SE9701154D0 - Plan trenches - Google Patents
Plan trenchesInfo
- Publication number
- SE9701154D0 SE9701154D0 SE9701154A SE9701154A SE9701154D0 SE 9701154 D0 SE9701154 D0 SE 9701154D0 SE 9701154 A SE9701154 A SE 9701154A SE 9701154 A SE9701154 A SE 9701154A SE 9701154 D0 SE9701154 D0 SE 9701154D0
- Authority
- SE
- Sweden
- Prior art keywords
- trenches
- plan
- regions
- extra
- polysilicon
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/763—Polycrystalline semiconductor regions
Abstract
Method for improving the topography over trench structures in which the provision of extra poly-semiconductor material e.g. polysilicon 20 or nitrate or oxide in the regions of the trench edges and, if necessary, the subsequent oxidation of the extra material prevents the occurrence of regions of high mechanical stress.
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9701154A SE520115C2 (en) | 1997-03-26 | 1997-03-26 | The ditch with flat top |
TW086105057A TW356579B (en) | 1997-03-26 | 1997-04-18 | Planar trenches |
JP54556198A JP2001519097A (en) | 1997-03-26 | 1998-03-23 | Manufacturing method of planar trench |
CN98805442A CN1110848C (en) | 1997-03-26 | 1998-03-23 | Method for producing planar trenches |
CA002285627A CA2285627A1 (en) | 1997-03-26 | 1998-03-23 | Method for producing planar trenches |
AU67539/98A AU6753998A (en) | 1997-03-26 | 1998-03-23 | Method for producing planar trenches |
EP98912851A EP1018156A1 (en) | 1997-03-26 | 1998-03-23 | Method for producing planar trenches |
KR10-1999-7008655A KR100374455B1 (en) | 1997-03-26 | 1998-03-23 | Method for producing planar trenches |
PCT/SE1998/000528 WO1998043293A1 (en) | 1997-03-26 | 1998-03-23 | Method for producing planar trenches |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9701154A SE520115C2 (en) | 1997-03-26 | 1997-03-26 | The ditch with flat top |
Publications (3)
Publication Number | Publication Date |
---|---|
SE9701154D0 true SE9701154D0 (en) | 1997-03-26 |
SE9701154L SE9701154L (en) | 1998-09-27 |
SE520115C2 SE520115C2 (en) | 2003-05-27 |
Family
ID=20406360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9701154A SE520115C2 (en) | 1997-03-26 | 1997-03-26 | The ditch with flat top |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP1018156A1 (en) |
JP (1) | JP2001519097A (en) |
KR (1) | KR100374455B1 (en) |
CN (1) | CN1110848C (en) |
AU (1) | AU6753998A (en) |
CA (1) | CA2285627A1 (en) |
SE (1) | SE520115C2 (en) |
TW (1) | TW356579B (en) |
WO (1) | WO1998043293A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6498383B2 (en) * | 2001-05-23 | 2002-12-24 | International Business Machines Corporation | Oxynitride shallow trench isolation and method of formation |
US6461936B1 (en) * | 2002-01-04 | 2002-10-08 | Infineon Technologies Ag | Double pullback method of filling an isolation trench |
JP2008028357A (en) | 2006-07-24 | 2008-02-07 | Hynix Semiconductor Inc | Semiconductor device and method for manufacturing the same |
JP4717122B2 (en) * | 2009-01-13 | 2011-07-06 | 三菱電機株式会社 | Method for manufacturing thin film solar cell |
CN102468176B (en) * | 2010-11-19 | 2013-12-18 | 上海华虹Nec电子有限公司 | Method for making longitudinal region of super junction device |
CN103822735A (en) * | 2012-11-16 | 2014-05-28 | 无锡华润上华半导体有限公司 | Wafer structure for pressure sensors and processing method of water structure |
CN107507773B (en) * | 2016-06-14 | 2021-09-17 | 格科微电子(上海)有限公司 | Method for optimizing transistor structure of CMOS image sensor |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2207281B (en) * | 1987-07-24 | 1992-02-05 | Plessey Co Plc | A method of providing refilled trenches |
US5175122A (en) * | 1991-06-28 | 1992-12-29 | Digital Equipment Corporation | Planarization process for trench isolation in integrated circuit manufacture |
US5561073A (en) * | 1992-03-13 | 1996-10-01 | Jerome; Rick C. | Method of fabricating an isolation trench for analog bipolar devices in harsh environments |
US5627092A (en) * | 1994-09-26 | 1997-05-06 | Siemens Aktiengesellschaft | Deep trench dram process on SOI for low leakage DRAM cell |
US5683945A (en) * | 1996-05-16 | 1997-11-04 | Siemens Aktiengesellschaft | Uniform trench fill recess by means of isotropic etching |
-
1997
- 1997-03-26 SE SE9701154A patent/SE520115C2/en not_active IP Right Cessation
- 1997-04-18 TW TW086105057A patent/TW356579B/en active
-
1998
- 1998-03-23 JP JP54556198A patent/JP2001519097A/en not_active Abandoned
- 1998-03-23 EP EP98912851A patent/EP1018156A1/en not_active Withdrawn
- 1998-03-23 CN CN98805442A patent/CN1110848C/en not_active Expired - Fee Related
- 1998-03-23 WO PCT/SE1998/000528 patent/WO1998043293A1/en active IP Right Grant
- 1998-03-23 CA CA002285627A patent/CA2285627A1/en not_active Abandoned
- 1998-03-23 AU AU67539/98A patent/AU6753998A/en not_active Abandoned
- 1998-03-23 KR KR10-1999-7008655A patent/KR100374455B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100374455B1 (en) | 2003-03-04 |
SE9701154L (en) | 1998-09-27 |
WO1998043293A1 (en) | 1998-10-01 |
AU6753998A (en) | 1998-10-20 |
CA2285627A1 (en) | 1998-10-01 |
TW356579B (en) | 1999-04-21 |
EP1018156A1 (en) | 2000-07-12 |
JP2001519097A (en) | 2001-10-16 |
CN1110848C (en) | 2003-06-04 |
CN1257609A (en) | 2000-06-21 |
KR20010005591A (en) | 2001-01-15 |
SE520115C2 (en) | 2003-05-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NUG | Patent has lapsed |