SG10201501238UA - Optical device - Google Patents
Optical deviceInfo
- Publication number
- SG10201501238UA SG10201501238UA SG10201501238UA SG10201501238UA SG10201501238UA SG 10201501238U A SG10201501238U A SG 10201501238UA SG 10201501238U A SG10201501238U A SG 10201501238UA SG 10201501238U A SG10201501238U A SG 10201501238UA SG 10201501238U A SG10201501238U A SG 10201501238UA
- Authority
- SG
- Singapore
- Prior art keywords
- optical device
- optical
- Prior art date
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014040056A JP6277017B2 (ja) | 2014-03-03 | 2014-03-03 | 光デバイス |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201501238UA true SG10201501238UA (en) | 2015-10-29 |
Family
ID=54033313
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201501238UA SG10201501238UA (en) | 2014-03-03 | 2015-02-17 | Optical device |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6277017B2 (zh) |
KR (1) | KR102155917B1 (zh) |
CN (1) | CN104900777B (zh) |
SG (1) | SG10201501238UA (zh) |
TW (1) | TWI639253B (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6605277B2 (ja) * | 2015-09-29 | 2019-11-13 | 浜松ホトニクス株式会社 | レーザ加工方法及びレーザ加工装置 |
JP6605278B2 (ja) | 2015-09-29 | 2019-11-13 | 浜松ホトニクス株式会社 | レーザ加工方法 |
JP6745165B2 (ja) * | 2016-08-09 | 2020-08-26 | 株式会社ディスコ | ウェーハの加工方法 |
JP6746211B2 (ja) * | 2016-09-21 | 2020-08-26 | 株式会社ディスコ | ウェーハの加工方法 |
JP6775880B2 (ja) * | 2016-09-21 | 2020-10-28 | 株式会社ディスコ | ウェーハの加工方法 |
US20210328115A1 (en) * | 2018-08-27 | 2021-10-21 | Sony Semiconductor Solutions Corporation | Light-emitting device and method for producing light-emitting device |
TW202040722A (zh) * | 2019-03-28 | 2020-11-01 | 日商東京威力科創股份有限公司 | 處理裝置及處理方法 |
CN111276577B (zh) * | 2019-12-18 | 2021-12-10 | 北京中科优唯科技有限公司 | 一种led芯片的制造方法 |
JP7499116B2 (ja) * | 2020-08-25 | 2024-06-13 | シャープ福山レーザー株式会社 | 画像表示素子 |
JP7206550B2 (ja) | 2020-09-30 | 2023-01-18 | 日亜化学工業株式会社 | 発光素子の製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10305420A (ja) | 1997-03-04 | 1998-11-17 | Ngk Insulators Ltd | 酸化物単結晶からなる母材の加工方法、機能性デバイスの製造方法 |
JP2007234707A (ja) * | 2006-02-28 | 2007-09-13 | Rohm Co Ltd | 半導体発光素子 |
CN2891295Y (zh) * | 2006-03-01 | 2007-04-18 | 东莞市福地电子材料有限公司 | 一种发光二极管 |
JP5221007B2 (ja) * | 2006-05-31 | 2013-06-26 | アイシン精機株式会社 | 発光ダイオードチップ及びウェハ分割加工方法 |
JP4909657B2 (ja) | 2006-06-30 | 2012-04-04 | 株式会社ディスコ | サファイア基板の加工方法 |
JP2008300645A (ja) * | 2007-05-31 | 2008-12-11 | Sharp Corp | 窒化物系半導体ledチップの製造方法 |
JP2011134955A (ja) * | 2009-12-25 | 2011-07-07 | Disco Abrasive Syst Ltd | 板状材料からのチップ状部品の生産方法 |
TW201242122A (en) * | 2011-04-15 | 2012-10-16 | Chi Mei Lighting Tech Corp | Light-emitting diode device |
KR101861997B1 (ko) * | 2011-10-31 | 2018-05-29 | 엘지이노텍 주식회사 | 발광소자 및 발광소자 제조방법 |
-
2014
- 2014-03-03 JP JP2014040056A patent/JP6277017B2/ja active Active
-
2015
- 2015-01-30 TW TW104103269A patent/TWI639253B/zh active
- 2015-02-17 SG SG10201501238UA patent/SG10201501238UA/en unknown
- 2015-02-27 KR KR1020150027962A patent/KR102155917B1/ko active IP Right Grant
- 2015-03-02 CN CN201510092333.6A patent/CN104900777B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
TW201535781A (zh) | 2015-09-16 |
JP2015165532A (ja) | 2015-09-17 |
KR20150103631A (ko) | 2015-09-11 |
CN104900777B (zh) | 2019-05-31 |
JP6277017B2 (ja) | 2018-02-07 |
KR102155917B1 (ko) | 2020-09-14 |
CN104900777A (zh) | 2015-09-09 |
TWI639253B (zh) | 2018-10-21 |
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