CS191622B1 - Liquid operable cooler,especially for both-sidedly cooled semiconductor power elements - Google Patents

Liquid operable cooler,especially for both-sidedly cooled semiconductor power elements

Info

Publication number
CS191622B1
CS191622B1 CS772935A CS293577A CS191622B1 CS 191622 B1 CS191622 B1 CS 191622B1 CS 772935 A CS772935 A CS 772935A CS 293577 A CS293577 A CS 293577A CS 191622 B1 CS191622 B1 CS 191622B1
Authority
CS
Czechoslovakia
Prior art keywords
sidedly
cooler
semiconductor power
power elements
cooled semiconductor
Prior art date
Application number
CS772935A
Other languages
English (en)
Inventor
Michal Pellant
Jaroslav Zuna
Petr Novak
Zdenek Zavazal
Jindrich Kratina
Pavel Reichel
Pavel Kafunek
Original Assignee
Michal Pellant
Jaroslav Zuna
Petr Novak
Zdenek Zavazal
Jindrich Kratina
Pavel Reichel
Pavel Kafunek
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Michal Pellant, Jaroslav Zuna, Petr Novak, Zdenek Zavazal, Jindrich Kratina, Pavel Reichel, Pavel Kafunek filed Critical Michal Pellant
Priority to CS772935A priority Critical patent/CS191622B1/cs
Priority to CH93378A priority patent/CH627026A5/de
Priority to SE7802067A priority patent/SE7802067L/xx
Priority to DE2814809A priority patent/DE2814809C2/de
Priority to PL1978206554A priority patent/PL115439B2/pl
Publication of CS191622B1 publication Critical patent/CS191622B1/cs

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CS772935A 1977-05-04 1977-05-04 Liquid operable cooler,especially for both-sidedly cooled semiconductor power elements CS191622B1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CS772935A CS191622B1 (en) 1977-05-04 1977-05-04 Liquid operable cooler,especially for both-sidedly cooled semiconductor power elements
CH93378A CH627026A5 (en) 1977-05-04 1978-01-27 Liquid-cooling appliance for cooling a semiconductor component, especially a power semiconductor component
SE7802067A SE7802067L (sv) 1977-05-04 1978-02-22 Med vetska arbetande kylkropp serskilt for kylning av effekthalvledarkomponenter
DE2814809A DE2814809C2 (de) 1977-05-04 1978-04-05 Kühlkörper zur Flüssigkeitskühlung eines Halbleiterbauelementes
PL1978206554A PL115439B2 (en) 1977-05-04 1978-05-03 Housing for liquid cooling,in particular cooling of semiconductor constructional components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS772935A CS191622B1 (en) 1977-05-04 1977-05-04 Liquid operable cooler,especially for both-sidedly cooled semiconductor power elements

Publications (1)

Publication Number Publication Date
CS191622B1 true CS191622B1 (en) 1979-07-31

Family

ID=5367943

Family Applications (1)

Application Number Title Priority Date Filing Date
CS772935A CS191622B1 (en) 1977-05-04 1977-05-04 Liquid operable cooler,especially for both-sidedly cooled semiconductor power elements

Country Status (5)

Country Link
CH (1) CH627026A5 (cs)
CS (1) CS191622B1 (cs)
DE (1) DE2814809C2 (cs)
PL (1) PL115439B2 (cs)
SE (1) SE7802067L (cs)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2826898A1 (de) * 1978-06-19 1980-01-03 Siemens Ag Kuehlkoerper fuer elektrische bauelemente
CH654694A5 (de) * 1981-09-01 1986-02-28 Bbc Brown Boveri & Cie Verfahren zur kuehlung von halbleiterelementen und kuehler zur durchfuehrung des verfahrens.
CS233062B1 (en) * 1983-04-20 1985-02-14 Vladimir Motycka Liquid cooler for power semiconductor elements cooling
EP0144579B1 (de) * 1983-11-02 1987-10-14 BBC Brown Boveri AG Kühlkörper zur Flüssigkeitskühlung von Leistungshalbleiterbauelementen
DE4017749C2 (de) * 1989-03-18 1993-12-16 Abb Patent Gmbh Verfahren zur Herstellung eines Flüssigkeitskühlkörpers aus elektrisch isolierendem Material
DE3908996C2 (de) * 1989-03-18 1993-09-30 Abb Patent Gmbh Verfahren zur Herstellung eines Flüssigkeitskühlkörpers
DE3937130A1 (de) * 1989-11-08 1990-05-31 Asea Brown Boveri Dosenkuehlvorrichtung
DE4121534C2 (de) * 1990-06-30 1998-10-08 Toshiba Kawasaki Kk Kühlvorrichtung
DE4131739C2 (de) * 1991-09-24 1996-12-19 Behr Industrietech Gmbh & Co Kühleinrichtung für elektrische Bauelemente

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3361195A (en) * 1966-09-23 1968-01-02 Westinghouse Electric Corp Heat sink member for a semiconductor device

Also Published As

Publication number Publication date
PL115439B2 (en) 1981-04-30
CH627026A5 (en) 1981-12-15
SE7802067L (sv) 1978-11-05
DE2814809A1 (de) 1978-11-16
PL206554A1 (pl) 1979-02-12
DE2814809C2 (de) 1983-11-24

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