SE7512496L - Metallbeleggningsbad samt forfarande for stabilisering av detta - Google Patents

Metallbeleggningsbad samt forfarande for stabilisering av detta

Info

Publication number
SE7512496L
SE7512496L SE7512496A SE7512496A SE7512496L SE 7512496 L SE7512496 L SE 7512496L SE 7512496 A SE7512496 A SE 7512496A SE 7512496 A SE7512496 A SE 7512496A SE 7512496 L SE7512496 L SE 7512496L
Authority
SE
Sweden
Prior art keywords
stabilizing
procedures
metal coating
coating bath
bath
Prior art date
Application number
SE7512496A
Other languages
English (en)
Inventor
M Gulla
C A Gaputis
Original Assignee
Shipley Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co filed Critical Shipley Co
Publication of SE7512496L publication Critical patent/SE7512496L/sv

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
SE7512496A 1975-01-02 1975-11-07 Metallbeleggningsbad samt forfarande for stabilisering av detta SE7512496L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/538,125 US3977884A (en) 1975-01-02 1975-01-02 Metal plating solution

Publications (1)

Publication Number Publication Date
SE7512496L true SE7512496L (sv) 1976-07-05

Family

ID=24145605

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7512496A SE7512496L (sv) 1975-01-02 1975-11-07 Metallbeleggningsbad samt forfarande for stabilisering av detta

Country Status (8)

Country Link
US (1) US3977884A (sv)
JP (1) JPS5192738A (sv)
CA (1) CA1051606A (sv)
DE (1) DE2559059C3 (sv)
FR (1) FR2296699A1 (sv)
GB (1) GB1507730A (sv)
IT (1) IT1049081B (sv)
SE (1) SE7512496L (sv)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3582697D1 (de) * 1984-06-07 1991-06-06 Hoechst Ag Positiv arbeitende strahlungsempfindliche beschichtungsloesung.
US5306334A (en) * 1992-07-20 1994-04-26 Monsanto Company Electroless nickel plating solution
DE69224914T2 (de) * 1992-11-25 1998-10-22 Kanto Kagaku Stromloses goldbeschichtungsbad
US5338343A (en) * 1993-07-23 1994-08-16 Technic Incorporated Catalytic electroless gold plating baths
MY128333A (en) * 1998-09-14 2007-01-31 Ibiden Co Ltd Printed wiring board and its manufacturing method
US6265301B1 (en) * 1999-05-12 2001-07-24 Taiwan Semiconductor Manufacturing Company Method of forming metal interconnect structures and metal via structures using photolithographic and electroplating or electro-less plating procedures
US6277180B1 (en) * 1999-07-12 2001-08-21 Oliver Sales Company Method of replacing evaporation losses from colloidal catalyst baths
US6902605B2 (en) * 2003-03-06 2005-06-07 Blue29, Llc Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/passivation layer on copper
EP1932943A4 (en) * 2005-10-07 2013-06-26 Nippon Mining Co SOLUTION FOR CHEMICAL NICKNESS
US20070175359A1 (en) * 2006-02-01 2007-08-02 Kilnam Hwang Electroless gold plating solution and method
US10731258B2 (en) 2014-10-27 2020-08-04 Surface Technology, Inc. Plating bath solutions
US10006126B2 (en) * 2014-10-27 2018-06-26 Surface Technology, Inc. Plating bath solutions
US10655227B2 (en) * 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2762723A (en) * 1953-06-03 1956-09-11 Gen American Transporation Cor Processes of chemical nickel plating and baths therefor
US3738849A (en) * 1971-12-22 1973-06-12 Du Pont Chemical plating solutions
US3764352A (en) * 1972-06-13 1973-10-09 Shipley Co Metal finishing alloy
JPS5347770B2 (sv) * 1973-01-11 1978-12-23

Also Published As

Publication number Publication date
DE2559059A1 (de) 1976-07-08
GB1507730A (en) 1978-04-19
IT1049081B (it) 1981-01-20
CA1051606A (en) 1979-04-03
DE2559059C3 (de) 1978-05-11
DE2559059B2 (de) 1977-09-15
FR2296699A1 (fr) 1976-07-30
US3977884A (en) 1976-08-31
FR2296699B1 (sv) 1978-09-22
JPS5192738A (sv) 1976-08-14

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