SG10201505758TA - Wire Bonding Apparatus Comprising an Oscillator Mechanism - Google Patents
Wire Bonding Apparatus Comprising an Oscillator MechanismInfo
- Publication number
- SG10201505758TA SG10201505758TA SG10201505758TA SG10201505758TA SG10201505758TA SG 10201505758T A SG10201505758T A SG 10201505758TA SG 10201505758T A SG10201505758T A SG 10201505758TA SG 10201505758T A SG10201505758T A SG 10201505758TA SG 10201505758T A SG10201505758T A SG 10201505758TA
- Authority
- SG
- Singapore
- Prior art keywords
- wire bonding
- bonding apparatus
- oscillator mechanism
- oscillator
- wire
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78308—Removable capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
- H01L2224/78347—Piezoelectric transducers
- H01L2224/78349—Piezoelectric transducers in the upper part of the bonding apparatus, e.g. in the capillary or wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7855—Mechanical means, e.g. for severing, pressing, stamping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/789—Means for monitoring the connection process
- H01L2224/78901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462028381P | 2014-07-24 | 2014-07-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201505758TA true SG10201505758TA (en) | 2016-02-26 |
Family
ID=55165967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201505758TA SG10201505758TA (en) | 2014-07-24 | 2015-07-23 | Wire Bonding Apparatus Comprising an Oscillator Mechanism |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9640512B2 (en) |
| JP (1) | JP6073991B2 (en) |
| KR (1) | KR101674400B1 (en) |
| CN (1) | CN105304513B (en) |
| MY (1) | MY170279A (en) |
| SG (1) | SG10201505758TA (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5930423B2 (en) | 2014-05-09 | 2016-06-08 | 株式会社カイジョー | Bonding equipment |
| US11302669B2 (en) | 2015-10-15 | 2022-04-12 | Skyworks Solutions, Inc. | Wire bond cleaning method and wire bonding recovery process |
| CN108227113A (en) * | 2016-12-10 | 2018-06-29 | 中国科学院长春光学精密机械与物理研究所 | For the adjustment of mirror optics element angle and the device and method of aberration compensation |
| US11289446B2 (en) * | 2018-03-28 | 2022-03-29 | Asm Technology Singapore Pte Ltd | Multiple actuator wire bonding apparatus |
| US11205634B2 (en) * | 2018-07-16 | 2021-12-21 | Asm Technology Singapore Pte Ltd | Bonding apparatus with replaceable bonding tool |
| CN113767458A (en) | 2019-08-13 | 2021-12-07 | 株式会社新川 | Wire bonding device |
| CN112548305B (en) * | 2020-12-01 | 2022-03-29 | 上海交通大学 | Ultrasonic metal welding base for providing additional force |
| IT202000031043A1 (en) | 2020-12-16 | 2022-06-16 | Nuovo Pignone Tecnologie Srl | ACTIVE PIEZOELECTRIC TOOL, ACTIVE PIEZOELECTRIC DEVICE AND ACTIVE PIEZOELECTRIC TOOL OPERATION METHOD. |
| CN113182158B (en) * | 2021-06-02 | 2022-10-18 | 广东阿达智能装备有限公司 | Piezoelectric transducer with flexible pre-tightening mechanism and isolating sheet |
| US11691214B2 (en) * | 2021-10-17 | 2023-07-04 | Shinkawa Ltd. | Ultrasound horn |
| US11798911B1 (en) | 2022-04-25 | 2023-10-24 | Asmpt Singapore Pte. Ltd. | Force sensor in an ultrasonic wire bonding device |
| US20240116126A1 (en) * | 2022-10-11 | 2024-04-11 | Asmpt Singapore Pte. Ltd. | Ultrasonic transducer operable at multiple resonant frequencies |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0653291A (en) * | 1992-07-30 | 1994-02-25 | Matsushita Electric Ind Co Ltd | Wire bonding apparatus |
| US5890643A (en) * | 1996-11-15 | 1999-04-06 | Kulicke And Soffa Investments, Inc. | Low mass ultrasonic bonding tool |
| US8104660B2 (en) * | 2006-05-03 | 2012-01-31 | Asm Technology Singapore Pte Ltd | Transducer and method for mounting the same |
| JP4679454B2 (en) * | 2006-07-13 | 2011-04-27 | 株式会社新川 | Wire bonding equipment |
| JP4425319B1 (en) | 2008-09-10 | 2010-03-03 | 株式会社新川 | Bonding method, bonding apparatus, and manufacturing method |
| US8919631B2 (en) * | 2012-03-15 | 2014-12-30 | Asm Technology Singapore Pte Ltd | Wire bonder including a transducer, a bond head, and a mounting apparatus |
-
2015
- 2015-07-20 US US14/803,314 patent/US9640512B2/en active Active
- 2015-07-23 SG SG10201505758TA patent/SG10201505758TA/en unknown
- 2015-07-23 KR KR1020150104142A patent/KR101674400B1/en active IP Right Grant
- 2015-07-23 CN CN201510436085.2A patent/CN105304513B/en active Active
- 2015-07-23 JP JP2015145817A patent/JP6073991B2/en active Active
- 2015-07-23 MY MYPI2015001849A patent/MY170279A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP6073991B2 (en) | 2017-02-01 |
| JP2016025359A (en) | 2016-02-08 |
| US9640512B2 (en) | 2017-05-02 |
| KR20160012939A (en) | 2016-02-03 |
| MY170279A (en) | 2019-07-16 |
| CN105304513A (en) | 2016-02-03 |
| CN105304513B (en) | 2017-11-24 |
| KR101674400B1 (en) | 2016-11-09 |
| US20160023298A1 (en) | 2016-01-28 |
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