SE9900164D0 - Flexible microsystem and building techniques - Google Patents
Flexible microsystem and building techniquesInfo
- Publication number
- SE9900164D0 SE9900164D0 SE9900164A SE9900164A SE9900164D0 SE 9900164 D0 SE9900164 D0 SE 9900164D0 SE 9900164 A SE9900164 A SE 9900164A SE 9900164 A SE9900164 A SE 9900164A SE 9900164 D0 SE9900164 D0 SE 9900164D0
- Authority
- SE
- Sweden
- Prior art keywords
- building techniques
- microsystem
- flexible microsystem
- flexible
- components
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Materials For Medical Uses (AREA)
- Polymerisation Methods In General (AREA)
- Developing Agents For Electrophotography (AREA)
- Laminated Bodies (AREA)
- Paper (AREA)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9900164A SE9900164D0 (sv) | 1999-01-20 | 1999-01-20 | Flexible microsystem and building techniques |
DE60014062T DE60014062T2 (de) | 1999-01-20 | 2000-01-14 | Flexibles mikrosystem und herstellungstechniken |
US09/889,734 US6711024B1 (en) | 1999-01-20 | 2000-01-14 | Flexible microsystem and building techniques |
AU23369/00A AU2336900A (en) | 1999-01-20 | 2000-01-14 | Flexible microsystem and building techniques |
PCT/SE2000/000063 WO2000044208A1 (en) | 1999-01-20 | 2000-01-14 | Flexible microsystem and building techniques |
CNB008029822A CN1191743C (zh) | 1999-01-20 | 2000-01-14 | 柔性微型系统及其装配方法、以及微型机电电机 |
AT00902240T ATE277498T1 (de) | 1999-01-20 | 2000-01-14 | Flexibles mikrosystem und herstellungstechniken |
JP2000595523A JP2002539956A (ja) | 1999-01-20 | 2000-01-14 | 可撓性マイクロシステムおよび構築技術 |
EP00902240A EP1169891B1 (en) | 1999-01-20 | 2000-01-14 | Flexible microsystem and building techniques |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9900164A SE9900164D0 (sv) | 1999-01-20 | 1999-01-20 | Flexible microsystem and building techniques |
Publications (1)
Publication Number | Publication Date |
---|---|
SE9900164D0 true SE9900164D0 (sv) | 1999-01-20 |
Family
ID=20414161
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9900164A SE9900164D0 (sv) | 1999-01-20 | 1999-01-20 | Flexible microsystem and building techniques |
Country Status (9)
Country | Link |
---|---|
US (1) | US6711024B1 (xx) |
EP (1) | EP1169891B1 (xx) |
JP (1) | JP2002539956A (xx) |
CN (1) | CN1191743C (xx) |
AT (1) | ATE277498T1 (xx) |
AU (1) | AU2336900A (xx) |
DE (1) | DE60014062T2 (xx) |
SE (1) | SE9900164D0 (xx) |
WO (1) | WO2000044208A1 (xx) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6795605B1 (en) * | 2000-08-01 | 2004-09-21 | Cheetah Omni, Llc | Micromechanical optical switch |
US7145704B1 (en) * | 2003-11-25 | 2006-12-05 | Cheetah Omni, Llc | Optical logic gate based optical router |
DE10130950A1 (de) * | 2001-06-27 | 2003-01-23 | Behr Gmbh & Co | Elektromotor |
US7110671B1 (en) * | 2001-12-03 | 2006-09-19 | Cheetah Omni, Llc | Method and apparatus for scheduling communication using a star switching fabric |
US7692934B2 (en) * | 2002-07-13 | 2010-04-06 | Smiths Heimann Gmbh | Assembling/disassembling and fixing a printed circuit board |
EP1455208A1 (en) * | 2003-03-05 | 2004-09-08 | Agilent Technologies, Inc. - a Delaware corporation - | Electrical connection arrangement, component and method, for instance for high speed optical transceivers |
US7053527B2 (en) | 2003-12-18 | 2006-05-30 | Piezomotor Uppsala Ab | Electromechanical motor and assembling method therefore |
US6927344B1 (en) * | 2004-02-27 | 2005-08-09 | Motorola, Inc. | Flexible circuit board assembly |
US20050287871A1 (en) * | 2004-06-25 | 2005-12-29 | Matsushita Electric Industrial Co., Ltd. | Device, method, and program for computer aided design of flexible substrates |
JP2006100302A (ja) * | 2004-09-28 | 2006-04-13 | Sharp Corp | 高周波モジュールおよびその製造方法 |
DE102005054266B3 (de) * | 2005-11-11 | 2007-05-31 | Eads Deutschland Gmbh | Schaltfeld |
DE102007026842A1 (de) * | 2007-06-06 | 2008-12-11 | Endress + Hauser Wetzer Gmbh + Co Kg | Vorrichtung zur Bestimmung und/oder Überwachung einer Messgröße |
DE102007038054A1 (de) * | 2007-08-10 | 2009-02-26 | Vega Grieshaber Kg | Mehrteilige Platine |
DE102008017155B4 (de) * | 2008-04-03 | 2016-08-11 | Siemens Healthcare Gmbh | Haltevorrichtung für Leiterplatten auf gekrümmten Flächen |
US9428237B2 (en) | 2010-09-01 | 2016-08-30 | Peer Toftner | Motorcycle with adjustable geometry |
DE102011118577B4 (de) * | 2011-11-15 | 2016-08-04 | Epcos Ag | Kondensator-Bauteil und Verfahren zur Herstellung eines Kondensator-Bauteils |
JP2013254877A (ja) * | 2012-06-08 | 2013-12-19 | Koito Mfg Co Ltd | 光源ユニット |
JP2014063975A (ja) * | 2012-08-31 | 2014-04-10 | Nidec Copal Corp | フレキシブルプリント配線板、及びそれを備えた機器 |
CN103257370A (zh) * | 2012-09-03 | 2013-08-21 | 上海未来伙伴机器人有限公司 | 碰撞检测装置和包含其的机器人 |
WO2014088974A1 (en) | 2012-12-03 | 2014-06-12 | Flextronics Ap, Llc | Driving board folding machine |
US9674949B1 (en) | 2013-08-27 | 2017-06-06 | Flextronics Ap, Llc | Method of making stretchable interconnect using magnet wires |
US9554465B1 (en) | 2013-08-27 | 2017-01-24 | Flextronics Ap, Llc | Stretchable conductor design and methods of making |
US9338915B1 (en) | 2013-12-09 | 2016-05-10 | Flextronics Ap, Llc | Method of attaching electronic module on fabrics by stitching plated through holes |
US10015880B1 (en) | 2013-12-09 | 2018-07-03 | Multek Technologies Ltd. | Rip stop on flex and rigid flex circuits |
US9736947B1 (en) | 2013-12-16 | 2017-08-15 | Multek Technologies, Ltd. | Nano-copper via fill for enhanced thermal conductivity of plated through-hole via |
US9515049B2 (en) * | 2013-12-19 | 2016-12-06 | Intel Corporation | Flexibly-wrapped integrated circuit die |
US9560746B1 (en) | 2014-01-24 | 2017-01-31 | Multek Technologies, Ltd. | Stress relief for rigid components on flexible circuits |
US9723713B1 (en) * | 2014-05-16 | 2017-08-01 | Multek Technologies, Ltd. | Flexible printed circuit board hinge |
US9549463B1 (en) * | 2014-05-16 | 2017-01-17 | Multek Technologies, Ltd. | Rigid to flexible PC transition |
EP3067628B1 (de) * | 2015-03-12 | 2018-07-11 | Grundfos Holding A/S | Hydraulisches ventil |
US10750620B2 (en) * | 2016-12-20 | 2020-08-18 | Philips Healthcare Informatics, Inc. | Flexible circuit battery attachment devices, systems, and methods |
US10103478B1 (en) * | 2017-06-23 | 2018-10-16 | Amazon Technologies, Inc. | Water resistant connectors with conductive elements |
DE102019109575A1 (de) * | 2019-04-11 | 2020-10-15 | Valeo Schalter Und Sensoren Gmbh | Sensoreinheit für Fahrzeuge |
CN112768887B (zh) * | 2020-12-22 | 2022-09-30 | 中国船舶集团有限公司第七一一研究所 | 用于运动机构的无线传感器的天线和具有其的无线传感器 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4394707A (en) | 1981-02-26 | 1983-07-19 | Bell Telephone Laboratories, Incorporated | Electrical circuit package |
US4810917A (en) * | 1985-05-28 | 1989-03-07 | Autotech Corporation | Digital resolver/encoder assembly |
US5220488A (en) * | 1985-09-04 | 1993-06-15 | Ufe Incorporated | Injection molded printed circuits |
US4995077A (en) * | 1989-10-30 | 1991-02-19 | Malinowski Igor P | Card-like device having a microprocessor and speaker for communicating with a telephone line |
US5103375A (en) | 1990-02-05 | 1992-04-07 | Motorola, Inc. | Electronic module assembly and method of manufacture |
US5170326A (en) * | 1990-02-05 | 1992-12-08 | Motorola, Inc. | Electronic module assembly |
JP2821262B2 (ja) * | 1990-11-26 | 1998-11-05 | 株式会社日立製作所 | 電子装置 |
US5607793A (en) * | 1990-11-27 | 1997-03-04 | Alexandres; Richard B. | Flexible welding board for battery pack |
US5377263A (en) * | 1991-05-01 | 1994-12-27 | Dial One Fastcard | Telephone dialer card |
WO1996002847A1 (en) * | 1994-07-20 | 1996-02-01 | Honeywell Inc. | Miniature magnetometer |
US6118072A (en) * | 1997-12-03 | 2000-09-12 | Teledyne Technologies Incorp. | Device having a flexible circuit disposed within a conductive tube and method of making same |
-
1999
- 1999-01-20 SE SE9900164A patent/SE9900164D0/xx unknown
-
2000
- 2000-01-14 CN CNB008029822A patent/CN1191743C/zh not_active Expired - Fee Related
- 2000-01-14 EP EP00902240A patent/EP1169891B1/en not_active Expired - Lifetime
- 2000-01-14 US US09/889,734 patent/US6711024B1/en not_active Expired - Fee Related
- 2000-01-14 AU AU23369/00A patent/AU2336900A/en not_active Abandoned
- 2000-01-14 JP JP2000595523A patent/JP2002539956A/ja not_active Withdrawn
- 2000-01-14 WO PCT/SE2000/000063 patent/WO2000044208A1/en active IP Right Grant
- 2000-01-14 AT AT00902240T patent/ATE277498T1/de not_active IP Right Cessation
- 2000-01-14 DE DE60014062T patent/DE60014062T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1191743C (zh) | 2005-03-02 |
DE60014062T2 (de) | 2005-10-06 |
WO2000044208A1 (en) | 2000-07-27 |
CN1338195A (zh) | 2002-02-27 |
EP1169891B1 (en) | 2004-09-22 |
US6711024B1 (en) | 2004-03-23 |
JP2002539956A (ja) | 2002-11-26 |
DE60014062D1 (de) | 2004-10-28 |
EP1169891A1 (en) | 2002-01-09 |
ATE277498T1 (de) | 2004-10-15 |
AU2336900A (en) | 2000-08-07 |
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