SG10201407661VA - Compressible Layer With Integrated Bridge In IC Testing Apparatus - Google Patents

Compressible Layer With Integrated Bridge In IC Testing Apparatus

Info

Publication number
SG10201407661VA
SG10201407661VA SG10201407661VA SG10201407661VA SG10201407661VA SG 10201407661V A SG10201407661V A SG 10201407661VA SG 10201407661V A SG10201407661V A SG 10201407661VA SG 10201407661V A SG10201407661V A SG 10201407661VA SG 10201407661V A SG10201407661V A SG 10201407661VA
Authority
SG
Singapore
Prior art keywords
testing apparatus
compressible layer
integrated bridge
bridge
integrated
Prior art date
Application number
SG10201407661VA
Other languages
English (en)
Inventor
Wei Kuong Foong
Kok Sing Goh
Shamal Mundiyath
Eng Kiat Lee
Original Assignee
Jf Microtechnology Sdn Bhd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jf Microtechnology Sdn Bhd filed Critical Jf Microtechnology Sdn Bhd
Publication of SG10201407661VA publication Critical patent/SG10201407661VA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Engineering & Computer Science (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
SG10201407661VA 2013-12-18 2014-11-17 Compressible Layer With Integrated Bridge In IC Testing Apparatus SG10201407661VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2013004546A MY188012A (en) 2013-12-18 2013-12-18 Compressible layer with integrated bridge in ic testing apparatus

Publications (1)

Publication Number Publication Date
SG10201407661VA true SG10201407661VA (en) 2015-07-30

Family

ID=53368117

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201407661VA SG10201407661VA (en) 2013-12-18 2014-11-17 Compressible Layer With Integrated Bridge In IC Testing Apparatus

Country Status (8)

Country Link
US (2) US10031163B2 (ko)
JP (1) JP2015118098A (ko)
KR (1) KR102311582B1 (ko)
CN (1) CN104730297A (ko)
MY (1) MY188012A (ko)
PH (1) PH12014000368A1 (ko)
SG (1) SG10201407661VA (ko)
TW (1) TW201527769A (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY188012A (en) * 2013-12-18 2021-11-09 Jf Microtechnology Sdn Bhd Compressible layer with integrated bridge in ic testing apparatus
MY197431A (en) 2020-06-11 2023-06-17 Jf Microtechnology Sdn Bhd Short interconnect assembly with strip elastomer
US11674977B2 (en) 2020-06-11 2023-06-13 Jf Microtechnology Sdn. Bhd Short interconnect assembly with strip elastomer
TWI751940B (zh) * 2021-04-14 2022-01-01 中華精測科技股份有限公司 探針卡裝置及類彈簧探針
TWI839902B (zh) * 2022-10-19 2024-04-21 泰可廣科技股份有限公司 探針式測試連接器

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5749738A (en) * 1991-01-09 1998-05-12 Johnstech International Corporation Electrical interconnect contact system
US5385477A (en) 1993-07-30 1995-01-31 Ck Technologies, Inc. Contactor with elastomer encapsulated probes
US6409521B1 (en) * 1997-05-06 2002-06-25 Gryphics, Inc. Multi-mode compliant connector and replaceable chip module utilizing the same
US6299459B1 (en) * 2001-02-02 2001-10-09 Agilent Technologies, Inc. compressible conductive interface
US6506082B1 (en) 2001-12-21 2003-01-14 Interconnect Devices, Inc. Electrical contact interface
US6623284B1 (en) * 2003-01-07 2003-09-23 Hon Hai Precision Ind. Co., Ltd. Electrical connector
AU2003207211A1 (en) * 2003-02-10 2004-08-30 Kabushiki Kaisha Nihon Micronics Electric connector
US7537461B2 (en) * 2003-07-16 2009-05-26 Gryphics, Inc. Fine pitch electrical interconnect assembly
CN101099268A (zh) * 2005-01-04 2008-01-02 格瑞费克斯公司 精密间距电互连组件
SG131790A1 (en) * 2005-10-14 2007-05-28 Tan Yin Leong Probe for testing integrated circuit devices
WO2007052358A1 (ja) * 2005-10-31 2007-05-10 Kabushiki Kaisha Nihon Micronics 電気的接続装置
CN101140295A (zh) * 2006-09-05 2008-03-12 杰冯科技有限公司 用于互连系统的改良接触器
JP2012520461A (ja) * 2009-03-10 2012-09-06 ジョンステック インターナショナル コーポレーション マイクロ回路テスタ用の導電ピン
US8441275B1 (en) * 2010-01-14 2013-05-14 Tapt Interconnect, LLC Electronic device test fixture
JP5097968B1 (ja) * 2011-08-02 2012-12-12 株式会社クローバーテクノロジー 異方導電性部材
US9088083B2 (en) * 2012-03-07 2015-07-21 Tyco Electronics Corporation Contacts for use with an electronic device
MY188012A (en) * 2013-12-18 2021-11-09 Jf Microtechnology Sdn Bhd Compressible layer with integrated bridge in ic testing apparatus

Also Published As

Publication number Publication date
US20150168451A1 (en) 2015-06-18
MY188012A (en) 2021-11-09
KR20150071657A (ko) 2015-06-26
PH12014000368B1 (en) 2016-06-13
JP2015118098A (ja) 2015-06-25
US10488439B2 (en) 2019-11-26
US20180328963A1 (en) 2018-11-15
TW201527769A (zh) 2015-07-16
KR102311582B1 (ko) 2021-10-13
PH12014000368A1 (en) 2016-06-13
US10031163B2 (en) 2018-07-24
CN104730297A (zh) 2015-06-24

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