SE9702687L - Anordning och förfarande i elektroniksystem - Google Patents
Anordning och förfarande i elektroniksystemInfo
- Publication number
- SE9702687L SE9702687L SE9702687A SE9702687A SE9702687L SE 9702687 L SE9702687 L SE 9702687L SE 9702687 A SE9702687 A SE 9702687A SE 9702687 A SE9702687 A SE 9702687A SE 9702687 L SE9702687 L SE 9702687L
- Authority
- SE
- Sweden
- Prior art keywords
- printed board
- conductor
- air gap
- component
- board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10363—Jumpers, i.e. non-printed cross-over connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9702687A SE510861C2 (sv) | 1997-07-11 | 1997-07-11 | Anordning och förfarande i elektroniksystem |
AU83604/98A AU8360498A (en) | 1997-07-11 | 1998-06-26 | A device and method in electronics systems |
DE69836860T DE69836860T2 (de) | 1997-07-11 | 1998-06-26 | Hochfrequenz leiterplattenanordnung mit verbesserter signalübertragungsqualität |
EP98933992A EP0997060B1 (en) | 1997-07-11 | 1998-06-26 | High frequencies printed board assembly with improved signal transmission |
CNB988070952A CN1150808C (zh) | 1997-07-11 | 1998-06-26 | 电子线路系统中的装置与方法 |
PCT/SE1998/001164 WO1999003315A1 (en) | 1997-07-11 | 1998-06-26 | A device and method in electronics systems |
US09/113,314 US6370030B1 (en) | 1997-07-11 | 1998-07-10 | Device and method in electronics systems |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9702687A SE510861C2 (sv) | 1997-07-11 | 1997-07-11 | Anordning och förfarande i elektroniksystem |
Publications (3)
Publication Number | Publication Date |
---|---|
SE9702687D0 SE9702687D0 (sv) | 1997-07-11 |
SE9702687L true SE9702687L (sv) | 1999-01-12 |
SE510861C2 SE510861C2 (sv) | 1999-06-28 |
Family
ID=20407725
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9702687A SE510861C2 (sv) | 1997-07-11 | 1997-07-11 | Anordning och förfarande i elektroniksystem |
Country Status (7)
Country | Link |
---|---|
US (1) | US6370030B1 (sv) |
EP (1) | EP0997060B1 (sv) |
CN (1) | CN1150808C (sv) |
AU (1) | AU8360498A (sv) |
DE (1) | DE69836860T2 (sv) |
SE (1) | SE510861C2 (sv) |
WO (1) | WO1999003315A1 (sv) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4591399B2 (ja) * | 2006-04-03 | 2010-12-01 | パナソニック株式会社 | 部品接合方法ならびに部品接合構造 |
US8201133B2 (en) * | 2008-06-17 | 2012-06-12 | International Business Machines Corporation | Printed circuit board with reduced signal distortion |
US8319113B2 (en) | 2010-06-09 | 2012-11-27 | International Buisness Machines Corporation | Printed circuit board with reduced dielectric loss |
JP6070909B2 (ja) * | 2014-12-01 | 2017-02-01 | 株式会社村田製作所 | 電子機器、電気素子および電気素子用トレイ |
US10321556B2 (en) | 2016-04-29 | 2019-06-11 | Hewlett Packard Enterprise Development Lp | Air dielectric printed circuit board |
CN113015492A (zh) * | 2018-10-10 | 2021-06-22 | 马宝海德医疗有限责任公司 | 颈内动脉血栓切除装置和方法 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE512499A (sv) * | 1951-06-30 | |||
US3904997A (en) * | 1973-09-13 | 1975-09-09 | Microwave Ass | Trapped-radiation microwave transmission line |
JPS5423447A (en) * | 1977-07-25 | 1979-02-22 | Toshiba Corp | Strip line coupling circuit |
US4254383A (en) * | 1979-10-22 | 1981-03-03 | General Electric Company | Inverted microstrip phase shifter |
JPS61196564A (ja) * | 1985-02-25 | 1986-08-30 | シーメンス、アクチエンゲゼルシヤフト | フイルムキヤリヤ集積回路とその製造方法 |
IL74937A0 (en) * | 1985-04-16 | 1985-08-30 | Israel State | Microwave diode phase shifter |
US4843695A (en) * | 1987-07-16 | 1989-07-04 | Digital Equipment Corporation | Method of assembling tab bonded semiconductor chip package |
US5071787A (en) * | 1989-03-14 | 1991-12-10 | Kabushiki Kaisha Toshiba | Semiconductor device utilizing a face-down bonding and a method for manufacturing the same |
US5574629A (en) * | 1989-06-09 | 1996-11-12 | Sullivan; Kenneth W. | Solderless printed wiring devices |
US5471151A (en) * | 1990-02-14 | 1995-11-28 | Particle Interconnect, Inc. | Electrical interconnect using particle enhanced joining of metal surfaces |
WO1991013533A1 (en) * | 1990-03-01 | 1991-09-05 | Motorola, Inc. | Selectively releasing conductive runner and substrate assembly |
JPH0677632A (ja) * | 1992-02-24 | 1994-03-18 | Matsushita Electric Ind Co Ltd | 回路基板 |
DE4222474A1 (de) * | 1992-07-09 | 1994-01-13 | Bosch Gmbh Robert | Montageeinheit für Mehrlagenhybrid mit Leistungsbauelementen |
JP3265669B2 (ja) * | 1993-01-19 | 2002-03-11 | 株式会社デンソー | プリント基板 |
US5384688A (en) * | 1993-03-08 | 1995-01-24 | Calcomp Inc. | Three-dimensional circuits for digitizer and pen-based computer system pen cursors |
ZA941671B (en) * | 1993-03-11 | 1994-10-12 | Csir | Attaching an electronic circuit to a substrate. |
US5340771A (en) * | 1993-03-18 | 1994-08-23 | Lsi Logic Corporation | Techniques for providing high I/O count connections to semiconductor dies |
US5412538A (en) * | 1993-07-19 | 1995-05-02 | Cordata, Inc. | Space-saving memory module |
US5386343A (en) * | 1993-11-12 | 1995-01-31 | Ford Motor Company | Double surface mount technology for electronic packaging |
JP2541487B2 (ja) * | 1993-11-29 | 1996-10-09 | 日本電気株式会社 | 半導体装置パッケ―ジ |
US5525763A (en) * | 1994-02-28 | 1996-06-11 | Robertshaw Controls Company | Printed circuit board arrangement |
US5457318A (en) * | 1994-04-29 | 1995-10-10 | Texas Instruments Incorporated | Thermal detector apparatus and method using reduced thermal capacity |
-
1997
- 1997-07-11 SE SE9702687A patent/SE510861C2/sv not_active IP Right Cessation
-
1998
- 1998-06-26 EP EP98933992A patent/EP0997060B1/en not_active Expired - Lifetime
- 1998-06-26 WO PCT/SE1998/001164 patent/WO1999003315A1/en active IP Right Grant
- 1998-06-26 DE DE69836860T patent/DE69836860T2/de not_active Expired - Lifetime
- 1998-06-26 CN CNB988070952A patent/CN1150808C/zh not_active Expired - Lifetime
- 1998-06-26 AU AU83604/98A patent/AU8360498A/en not_active Abandoned
- 1998-07-10 US US09/113,314 patent/US6370030B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1150808C (zh) | 2004-05-19 |
WO1999003315A1 (en) | 1999-01-21 |
CN1263691A (zh) | 2000-08-16 |
EP0997060B1 (en) | 2007-01-10 |
DE69836860D1 (de) | 2007-02-22 |
US6370030B1 (en) | 2002-04-09 |
AU8360498A (en) | 1999-02-08 |
SE510861C2 (sv) | 1999-06-28 |
SE9702687D0 (sv) | 1997-07-11 |
DE69836860T2 (de) | 2007-11-22 |
EP0997060A1 (en) | 2000-05-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NUG | Patent has lapsed |