FR2296699A1 - Bain stabilise de depot chimique de metal - Google Patents

Bain stabilise de depot chimique de metal

Info

Publication number
FR2296699A1
FR2296699A1 FR7535660A FR7535660A FR2296699A1 FR 2296699 A1 FR2296699 A1 FR 2296699A1 FR 7535660 A FR7535660 A FR 7535660A FR 7535660 A FR7535660 A FR 7535660A FR 2296699 A1 FR2296699 A1 FR 2296699A1
Authority
FR
France
Prior art keywords
metal deposit
chemical metal
stabilized chemical
deposit bath
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7535660A
Other languages
English (en)
Other versions
FR2296699B1 (fr
Inventor
Michael Gulla
Charles A Gaputis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
Shipley Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc filed Critical Shipley Co Inc
Publication of FR2296699A1 publication Critical patent/FR2296699A1/fr
Application granted granted Critical
Publication of FR2296699B1 publication Critical patent/FR2296699B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
FR7535660A 1975-01-02 1975-11-21 Bain stabilise de depot chimique de metal Granted FR2296699A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/538,125 US3977884A (en) 1975-01-02 1975-01-02 Metal plating solution

Publications (2)

Publication Number Publication Date
FR2296699A1 true FR2296699A1 (fr) 1976-07-30
FR2296699B1 FR2296699B1 (fr) 1978-09-22

Family

ID=24145605

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7535660A Granted FR2296699A1 (fr) 1975-01-02 1975-11-21 Bain stabilise de depot chimique de metal

Country Status (8)

Country Link
US (1) US3977884A (fr)
JP (1) JPS5192738A (fr)
CA (1) CA1051606A (fr)
DE (1) DE2559059C3 (fr)
FR (1) FR2296699A1 (fr)
GB (1) GB1507730A (fr)
IT (1) IT1049081B (fr)
SE (1) SE7512496L (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3582697D1 (de) * 1984-06-07 1991-06-06 Hoechst Ag Positiv arbeitende strahlungsempfindliche beschichtungsloesung.
US5306334A (en) * 1992-07-20 1994-04-26 Monsanto Company Electroless nickel plating solution
WO1994012686A1 (fr) * 1992-11-25 1994-06-09 Kanto Kagaku Kabushiki Kaisha Bain autocatalytique de placage d'or
US5338343A (en) * 1993-07-23 1994-08-16 Technic Incorporated Catalytic electroless gold plating baths
MY144573A (en) * 1998-09-14 2011-10-14 Ibiden Co Ltd Printed circuit board and method for its production
US6265301B1 (en) * 1999-05-12 2001-07-24 Taiwan Semiconductor Manufacturing Company Method of forming metal interconnect structures and metal via structures using photolithographic and electroplating or electro-less plating procedures
US6277180B1 (en) * 1999-07-12 2001-08-21 Oliver Sales Company Method of replacing evaporation losses from colloidal catalyst baths
US6902605B2 (en) * 2003-03-06 2005-06-07 Blue29, Llc Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/passivation layer on copper
WO2007043333A1 (fr) * 2005-10-07 2007-04-19 Nippon Mining & Metals Co., Ltd. Solution de nickelage autocatalytique
US20070175359A1 (en) * 2006-02-01 2007-08-02 Kilnam Hwang Electroless gold plating solution and method
US10006126B2 (en) * 2014-10-27 2018-06-26 Surface Technology, Inc. Plating bath solutions
US10731258B2 (en) 2014-10-27 2020-08-04 Surface Technology, Inc. Plating bath solutions
US10655227B2 (en) * 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2762723A (en) * 1953-06-03 1956-09-11 Gen American Transporation Cor Processes of chemical nickel plating and baths therefor
US3738849A (en) * 1971-12-22 1973-06-12 Du Pont Chemical plating solutions
US3764352A (en) * 1972-06-13 1973-10-09 Shipley Co Metal finishing alloy
JPS5347770B2 (fr) * 1973-01-11 1978-12-23

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NEANT *

Also Published As

Publication number Publication date
DE2559059B2 (de) 1977-09-15
SE7512496L (sv) 1976-07-05
IT1049081B (it) 1981-01-20
DE2559059A1 (de) 1976-07-08
JPS5192738A (fr) 1976-08-14
DE2559059C3 (de) 1978-05-11
US3977884A (en) 1976-08-31
CA1051606A (fr) 1979-04-03
FR2296699B1 (fr) 1978-09-22
GB1507730A (en) 1978-04-19

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Legal Events

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ST Notification of lapse
CA Change of address
CD Change of name or company name