SE7802067L - WITH SCREEN WORKING COOLER SPECIAL FOR COOLING OF POWER SALIFICER COMPONENTS - Google Patents

WITH SCREEN WORKING COOLER SPECIAL FOR COOLING OF POWER SALIFICER COMPONENTS

Info

Publication number
SE7802067L
SE7802067L SE7802067A SE7802067A SE7802067L SE 7802067 L SE7802067 L SE 7802067L SE 7802067 A SE7802067 A SE 7802067A SE 7802067 A SE7802067 A SE 7802067A SE 7802067 L SE7802067 L SE 7802067L
Authority
SE
Sweden
Prior art keywords
salificer
cooling
components
power
screen working
Prior art date
Application number
SE7802067A
Other languages
Swedish (sv)
Inventor
M Pellant
J Zuna
P Novak
Z Zacazal
J Kratina
P Reichel
P Kafunek
Original Assignee
Ckd Praha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ckd Praha filed Critical Ckd Praha
Publication of SE7802067L publication Critical patent/SE7802067L/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
SE7802067A 1977-05-04 1978-02-22 WITH SCREEN WORKING COOLER SPECIAL FOR COOLING OF POWER SALIFICER COMPONENTS SE7802067L (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS772935A CS191622B1 (en) 1977-05-04 1977-05-04 Liquid operable cooler,especially for both-sidedly cooled semiconductor power elements

Publications (1)

Publication Number Publication Date
SE7802067L true SE7802067L (en) 1978-11-05

Family

ID=5367943

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7802067A SE7802067L (en) 1977-05-04 1978-02-22 WITH SCREEN WORKING COOLER SPECIAL FOR COOLING OF POWER SALIFICER COMPONENTS

Country Status (5)

Country Link
CH (1) CH627026A5 (en)
CS (1) CS191622B1 (en)
DE (1) DE2814809C2 (en)
PL (1) PL115439B2 (en)
SE (1) SE7802067L (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2826898A1 (en) * 1978-06-19 1980-01-03 Siemens Ag HEAT SINK FOR ELECTRICAL COMPONENTS
CH654694A5 (en) * 1981-09-01 1986-02-28 Bbc Brown Boveri & Cie METHOD OF COOLING SEMICONDUCTOR ELEMENTS AND RADIATORS FOR CARRYING OUT THE METHOD.
CS233062B1 (en) * 1983-04-20 1985-02-14 Vladimir Motycka Liquid cooler for power semiconductor elements cooling
DE3466833D1 (en) * 1983-11-02 1987-11-19 Bbc Brown Boveri & Cie Cooling body for the liquid cooling of power semiconductor devices
DE3908996C2 (en) * 1989-03-18 1993-09-30 Abb Patent Gmbh Method of manufacturing a liquid heat sink
DE4017749C2 (en) * 1989-03-18 1993-12-16 Abb Patent Gmbh Method of manufacturing a liquid heat sink from an electrically insulating material
DE3937130A1 (en) * 1989-11-08 1990-05-31 Asea Brown Boveri Box-type cooler - for power semiconductor modules insulated by layer of specified plastic material
DE4121534C2 (en) * 1990-06-30 1998-10-08 Toshiba Kawasaki Kk Cooler
DE4131739C2 (en) * 1991-09-24 1996-12-19 Behr Industrietech Gmbh & Co Cooling device for electrical components

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3361195A (en) * 1966-09-23 1968-01-02 Westinghouse Electric Corp Heat sink member for a semiconductor device

Also Published As

Publication number Publication date
PL115439B2 (en) 1981-04-30
CS191622B1 (en) 1979-07-31
DE2814809C2 (en) 1983-11-24
CH627026A5 (en) 1981-12-15
PL206554A1 (en) 1979-02-12
DE2814809A1 (en) 1978-11-16

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