SE9902230D0 - Anordning vid kylning av elektroniska komponenter - Google Patents

Anordning vid kylning av elektroniska komponenter

Info

Publication number
SE9902230D0
SE9902230D0 SE9902230A SE9902230A SE9902230D0 SE 9902230 D0 SE9902230 D0 SE 9902230D0 SE 9902230 A SE9902230 A SE 9902230A SE 9902230 A SE9902230 A SE 9902230A SE 9902230 D0 SE9902230 D0 SE 9902230D0
Authority
SE
Sweden
Prior art keywords
liquid
electronic components
cooling electronic
frame
pad
Prior art date
Application number
SE9902230A
Other languages
English (en)
Other versions
SE9902230L (sv
SE518446C2 (sv
Inventor
Aake Maelhammar
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9902230A priority Critical patent/SE518446C2/sv
Publication of SE9902230D0 publication Critical patent/SE9902230D0/sv
Priority to AU58588/00A priority patent/AU5858800A/en
Priority to PCT/SE2000/001177 priority patent/WO2000078112A1/en
Publication of SE9902230L publication Critical patent/SE9902230L/sv
Priority to US10/013,830 priority patent/US6622782B2/en
Publication of SE518446C2 publication Critical patent/SE518446C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
SE9902230A 1999-06-14 1999-06-14 Anordning vid kylning av elektroniska komponenter SE518446C2 (sv)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE9902230A SE518446C2 (sv) 1999-06-14 1999-06-14 Anordning vid kylning av elektroniska komponenter
AU58588/00A AU5858800A (en) 1999-06-14 2000-06-07 A device for cooling of electronic components
PCT/SE2000/001177 WO2000078112A1 (en) 1999-06-14 2000-06-07 A device for cooling of electronic components
US10/013,830 US6622782B2 (en) 1999-06-14 2001-12-13 Device for cooling of electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9902230A SE518446C2 (sv) 1999-06-14 1999-06-14 Anordning vid kylning av elektroniska komponenter

Publications (3)

Publication Number Publication Date
SE9902230D0 true SE9902230D0 (sv) 1999-06-14
SE9902230L SE9902230L (sv) 2000-12-15
SE518446C2 SE518446C2 (sv) 2002-10-08

Family

ID=20416058

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9902230A SE518446C2 (sv) 1999-06-14 1999-06-14 Anordning vid kylning av elektroniska komponenter

Country Status (4)

Country Link
US (1) US6622782B2 (sv)
AU (1) AU5858800A (sv)
SE (1) SE518446C2 (sv)
WO (1) WO2000078112A1 (sv)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2388473B (en) * 2002-05-08 2005-09-21 Sun Microsystems Inc Compliant heat sink interface
US7167366B2 (en) * 2002-09-11 2007-01-23 Kioan Cheon Soft cooling jacket for electronic device
US20050039884A1 (en) * 2003-08-20 2005-02-24 Ivan Pawlenko Conformal heat sink
US7063127B2 (en) * 2003-09-18 2006-06-20 International Business Machines Corporation Method and apparatus for chip-cooling
JP4048435B2 (ja) * 2003-10-23 2008-02-20 ソニー株式会社 電子機器
US20060090881A1 (en) * 2004-10-29 2006-05-04 3M Innovative Properties Company Immersion cooling apparatus
US7581585B2 (en) * 2004-10-29 2009-09-01 3M Innovative Properties Company Variable position cooling apparatus
JP2007266150A (ja) * 2006-03-28 2007-10-11 Fujitsu Ltd 熱伝導性接合材、半導体パッケージ、ヒートスプレッダ、半導体チップ、及び半導体チップとヒートスプレッダとを接合する接合方法
US8176972B2 (en) * 2006-08-31 2012-05-15 International Business Machines Corporation Compliant vapor chamber chip packaging
US7995344B2 (en) * 2007-01-09 2011-08-09 Lockheed Martin Corporation High performance large tolerance heat sink
US20090084435A1 (en) * 2007-10-01 2009-04-02 International Business Machines Corporation Techniques for Cooling Solar Concentrator Devices
US8215377B1 (en) * 2009-05-06 2012-07-10 Lockheed Martin Corporation Heat transfer device with flexible cooling layer
US8776868B2 (en) 2009-08-28 2014-07-15 International Business Machines Corporation Thermal ground plane for cooling a computer
TW201209552A (en) * 2010-08-19 2012-03-01 Hon Hai Prec Ind Co Ltd Heat dissipation device
WO2015064240A1 (ja) * 2013-10-29 2015-05-07 ポリマテック・ジャパン株式会社 液体封入放熱部材

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3586102A (en) * 1969-02-17 1971-06-22 Teledyne Inc Heat sink pillow
US4279294A (en) * 1978-12-22 1981-07-21 United Technologies Corporation Heat pipe bag system
JPS5599586A (en) * 1979-01-22 1980-07-29 Nippon Telegr & Teleph Corp <Ntt> Manufacture of extra fine heat pipe
US4938279A (en) * 1988-02-05 1990-07-03 Hughes Aircraft Company Flexible membrane heat sink
JP2724033B2 (ja) * 1990-07-11 1998-03-09 株式会社日立製作所 半導体モジユール
US5245508A (en) * 1990-08-21 1993-09-14 International Business Machines Corporation Close card cooling method
JPH04206555A (ja) * 1990-11-30 1992-07-28 Hitachi Ltd 電子機器の冷却装置
US5485671A (en) * 1993-09-10 1996-01-23 Aavid Laboratories, Inc. Method of making a two-phase thermal bag component cooler
US5640303A (en) * 1995-10-30 1997-06-17 Precision Connector Designs, Inc. Interconnection apparatus for semiconductor/integrated circuit devices
AT404532B (de) * 1996-02-13 1998-12-28 Electrovac Kühlkörper für elektrische und elektronische bauelemente
JP4132154B2 (ja) * 1997-10-23 2008-08-13 ソニー株式会社 音声合成方法及び装置、並びに帯域幅拡張方法及び装置
US6227287B1 (en) * 1998-05-25 2001-05-08 Denso Corporation Cooling apparatus by boiling and cooling refrigerant
US6116331A (en) * 1998-12-10 2000-09-12 Unisys Corporation Mechanical assembly for regulating the temperature of an electronic device which incorporates a single leaf spring for self-alignment plus a low initial contact force and a low profile
US6154363A (en) * 1999-12-29 2000-11-28 Chang; Neng Chao Electronic device cooling arrangement

Also Published As

Publication number Publication date
SE9902230L (sv) 2000-12-15
SE518446C2 (sv) 2002-10-08
AU5858800A (en) 2001-01-02
US6622782B2 (en) 2003-09-23
WO2000078112A1 (en) 2000-12-21
US20020088605A1 (en) 2002-07-11

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