SE7802067L - Med vetska arbetande kylkropp serskilt for kylning av effekthalvledarkomponenter - Google Patents
Med vetska arbetande kylkropp serskilt for kylning av effekthalvledarkomponenterInfo
- Publication number
- SE7802067L SE7802067L SE7802067A SE7802067A SE7802067L SE 7802067 L SE7802067 L SE 7802067L SE 7802067 A SE7802067 A SE 7802067A SE 7802067 A SE7802067 A SE 7802067A SE 7802067 L SE7802067 L SE 7802067L
- Authority
- SE
- Sweden
- Prior art keywords
- salificer
- cooling
- components
- power
- screen working
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CS772935A CS191622B1 (en) | 1977-05-04 | 1977-05-04 | Liquid operable cooler,especially for both-sidedly cooled semiconductor power elements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE7802067L true SE7802067L (sv) | 1978-11-05 |
Family
ID=5367943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE7802067A SE7802067L (sv) | 1977-05-04 | 1978-02-22 | Med vetska arbetande kylkropp serskilt for kylning av effekthalvledarkomponenter |
Country Status (5)
| Country | Link |
|---|---|
| CH (1) | CH627026A5 (cs) |
| CS (1) | CS191622B1 (cs) |
| DE (1) | DE2814809C2 (cs) |
| PL (1) | PL115439B2 (cs) |
| SE (1) | SE7802067L (cs) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2826898A1 (de) * | 1978-06-19 | 1980-01-03 | Siemens Ag | Kuehlkoerper fuer elektrische bauelemente |
| CH654694A5 (de) * | 1981-09-01 | 1986-02-28 | Bbc Brown Boveri & Cie | Verfahren zur kuehlung von halbleiterelementen und kuehler zur durchfuehrung des verfahrens. |
| CS233062B1 (en) * | 1983-04-20 | 1985-02-14 | Vladimir Motycka | Liquid cooler for power semiconductor elements cooling |
| EP0144579B1 (de) * | 1983-11-02 | 1987-10-14 | BBC Brown Boveri AG | Kühlkörper zur Flüssigkeitskühlung von Leistungshalbleiterbauelementen |
| DE4017749C2 (de) * | 1989-03-18 | 1993-12-16 | Abb Patent Gmbh | Verfahren zur Herstellung eines Flüssigkeitskühlkörpers aus elektrisch isolierendem Material |
| DE3908996C2 (de) * | 1989-03-18 | 1993-09-30 | Abb Patent Gmbh | Verfahren zur Herstellung eines Flüssigkeitskühlkörpers |
| DE3937130A1 (de) * | 1989-11-08 | 1990-05-31 | Asea Brown Boveri | Dosenkuehlvorrichtung |
| DE4121534C2 (de) * | 1990-06-30 | 1998-10-08 | Toshiba Kawasaki Kk | Kühlvorrichtung |
| DE4131739C2 (de) * | 1991-09-24 | 1996-12-19 | Behr Industrietech Gmbh & Co | Kühleinrichtung für elektrische Bauelemente |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3361195A (en) * | 1966-09-23 | 1968-01-02 | Westinghouse Electric Corp | Heat sink member for a semiconductor device |
-
1977
- 1977-05-04 CS CS772935A patent/CS191622B1/cs unknown
-
1978
- 1978-01-27 CH CH93378A patent/CH627026A5/de not_active IP Right Cessation
- 1978-02-22 SE SE7802067A patent/SE7802067L/xx unknown
- 1978-04-05 DE DE2814809A patent/DE2814809C2/de not_active Expired
- 1978-05-03 PL PL1978206554A patent/PL115439B2/pl unknown
Also Published As
| Publication number | Publication date |
|---|---|
| PL115439B2 (en) | 1981-04-30 |
| CH627026A5 (en) | 1981-12-15 |
| CS191622B1 (en) | 1979-07-31 |
| DE2814809A1 (de) | 1978-11-16 |
| PL206554A1 (pl) | 1979-02-12 |
| DE2814809C2 (de) | 1983-11-24 |
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