SE9703128L - Förfarande och anordning i elektroniksystem - Google Patents
Förfarande och anordning i elektroniksystemInfo
- Publication number
- SE9703128L SE9703128L SE9703128A SE9703128A SE9703128L SE 9703128 L SE9703128 L SE 9703128L SE 9703128 A SE9703128 A SE 9703128A SE 9703128 A SE9703128 A SE 9703128A SE 9703128 L SE9703128 L SE 9703128L
- Authority
- SE
- Sweden
- Prior art keywords
- conductor
- air gap
- carrier
- layer
- metal layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
- H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
- Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9703128A SE512578C2 (sv) | 1997-08-29 | 1997-08-29 | Förfarande jämte anordning för att framställa ett luftgap över åtminstone en ledare på ett kretskort |
PCT/SE1998/001519 WO1999012223A1 (en) | 1997-08-29 | 1998-08-25 | A method and an arrangement in an electronics system |
AU90123/98A AU9012398A (en) | 1997-08-29 | 1998-08-25 | A method and an arrangement in an electronics system |
US09/143,436 US6230401B1 (en) | 1997-08-29 | 1998-08-28 | Method and an arrangement in an electronics system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9703128A SE512578C2 (sv) | 1997-08-29 | 1997-08-29 | Förfarande jämte anordning för att framställa ett luftgap över åtminstone en ledare på ett kretskort |
Publications (3)
Publication Number | Publication Date |
---|---|
SE9703128D0 SE9703128D0 (sv) | 1997-08-29 |
SE9703128L true SE9703128L (sv) | 1999-03-01 |
SE512578C2 SE512578C2 (sv) | 2000-04-03 |
Family
ID=20408088
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9703128A SE512578C2 (sv) | 1997-08-29 | 1997-08-29 | Förfarande jämte anordning för att framställa ett luftgap över åtminstone en ledare på ett kretskort |
Country Status (4)
Country | Link |
---|---|
US (1) | US6230401B1 (sv) |
AU (1) | AU9012398A (sv) |
SE (1) | SE512578C2 (sv) |
WO (1) | WO1999012223A1 (sv) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE523150C2 (sv) * | 2000-01-14 | 2004-03-30 | Ericsson Telefon Ab L M | Kretsmönsterkort och metod för tillverkning av kretsmönsterkort med tunt kopparskikt |
JP2002094195A (ja) * | 2000-09-12 | 2002-03-29 | Sony Corp | 信号配線基板及び信号配線基板の製造方法 |
KR100987191B1 (ko) * | 2008-04-18 | 2010-10-11 | (주)기가레인 | 신호전송라인 주위의 본딩 시트를 제거한 인쇄회로기판 |
US8201133B2 (en) * | 2008-06-17 | 2012-06-12 | International Business Machines Corporation | Printed circuit board with reduced signal distortion |
US8319113B2 (en) | 2010-06-09 | 2012-11-27 | International Buisness Machines Corporation | Printed circuit board with reduced dielectric loss |
US11527807B2 (en) * | 2018-03-07 | 2022-12-13 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Electronic device having first and second component carrier parts with cut-outs therein and adhesively joined to form a cavity that supports an electronic component therein |
CN112261802B (zh) * | 2020-11-04 | 2021-08-13 | 生益电子股份有限公司 | 一种内埋空腔的制作方法及pcb |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE512499A (sv) * | 1951-06-30 | |||
US3893231A (en) * | 1974-12-19 | 1975-07-08 | Us Navy | Technique for fabricating vacuum waveguide in the x-ray region |
FR2665578A1 (fr) * | 1990-08-03 | 1992-02-07 | Tekelec Airtronic Sa | Structure de ligne de transmission d'ondes electromagnetiques hyperfrequences du type triplaque suspendue et dispositif de multicouplage notamment de plusieurs filtres. |
NL9400165A (nl) * | 1994-02-03 | 1995-09-01 | Hollandse Signaalapparaten Bv | Transmissielijnnetwerk. |
JP3290041B2 (ja) * | 1995-02-17 | 2002-06-10 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 多層プリント基板、多層プリント基板の製造方法 |
-
1997
- 1997-08-29 SE SE9703128A patent/SE512578C2/sv not_active IP Right Cessation
-
1998
- 1998-08-25 AU AU90123/98A patent/AU9012398A/en not_active Abandoned
- 1998-08-25 WO PCT/SE1998/001519 patent/WO1999012223A1/en active Application Filing
- 1998-08-28 US US09/143,436 patent/US6230401B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
SE9703128D0 (sv) | 1997-08-29 |
US6230401B1 (en) | 2001-05-15 |
AU9012398A (en) | 1999-03-22 |
WO1999012223A1 (en) | 1999-03-11 |
SE512578C2 (sv) | 2000-04-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NUG | Patent has lapsed |