SE8203371L - Elektropleteringskomposition for avsettning av glensande metalliskt tenn eller legeringar av tenn med koppar eller rodium - Google Patents

Elektropleteringskomposition for avsettning av glensande metalliskt tenn eller legeringar av tenn med koppar eller rodium

Info

Publication number
SE8203371L
SE8203371L SE8203371A SE8203371A SE8203371L SE 8203371 L SE8203371 L SE 8203371L SE 8203371 A SE8203371 A SE 8203371A SE 8203371 A SE8203371 A SE 8203371A SE 8203371 L SE8203371 L SE 8203371L
Authority
SE
Sweden
Prior art keywords
tin
bath
deposition
electropleting
rodium
Prior art date
Application number
SE8203371A
Other languages
Unknown language ( )
English (en)
Swedish (sv)
Inventor
R J Teichmann
L J Mayer
Original Assignee
Hooker Chemicals Plastics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hooker Chemicals Plastics Corp filed Critical Hooker Chemicals Plastics Corp
Publication of SE8203371L publication Critical patent/SE8203371L/

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/30Electroplating: Baths therefor from solutions of tin
    • C25D3/32Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
SE8203371A 1981-06-16 1982-06-01 Elektropleteringskomposition for avsettning av glensande metalliskt tenn eller legeringar av tenn med koppar eller rodium SE8203371L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/274,084 US4381228A (en) 1981-06-16 1981-06-16 Process and composition for the electrodeposition of tin and tin alloys

Publications (1)

Publication Number Publication Date
SE8203371L true SE8203371L (sv) 1982-12-17

Family

ID=23046699

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8203371A SE8203371L (sv) 1981-06-16 1982-06-01 Elektropleteringskomposition for avsettning av glensande metalliskt tenn eller legeringar av tenn med koppar eller rodium

Country Status (12)

Country Link
US (1) US4381228A (es)
JP (1) JPS57207189A (es)
BE (1) BE893533A (es)
BR (1) BR8203500A (es)
CA (1) CA1193224A (es)
DE (1) DE3212118A1 (es)
ES (1) ES8307930A1 (es)
FR (1) FR2507631A1 (es)
GB (1) GB2101634B (es)
IT (1) IT8248259A0 (es)
NL (1) NL8201584A (es)
SE (1) SE8203371L (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01242795A (ja) * 1988-03-24 1989-09-27 Okuno Seiyaku Kogyo Kk 錫−鉛合金めっき浴
JP2803212B2 (ja) * 1989-09-06 1998-09-24 凸版印刷株式会社 錫―鉛系めっき液
US6620460B2 (en) 1992-04-15 2003-09-16 Jet-Lube, Inc. Methods for using environmentally friendly anti-seize/lubricating systems
US5385661A (en) * 1993-09-17 1995-01-31 International Business Machines Corporation Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition
EP1091023A3 (en) * 1999-10-08 2003-05-14 Shipley Company LLC Alloy composition and plating method
US20020166774A1 (en) * 1999-12-10 2002-11-14 Shipley Company, L.L.C. Alloy composition and plating method
GB0106131D0 (en) * 2001-03-13 2001-05-02 Macdermid Plc Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys
ATE507327T1 (de) * 2006-01-06 2011-05-15 Enthone Elektrolyt und verfahren zur abscheidung einer matten metallschicht
CN104087982A (zh) * 2014-06-17 2014-10-08 宁国新博能电子有限公司 一种电解液
KR101636361B1 (ko) * 2014-07-31 2016-07-06 주식회사 에이피씨티 과불소화알킬 계면활성제를 함유하는 솔더범프용 주석합금 전기도금액

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3002901A (en) * 1959-09-08 1961-10-03 Metal & Thermit Corp Electroplating process and bath
NL266076A (es) * 1960-06-17
US3677907A (en) * 1969-06-19 1972-07-18 Udylite Corp Codeposition of a metal and fluorocarbon resin particles
US3917486A (en) * 1973-07-24 1975-11-04 Kollmorgen Photocircuits Immersion tin bath composition and process for using same
US4139425A (en) * 1978-04-05 1979-02-13 R. O. Hull & Company, Inc. Composition, plating bath, and method for electroplating tin and/or lead
ATE436T1 (de) * 1978-06-06 1981-12-15 Akzo N.V. Verfahren zum absetzen von anorganische partikel enthaltenden zusammengesetzten schichten aus einem elektrolytischen bad.

Also Published As

Publication number Publication date
CA1193224A (en) 1985-09-10
ES513126A0 (es) 1983-08-01
FR2507631B1 (es) 1984-11-30
BE893533A (fr) 1982-12-16
JPS57207189A (en) 1982-12-18
IT8248259A0 (it) 1982-04-21
BR8203500A (pt) 1983-06-07
GB2101634B (en) 1984-12-12
US4381228A (en) 1983-04-26
FR2507631A1 (fr) 1982-12-17
DE3212118A1 (de) 1982-12-30
ES8307930A1 (es) 1983-08-01
NL8201584A (nl) 1983-01-17
GB2101634A (en) 1983-01-19

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