SE7802067L - Med vetska arbetande kylkropp serskilt for kylning av effekthalvledarkomponenter - Google Patents

Med vetska arbetande kylkropp serskilt for kylning av effekthalvledarkomponenter

Info

Publication number
SE7802067L
SE7802067L SE7802067A SE7802067A SE7802067L SE 7802067 L SE7802067 L SE 7802067L SE 7802067 A SE7802067 A SE 7802067A SE 7802067 A SE7802067 A SE 7802067A SE 7802067 L SE7802067 L SE 7802067L
Authority
SE
Sweden
Prior art keywords
salificer
cooling
components
power
screen working
Prior art date
Application number
SE7802067A
Other languages
English (en)
Swedish (sv)
Inventor
M Pellant
J Zuna
P Novak
Z Zacazal
J Kratina
P Reichel
P Kafunek
Original Assignee
Ckd Praha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ckd Praha filed Critical Ckd Praha
Publication of SE7802067L publication Critical patent/SE7802067L/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3677Wire-like or pin-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
SE7802067A 1977-05-04 1978-02-22 Med vetska arbetande kylkropp serskilt for kylning av effekthalvledarkomponenter SE7802067L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS772935A CS191622B1 (en) 1977-05-04 1977-05-04 Liquid operable cooler,especially for both-sidedly cooled semiconductor power elements

Publications (1)

Publication Number Publication Date
SE7802067L true SE7802067L (sv) 1978-11-05

Family

ID=5367943

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7802067A SE7802067L (sv) 1977-05-04 1978-02-22 Med vetska arbetande kylkropp serskilt for kylning av effekthalvledarkomponenter

Country Status (5)

Country Link
CH (1) CH627026A5 (xx)
CS (1) CS191622B1 (xx)
DE (1) DE2814809C2 (xx)
PL (1) PL115439B2 (xx)
SE (1) SE7802067L (xx)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2826898A1 (de) * 1978-06-19 1980-01-03 Siemens Ag Kuehlkoerper fuer elektrische bauelemente
CH654694A5 (de) * 1981-09-01 1986-02-28 Bbc Brown Boveri & Cie Verfahren zur kuehlung von halbleiterelementen und kuehler zur durchfuehrung des verfahrens.
CS233062B1 (en) * 1983-04-20 1985-02-14 Vladimir Motycka Liquid cooler for power semiconductor elements cooling
DE3466833D1 (en) * 1983-11-02 1987-11-19 Bbc Brown Boveri & Cie Cooling body for the liquid cooling of power semiconductor devices
DE3908996C2 (de) * 1989-03-18 1993-09-30 Abb Patent Gmbh Verfahren zur Herstellung eines Flüssigkeitskühlkörpers
DE4017749C2 (de) * 1989-03-18 1993-12-16 Abb Patent Gmbh Verfahren zur Herstellung eines Flüssigkeitskühlkörpers aus elektrisch isolierendem Material
DE3937130A1 (de) * 1989-11-08 1990-05-31 Asea Brown Boveri Dosenkuehlvorrichtung
DE4121534C2 (de) * 1990-06-30 1998-10-08 Toshiba Kawasaki Kk Kühlvorrichtung
DE4131739C2 (de) * 1991-09-24 1996-12-19 Behr Industrietech Gmbh & Co Kühleinrichtung für elektrische Bauelemente

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3361195A (en) * 1966-09-23 1968-01-02 Westinghouse Electric Corp Heat sink member for a semiconductor device

Also Published As

Publication number Publication date
PL115439B2 (en) 1981-04-30
CS191622B1 (en) 1979-07-31
DE2814809C2 (de) 1983-11-24
CH627026A5 (en) 1981-12-15
PL206554A1 (pl) 1979-02-12
DE2814809A1 (de) 1978-11-16

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