It is some, whole in the feature stated, or without for other features for realizing description.
In following specification and claims, term " coupling " and " connection " and its derivative may be used.
It is to be appreciated that these terms are not intended to as mutual synonym.On the contrary, " connection " is used in specific realize
Indicate that two or more components physically or electrically contact directly with one another, and " coupling " is then used to indicate that two or more components are assisted each other
Make or interactive, but they may, directly may not also physically or electrically be contacted.
Fig. 1 shows the exemplary wafer laser scribing system 100 that can be implemented within some realizations of the disclosure.Such as
Shown in Fig. 1, system 100 may include laser 110, optical system 120 and workbench 130, and wafer 140 is placed on work
On platform 130 and it is fixed.The some optical elements such as may include beam expanding lens, diaphragm, focus lamp of optical system 120, however
The realization of the disclosure is not limited to the optical system of specific structure.Although being not shown, it will be appreciated by a person skilled in the art that being
System 100 can also include more components, for example, one or more control unit/equipment, for controlling laser 110, optics
System 120, and/or workbench 130.
In work, the High energy laser beam that the laser 110 of system 100 issues is radiated at work by optical system 120
On the designated position (more specifically, Cutting Road between die area on wafer 140) of wafer 140 on platform 130, ablation goes out
Spot, the form of spot reflect the characteristic of corresponding laser beam.Wafer 140 is as workbench 130 is with scheduled direction
It is moved with speed relative to laser beam, thus forms scribing line on the current Cutting Road of wafer 140.
Whether the laser beam being irradiated on wafer 140 meets defined standard for laser scribe process to Guan Chong
It wants.It before carrying out formal scribing to the wafer manufactured, needs to carry out whole system 100 point-device configuration, wraps
Setting various parameters associated with laser beam are included, to ensure product quality.However, the configuration behaviour of current considerable key
The operator for still needing to system 100 carries out manually.
For example, in wafer laser scribing configuration process, by image collecting device (for example, with optics or electron microscopic
Mirror etc. is associated) the laser beam spot that is formed on the test die of irradiation or spot are imaged.In the prior art, it grasps
Making personnel will observe and move the image acquired in this way, manually judge and/or measure the form of spot to determine configuration quality.
However, being influenced by factors such as environment, equipment and operator's own situations, such manual judgement and/or survey
Amount be it is inefficient and unstable, inexactness will lead to huge error so as to influence product quality.
Turning now to Fig. 2, it illustrates the flow charts according to the illustrative methods 200 of some realizations of the disclosure.Method
200 can for example be used in wafer laser scribing configuration process, detect the quality of laser beam.This method for example can be such as
Implement in wafer laser scribing system 100 shown in FIG. 1, for example, implementing one or more control unit/equipment in the system
In (not shown)；Alternatively, this method can also be implemented in the calculating equipment for being coupled to system 100, however the disclosure is not
It is limited to this.
As shown in Fig. 2, method 200 starts from step 210, in this step, irradiated to collected comprising laser beam
The image of the spot shape formed on wafer is pre-processed.
As previously mentioned, in wafer laser scribing configuration process, by associated with optics or electron microscope etc.
Image collecting device the laser beam from laser 110 and Jing Guo optical system 120 is radiated on test wafer 140
The spot of formation is imaged.In some realizations of the disclosure, can directly acquire such collecting image and to its into
Row pretreatment, this makes the image acquired be fully utilized, avoids information waste.According to other realities of the disclosure
It is existing, laser beam can also be acquired using other types of general/special image acquisition device to be radiated at formed on wafer
The image of spot.The disclosure is not limited to the specific implementation of image collecting device.
By pre-processing to acquired image, the spot shape that can be protruded in described image is subsequent to facilitate
Detection.For this purpose, in an exemplary realization of the disclosure, the pretreatment may include described image is carried out gray processing,
Noise reduction, binaryzation and corrosion treatment.It will be understood by those skilled in the art that at can be using more or less image
Reason means, to realize more preferable or similar effect.The disclosure is not limited to specific image procossing mode and sequence.
Next, method 200 proceeds to step 220, in this step, the spot shape in pretreated image is detected
Shape obtains attribute information associated with the spot shape.
It, can be using the side in computer vision to the detection of the spot shape in image in some realizations of the disclosure
Edge detection technique carries out.Illustrative edge detection algorithm can include but is not limited to: Sobel edge detection algorithm, Candy
Edge detection algorithm, Scharr edge detection algorithm, Laplacian edge detection algorithm, etc..In some examples of the disclosure
Property realize, the detection can use the edge indicator function that provides in open source computer vision programming function library OpenCV and comes
It carries out.
By detecting the spot shape in image, available attribute information associated with the spot shape.For example,
The shape of spot can be round or close circle.In addition, the shape of spot is for example also possible to rectangle.In some of the disclosure
In realization, the attribute information may include maximum distance of the spot shape in X, Y-axis；In some realizations of the disclosure,
The attribute information may include the radius/diameter of spot shape；In some realizations of the disclosure, the attribute information can be with
Roundness including spot shape；In some realizations of the disclosure, the attribute information may include the width of spot shape；
Etc..
Then, method 200 proceeds to step 230, in this step, based on obtained associated with the spot shape
Attribute information, judge whether the spot shape meets predefined standard.
As an example, not a limit, the judgement can be by by attribute information obtained and the predefined standard
It is compared to realize.Continue the example of front, the predefined standard can be the maximum of the diameter for spot shape
Value and/or minimum value require, for spot shape roundness maximum value and/or minimum value require, for spot shape
Maximum value and/or minimum value requirement of width, etc..As previously mentioned, the form of spot reflects corresponding laser beam
Characteristic.Therefore, by judging whether spot shape meets predefined standard, it would know that the swashing for Wafer Dicing configured
Whether the quality of light light beam meets the requirements.
Illustrative methods 200 as shown in Figure 2 are completed by means of computer vision technique to swash to for Wafer Dicing
The automatic detection of the quality of light light beam.It is greatlyd improve compared to traditional manual judgement and/or measurement, the automatic testing method
Efficiency, accuracy and stability.
Illustrative methods 200 can also include other steps.
For example, it is predefined to have judged whether the spot shape meets in step 230 according to some realizations of the disclosure
Standard after, method 200 can also include generating the report for the result for indicating the judgement, and the report is presented.Make
For example, the report may include described image itself, attribute information associated with spot shape obtained, Yi Jisuo
State the result of judgement.In a more specific exemplary realization, it is described report may include be superimposed thereon attribute information and
The described image of judging result.The report is for example shown on the display for calculating equipment, so that operator checks.
In addition, it is predefined to have judged whether the spot shape meets in step 230 according to some realizations of the disclosure
Standard after, method 200 can also include by described image, attribute information associated with spot shape obtained, with
And the information associations such as result of the judgement carry out storage as historical data, for consulting and using when needed, thus
Realize the traceability of data.In some implementations, the historical data can also include the report of above-mentioned generation.In addition,
In some implementations, the predefined standard is at least partially based on the historical data to determine.In addition, as showing
Example builds such historical data by key messages such as the shooting times of source device, described image using described image
Lithol draws, and can be convenient subsequent retrieval and use.In some implementations, such historical data can be used for regularly
(for example, daily, per week, monthly ...) generates statistical report.
In addition, method 200 can also include: the result in response to the judgement of step 230 according to some realizations of the disclosure
Indicate that the spot shape does not meet predefined standard, it is described sharp to improve to adjust parameter associated with the laser beam
The quality of light light beam.As an example, not a limit, the parameter may include the laser for influencing the quality of the laser beam
110 parameter, such as the wavelength of emitted laser, power, pulse width, repetition rate, etc..In addition, the parameter can also
With include the quality for influencing the laser beam optical system 200 parameter.In some implementations, the adjustment can pass through
Corresponding instruction is issued to one or more control units for controlling laser 100 and/or optical system 200/equipment to come
It realizes.It will be understood by those skilled in the art that the other parameters that will affect laser beam quality of adjustment are also feasible, the disclosure
It is not limited to above-mentioned specific example.
Below with reference to Fig. 3, it illustrates the flow charts according to the illustrative methods 300 of some realizations of the disclosure.Method
300 can for example be used in wafer laser scribing configuration process, detect and control the quality of laser beam.This method for example may be used
To implement in wafer laser scribing system 100 as shown in Figure 1, for example, implementing one or more control units in the system
In part/equipment (not shown)；Alternatively, this method can also be implemented in the calculating equipment for being coupled to system 100, however this public affairs
It opens and is not limited to this.
As shown in figure 3, method 300 starts from step 310, in this step, irradiated to collected comprising laser beam
The image of the spot shape formed on wafer carries out gray processing and handles to obtain gray level image.Then, method 300 proceeds to step
Rapid 320, in this step, noise reduction process is carried out to the gray level image obtained in the step 310.Then, in a step 330, right
Gray level image after noise reduction carries out binary conversion treatment to generate bianry image.Method 300 continues to step 340, in the step
In rapid, to the bianry image application erosion algorithm generated in a step 330.
The above-mentioned steps 310-340 of method 300 can correspond to the image preprocessing of the step 210 in preceding method 200
A kind of exemplary realization.It will be understood by those skilled in the art that for gray processing, noise reduction, binaryzation and corroding this four
Each of processing stage can also choose be applicable in specific algorithm respectively, and the disclosure is not limited to specific algorithm
It realizes.In addition, it will be understood by those skilled in the art that in order to the step 210 in Method Of Accomplishment 200 image preprocessing with protrusion
It is all required that spot shape in described image, which is not each of the step 310-340 of method 300, but can be with
More preferable or similar effect is realized using more perhaps less image processing means, and/or using other processing sequences
Fruit.
Method 300 then proceedes to step 350, in this step, detects the spot in the image after aforementioned step process
Trace shape obtains attribute information associated with the spot shape.Then, in step 360, based on it is obtained with it is described
The associated attribute information of spot shape, judges whether the spot shape meets predefined standard.In response to step 360
The result of judgement indicates that the spot shape does not meet predefined standard, in step 370, adjustment and the laser beam phase
Associated parameter is to improve the quality of the laser beam.The above-mentioned steps 350-370 of method 300 can correspond respectively to aforementioned
Step 220 in method 200,230 and the set-up procedure that additionally describes.
In addition, in some implementations, step 310-370 can be iteratively performed, until the step in certain one cycle
Until 360 judging result indicates that the spot shape that this time detects meets predefined standard.
Fig. 4 shows a specific example of some realizations according to the disclosure.The top of Fig. 4 shows collected
Original image is radiated at the spot formed on wafer comprising the laser beam for Wafer Dicing in the image.In this example
It is assumed that shape to be measured is round.The image obtained after pre-processing to the original image is as shown in the middle part of Fig. 4, by figure
As pretreatment, intermediate spot is highlighted.Then, by using edge detection algorithm come the spot shape in detection image,
Its coordinate can be obtained, determines that spot diameter is 35 pixels.It is assumed herein that predefined standard is that diameter should be less than or be equal to
40 pixels.Therefore, it is possible to judge that going out the spot meets predefined standard.The lower part of Fig. 4 shows instruction generated
The report of judging result, as shown, indicating that the symbol " 35px " that spot diameter is 35 pixels, expression judging result are to meet
The symbol " Pass " of standard is applied on the original image.In addition, in this example, spot edge be highlighted (in figure with
Dotted line frame indicates).
In fact, spot is not always the circle of standard.In another example, it can use edge detection algorithm to examine
Spot in altimetric image obtains maximum distance (for example, 25 pixels) of the spot in X-axis and the maximum distance (example in Y-axis
Such as, 30 pixels), determine that the ratio between the two is 25/30, which reflects the roundness of spot.It is assumed herein that predefined standard
It is that roundness should be greater than or be equal to 0.8.Therefore, it is possible to judge that going out the spot meets predefined standard.It can be generated and show
With report as form class shown in the lower part Fig. 4.
Fig. 5 shows another specific example of some realizations according to the disclosure.The top of Fig. 5, which is shown, to be collected
Original image, be radiated at the rectangle spot formed on wafer comprising the laser beam for Wafer Dicing in the image.At this
Assume that be measured is the width of rectangle spot in example, and predefined standard is that width should be less than or be equal to 16 pixels.
Original image can be initialized by the way of similar to the above, then detect rectangle spot therein, obtained corresponding
Width be respectively 18 pixels, 18 pixels, 20 pixels.The lower part of Fig. 5 shows instruction judging result generated
Report.Here, it respectively indicates the symbol " 18px ", " 18px " and " 20px " of each spot width value, indicate that judging result is not
Standard compliant symbol " Fail " is applied on the original image.In addition, in this example, rectangle spot edge is also highlighted aobvious
Show and (is indicated in figure with dotted line frame).
Fig. 6 shows the block diagram of the exemplary means 600 of some realizations according to the disclosure.For example, the device can be by
Realize in wafer laser scribing system 120 shown in Fig. 1 (for example, implement the system one or more control units/
In equipment (not shown))；Alternatively, which can also implement in the calculating equipment for being coupled to system 100, however the disclosure
It is not limited to this.Exemplary means 600 can with software, hardware, firmware, or any combination thereof realize.
Device 600 may include for being radiated at the spot shape formed on wafer comprising laser beam to collected
Image carries out pretreated unit 610.Device 600 can also include for detecting the spot shape in pretreated image,
Obtain the unit 620 of attribute information associated with the spot shape.In addition, device 600 can also include for being based on institute
The attribute information associated with the spot shape obtained, judges whether the spot shape meets the list of predefined standard
Member 630.
Although device 600 is shown as comprising unit 610-630, device 600 can also include other units or
Its existing one or more unit of person, which can be configured to execute, combines the other of Fig. 2 and Fig. 3 description in the disclosure
Operation.
Turning now to Fig. 7, the block diagram of the example devices 700 of some realizations according to the disclosure is shown.Such as Fig. 7 institute
Show, equipment 700 may include one or more processors 710 and memory 720.One or more processors 710 can wrap
Include any type of General Porcess Unit/core (such as, but not limited to: CPU, GPU) or specialized processing units, core, electricity
Road, controller, etc..Memory 720 may include any type of medium that can be used for storing data.720 quilt of memory
It is configured to store instruction, it is described in the disclosure that described instruction executes one or more processors 710
The operation of method (for example, illustrative methods 200,300, etc.).
Various realizations described herein may include or operate multiple components, component, unit, module, example or mechanism,
Can with hardware, software, firmware, or any combination thereof realize.The example of hardware may include but be not limited to: equipment, processing
Device, microprocessor, circuit, circuit element (such as transistor, resistor, capacitor, inductor, etc.), integrated circuit, specially
With integrated circuit (ASIC), programmable logic device (PLD), digital signal processor (DSP), field programmable gate array
(FPGA), storage unit, logic gate, register, semiconductor devices, chip, microchip, chipset, etc..The example of software can
With including but not limited to: component software, program, application, computer program, application program, system program, machine program, operation
System software, middleware, software module, routine, subroutine, function, method, process, software interface, Application Programming Interface
(API), instruction set, computer code, computer code segments, word, value, symbol, or any combination thereof.Determine that a realization is to make
Many factors can be depended on and change by being realized with hardware, software, and/or firmware, such as desired computation rate, power stage
Not, heat resistance, process cycle budget, input data rate, output data rate, memory resource, data bus speed, and
Others design or performance constraints, as a given realization is desired.
Some realize described herein may include product.Product may include storage medium.The example of storage medium can
To include being realized with any means or technology to store information (for example, computer readable instructions, data structure, program mould
Block or other data) volatibility and non-volatile, moveable and immovable medium.Storage medium can wrap
It includes but is not limited to: is random access memory (RAM), read-only memory (ROM), programmable read only memory (PROM), erasable
Programmable read only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other storages
Device technology, CD (CD), digital versatile disk (DVD) or other optical storages, cassette, tape, disk storage or other magnetic storages
Equipment or any other medium that can be used in storing information.In some implementations, product can store executable meter
Calculation machine program instruction, when being executed by one or more processing units, so that processing unit executes operation described here.It can
The computer program instructions of execution may include the code of any type, for example, source code, compiled code, interpretive code,
Executable code, static code, dynamic code, etc..Executable computer program instructions can be used any suitable high
Grade, rudimentary, object-oriented, visual, compiling and/or explanation programming language is realized.
Some exemplary realizations of the disclosure are described below.
Example 1: a kind of method of the quality of the laser beam of detection for Wafer Dicing includes: to collected comprising institute
It states laser beam and is radiated at the image of the spot shape formed on wafer and pre-processed；Detect the spot in pretreated image
Trace shape obtains attribute information associated with the spot shape；And based on obtained related to the spot shape
The attribute information of connection, judges whether the spot shape meets predefined standard.
Example 2: according to method described in aforementioned any example, further includes: described in the result instruction in response to the judgement
Spot shape does not meet the predefined standard, adjusts parameter associated with the laser beam to improve the laser light
The quality of beam.
Example 3: according to method described in aforementioned any example, further includes: generate the report for indicating the result of the judgement；
And the report is presented.
Example 4: according to method described in aforementioned any example, wherein it is described report include described image, it is obtained with
The associated attribute information of spot shape and the judgement as a result, and wherein, the attribute information and described sentence
Disconnected result is applied on the image.
Example 5: according to method described in aforementioned any example, wherein the pretreatment includes: to carry out ash to described image
Degreeization processing is to obtain gray level image；Noise reduction process is carried out to gray level image obtained；Gray level image after noise reduction is carried out
Binary conversion treatment is to generate bianry image；And to bianry image application erosion algorithm generated.
Example 6: according to method described in aforementioned any example, wherein the predefined standard include in following extremely
Few one: maximum value and/or minimum value for the diameter of spot shape require, for spot shape roundness maximum value
And/or minimum value require, for spot shape width maximum value and/or minimum value requirement.
Example 7: according to method described in aforementioned any example, further includes: by described image, the obtained and spot
The associated attribute information of shape and the result of the judgement are stored in association.
Example 8: a kind of equipment of quality of the laser beam of detection for Wafer Dicing includes: memory, is used to deposit
Storage instruction；And at least one processor, be coupled to the memory, wherein described instruction by it is described at least one
When managing device execution, so that at least one described processor: being formed to collected be radiated on wafer comprising the laser beam
The image of spot shape pre-processed；The spot shape in pretreated image is detected, is obtained and the spot shape
Associated attribute information；And it is based on attribute information associated with the spot shape obtained, judge the spot
Whether shape meets predefined standard.
Example 9: according to equipment described in aforementioned any example, wherein described instruction is by least one described processor
When execution, also make at least one described processor: indicating that the spot shape does not meet institute in response to the result of the judgement
Predefined standard is stated, adjusts parameter associated with the laser beam to improve the quality of the laser beam.
Example 10: according to equipment described in aforementioned any example, wherein described instruction is by least one described processor
When execution, also makes at least one described processor: generating the report for indicating the result of the judgement；And the report is presented
It accuses.
Example 11: according to equipment described in aforementioned any example, wherein described to report to include described image, is obtained
Attribute information associated with the spot shape and the judgement as a result, and wherein, the attribute information and described
The result of judgement is applied on the image.
Example 12: according to equipment described in aforementioned any example, wherein the pretreatment includes: to carry out to described image
Gray processing processing is to obtain gray level image；Noise reduction process is carried out to gray level image obtained；To the gray level image after noise reduction into
Row binary conversion treatment is to generate bianry image；And to bianry image application erosion algorithm generated.
Example 13: according to equipment described in aforementioned any example, wherein the predefined standard include in following extremely
Few one: maximum value and/or minimum value for the diameter of spot shape require, for spot shape roundness maximum value
And/or minimum value require, for spot shape width maximum value and/or minimum value requirement.
Example 14: according to equipment described in aforementioned any example, wherein described instruction is by least one described processor
When execution, also make at least one described processor: by described image, attribute associated with the spot shape obtained
Information and the result of the judgement are stored in association.
Example 15: a kind of device for the quality detecting the laser beam for Wafer Dicing, including for executing herein
The module of the method.
Example 16: a kind of computer readable storage medium is stored thereon with instruction, and described instruction is by least one processing
When device executes, so that at least one described processor executes method described herein.
The content being described above includes the example of disclosed framework.Certainly and component and/or side can not be described
The combination that every kind of method can infer, it will be recognized to those skilled in the art that many other combination and permutation are also can
Capable.Therefore, the novel architecture be intended to cover fall into all such substitutions within spirit and scope of the appended claims,
Modifications and variations.
Claims (16)
1. a kind of method of the quality of laser beam of detection for Wafer Dicing, comprising:
The collected image for being radiated at the spot shape formed on wafer comprising the laser beam is pre-processed；
The spot shape in pretreated image is detected, attribute information associated with the spot shape is obtained；And
Based on attribute information associated with the spot shape obtained, it is predefined to judge whether the spot shape meets
Standard.
2. according to the method described in claim 1, further include:
Indicate that the spot shape does not meet the predefined standard, adjustment and the laser in response to the result of the judgement
The associated parameter of light beam is to improve the quality of the laser beam.
3. according to the method described in claim 1, further include:
Generate the report for indicating the result of the judgement；And
The report is presented.
4. according to the method described in claim 3, wherein, the report includes described image, the obtained and spot shape
The associated attribute information of shape and the judgement as a result, and wherein, the result quilt of the attribute information and the judgement
Superposition is on the image.
5. according to the method described in claim 1, wherein, the pretreatment includes:
Gray processing processing is carried out to obtain gray level image to described image；
Noise reduction process is carried out to gray level image obtained；
Binary conversion treatment is carried out to generate bianry image to the gray level image after noise reduction；And
To bianry image application erosion algorithm generated.
6. according to the method described in claim 1, wherein, the predefined standard includes at least one of the following: being directed to
The maximum value and/or minimum value of the diameter of spot shape require, for spot shape roundness maximum value and/or minimum value
It is required that, for spot shape width maximum value and/or minimum value requirement.
7. according to the method described in claim 1, further include:
The result of described image, attribute information associated with the spot shape obtained and the judgement is associated with
Ground is stored.
8. a kind of equipment of the quality of laser beam of detection for Wafer Dicing, comprising:
Memory, for storing instruction；And
At least one processor is coupled to the memory, wherein described instruction is executed by least one described processor
When, so that at least one described processor:
The collected image for being radiated at the spot shape formed on wafer comprising the laser beam is pre-processed；
The spot shape in pretreated image is detected, attribute information associated with the spot shape is obtained；And
Based on attribute information associated with the spot shape obtained, it is predefined to judge whether the spot shape meets
Standard.
9. equipment according to claim 8, wherein described instruction also makes when being executed by least one described processor
Obtain at least one described processor:
Indicate that the spot shape does not meet the predefined standard, adjustment and the laser in response to the result of the judgement
The associated parameter of light beam is to improve the quality of the laser beam.
10. equipment according to claim 8, wherein described instruction also makes when being executed by least one described processor
Obtain at least one described processor:
Generate the report for indicating the result of the judgement；And
The report is presented.
11. equipment according to claim 10, wherein the report includes described image, the obtained and spot
The associated attribute information of shape and the judgement as a result, and wherein, the result of the attribute information and the judgement
It is applied on the image.
12. equipment according to claim 8, wherein the pretreatment includes:
Gray processing processing is carried out to obtain gray level image to described image；
Noise reduction process is carried out to gray level image obtained；
Binary conversion treatment is carried out to generate bianry image to the gray level image after noise reduction；And
To bianry image application erosion algorithm generated.
13. equipment according to claim 8, wherein the predefined standard includes at least one of the following: being directed to
The maximum value and/or minimum value of the diameter of spot shape require, for spot shape roundness maximum value and/or minimum value
It is required that, for spot shape width maximum value and/or minimum value requirement.
14. equipment according to claim 8, wherein described instruction also makes when being executed by least one described processor
Obtain at least one described processor:
The result of described image, attribute information associated with the spot shape obtained and the judgement is associated with
Ground is stored.
15. a kind of device of the quality of laser beam of detection for Wafer Dicing, including for executing according to claim 1-7
In any one described in method module.
16. a kind of computer readable storage medium, is stored thereon with instruction, described instruction is executed by least one processor
When, so that at least one described processor executes method described in any one according to claim 1 in -7.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111782695A (en) * | 2020-06-29 | 2020-10-16 | 上海华力微电子有限公司 | Data processing method, storage medium and computer equipment for MPW multi-product joint measurement |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101794435A (en) * | 2010-03-04 | 2010-08-04 | 成都三泰电子实业股份有限公司 | Binary image noise-reduction method based on integral graph and binary image processing system |
| CN102043347A (en) * | 2010-10-19 | 2011-05-04 | 长春理工大学 | Method and system for detecting and calibrating incident postures of light beams in laser interference nano-lithography |
| CN103674839A (en) * | 2013-11-12 | 2014-03-26 | 清华大学 | Visual sample positioning operating system and method based on light spot detection |
| US20160045980A1 (en) * | 2014-08-18 | 2016-02-18 | Disco Corporation | Laser beam spot shape detection method |
| CN107894214A (en) * | 2016-10-04 | 2018-04-10 | 株式会社迪思科 | The light spot shape detection method of pulse laser light |
| CN108257137A (en) * | 2017-11-27 | 2018-07-06 | 南京浩梁景信息科技有限公司 | A kind of angle measurement method and system of the automatic interpretation of view-based access control model hot spot |
| CN108340071A (en) * | 2017-01-24 | 2018-07-31 | 株式会社迪思科 | Light spot shape detection device |
-
2019
- 2019-02-15 CN CN201910116772.4A patent/CN109822231A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101794435A (en) * | 2010-03-04 | 2010-08-04 | 成都三泰电子实业股份有限公司 | Binary image noise-reduction method based on integral graph and binary image processing system |
| CN102043347A (en) * | 2010-10-19 | 2011-05-04 | 长春理工大学 | Method and system for detecting and calibrating incident postures of light beams in laser interference nano-lithography |
| CN103674839A (en) * | 2013-11-12 | 2014-03-26 | 清华大学 | Visual sample positioning operating system and method based on light spot detection |
| US20160045980A1 (en) * | 2014-08-18 | 2016-02-18 | Disco Corporation | Laser beam spot shape detection method |
| CN107894214A (en) * | 2016-10-04 | 2018-04-10 | 株式会社迪思科 | The light spot shape detection method of pulse laser light |
| CN108340071A (en) * | 2017-01-24 | 2018-07-31 | 株式会社迪思科 | Light spot shape detection device |
| CN108257137A (en) * | 2017-11-27 | 2018-07-06 | 南京浩梁景信息科技有限公司 | A kind of angle measurement method and system of the automatic interpretation of view-based access control model hot spot |
Non-Patent Citations (1)
| Title |
|---|
| 夏敏: "浅析腐蚀算法", 《民营科技》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111782695A (en) * | 2020-06-29 | 2020-10-16 | 上海华力微电子有限公司 | Data processing method, storage medium and computer equipment for MPW multi-product joint measurement |
| CN111782695B (en) * | 2020-06-29 | 2024-03-15 | 上海华力微电子有限公司 | MPW multi-product joint measurement data processing method, storage medium and computer equipment |
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