SE9604345L - Förfarande och anordning för att montera en komponent på en bärare - Google Patents

Förfarande och anordning för att montera en komponent på en bärare

Info

Publication number
SE9604345L
SE9604345L SE9604345A SE9604345A SE9604345L SE 9604345 L SE9604345 L SE 9604345L SE 9604345 A SE9604345 A SE 9604345A SE 9604345 A SE9604345 A SE 9604345A SE 9604345 L SE9604345 L SE 9604345L
Authority
SE
Sweden
Prior art keywords
component
leads
board
carrier
mounting
Prior art date
Application number
SE9604345A
Other languages
English (en)
Other versions
SE516207C2 (sv
SE9604345D0 (sv
Inventor
Eva Hellgren
Mats Eriksson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9604345A priority Critical patent/SE516207C2/sv
Publication of SE9604345D0 publication Critical patent/SE9604345D0/sv
Priority to TW085115743A priority patent/TW503682B/zh
Priority to EP97850147A priority patent/EP0844811B1/en
Priority to DE69730801T priority patent/DE69730801T2/de
Priority to US08/977,235 priority patent/US6010920A/en
Priority to CA002222319A priority patent/CA2222319A1/en
Priority to BR9705908A priority patent/BR9705908A/pt
Publication of SE9604345L publication Critical patent/SE9604345L/sv
Priority to US09/442,034 priority patent/US6268651B1/en
Publication of SE516207C2 publication Critical patent/SE516207C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10454—Vertically mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10696—Single-in-line [SIL] package
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multi-Conductor Connections (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
SE9604345A 1996-11-26 1996-11-26 Förfarande och anordning för att ytmontera en komponent stående på en bärare SE516207C2 (sv)

Priority Applications (8)

Application Number Priority Date Filing Date Title
SE9604345A SE516207C2 (sv) 1996-11-26 1996-11-26 Förfarande och anordning för att ytmontera en komponent stående på en bärare
TW085115743A TW503682B (en) 1996-11-26 1996-12-20 Method and device for mounting a component on a carrier
EP97850147A EP0844811B1 (en) 1996-11-26 1997-10-24 A method and an arrangement for mounting a component on a carrier
DE69730801T DE69730801T2 (de) 1996-11-26 1997-10-24 Verfahren und Anordnung zur Montage einer Komponente auf einem Träger
US08/977,235 US6010920A (en) 1996-11-26 1997-11-24 Method and an arrangement for mounting a component on a carrier
CA002222319A CA2222319A1 (en) 1996-11-26 1997-11-25 A method and an arrangement for mounting a component on a carrier
BR9705908A BR9705908A (pt) 1996-11-26 1997-11-26 Processo e disposição para montagem em superfície de um componente ereto em um transportador
US09/442,034 US6268651B1 (en) 1996-11-26 1999-11-17 Arrangement for mounting a component upstanding on a carrier with surface mounted leads

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9604345A SE516207C2 (sv) 1996-11-26 1996-11-26 Förfarande och anordning för att ytmontera en komponent stående på en bärare

Publications (3)

Publication Number Publication Date
SE9604345D0 SE9604345D0 (sv) 1996-11-26
SE9604345L true SE9604345L (sv) 1998-05-27
SE516207C2 SE516207C2 (sv) 2001-12-03

Family

ID=20404761

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9604345A SE516207C2 (sv) 1996-11-26 1996-11-26 Förfarande och anordning för att ytmontera en komponent stående på en bärare

Country Status (7)

Country Link
US (2) US6010920A (sv)
EP (1) EP0844811B1 (sv)
BR (1) BR9705908A (sv)
CA (1) CA2222319A1 (sv)
DE (1) DE69730801T2 (sv)
SE (1) SE516207C2 (sv)
TW (1) TW503682B (sv)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6087723A (en) * 1998-03-30 2000-07-11 Micron Technology, Inc. Vertical surface mount assembly and methods
US5990566A (en) * 1998-05-20 1999-11-23 Micron Technology, Inc. High density semiconductor package
JP3871486B2 (ja) * 1999-02-17 2007-01-24 株式会社ルネサステクノロジ 半導体装置
US6552275B2 (en) * 2001-04-16 2003-04-22 Intel Corporation Surface mount component
US6651869B2 (en) 2001-09-21 2003-11-25 Intel Corporation Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering
US20030129121A1 (en) * 2002-01-04 2003-07-10 Conoco Inc. Integrated oxidative dehydrogenation/carbon filament production process and reactor therefor
US7236677B2 (en) * 2004-11-24 2007-06-26 Corning Cable Systems Llc Optical fiber distribution apparatus
FR2909832A1 (fr) * 2006-12-08 2008-06-13 Thales Sa Procede d'adaptation d'un composant electronique au montage en surface
US8837141B2 (en) * 2012-10-17 2014-09-16 Microelectronics Assembly Technologies Electronic module with heat spreading enclosure
US20140104776A1 (en) * 2012-10-17 2014-04-17 James E. Clayton Rigid circuit board with flexibly attached module
US11152288B2 (en) 2019-04-25 2021-10-19 Infineon Technologies Ag Lead frames for semiconductor packages

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2911609A (en) * 1955-09-29 1959-11-03 Horatio H Burtt Printed circuit card connector
DE1257235B (de) * 1965-02-23 1967-12-28 Buchungsmaschinenwerk Veb Baueinheit mit in mehreren Ebenen angeordneten gedruckten Leiterplatten
NL165906C (nl) * 1971-04-09 1981-05-15 Philips Nv Werkwijze voor het monteren van een aantal elektrische onderdelen op een montagepaneel, alsmede elektrisch on- derdeel geschikt voor het uitvoeren van de werkwijze.
DE2459307C3 (de) * 1974-12-14 1980-01-31 Stocko Metallwarenfabriken Henkels Und Sohn Gmbh & Co, 5600 Wuppertal Elektrische Steckvorrichtung für integrierte Dickschichtschaltungen
SE387816B (sv) * 1975-09-05 1976-09-13 Ericsson Telefon Ab L M Hallare for montering av staende komponenter
JP2674419B2 (ja) * 1992-04-27 1997-11-12 日本電気株式会社 半導体装置のリード成形方法及び装置
JP3093476B2 (ja) * 1992-08-31 2000-10-03 ローム株式会社 電子部品およびその実装方法
JP2565091B2 (ja) * 1993-07-01 1996-12-18 日本電気株式会社 半導体装置およびその製造方法
JPH07249723A (ja) * 1994-03-11 1995-09-26 Fujitsu Miyagi Electron:Kk 半導体装置の実装構造及び半導体装置の実装方法及びリードフレーム
US5518964A (en) * 1994-07-07 1996-05-21 Tessera, Inc. Microelectronic mounting with multiple lead deformation and bonding
US5629839A (en) * 1995-09-12 1997-05-13 Allen-Bradley Company, Inc. Module interconnect adapter for reduced parasitic inductance

Also Published As

Publication number Publication date
CA2222319A1 (en) 1998-05-26
US6010920A (en) 2000-01-04
DE69730801D1 (de) 2004-10-28
TW503682B (en) 2002-09-21
US6268651B1 (en) 2001-07-31
EP0844811A2 (en) 1998-05-27
SE516207C2 (sv) 2001-12-03
EP0844811A3 (en) 1999-12-01
DE69730801T2 (de) 2006-02-23
BR9705908A (pt) 1999-08-03
SE9604345D0 (sv) 1996-11-26
EP0844811B1 (en) 2004-09-22

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Legal Events

Date Code Title Description
NUG Patent has lapsed