SE511103C2 - Klämma för att fästa en effekttransistorenhet eller liknande mot ett kretskort - Google Patents

Klämma för att fästa en effekttransistorenhet eller liknande mot ett kretskort

Info

Publication number
SE511103C2
SE511103C2 SE9703961A SE9703961A SE511103C2 SE 511103 C2 SE511103 C2 SE 511103C2 SE 9703961 A SE9703961 A SE 9703961A SE 9703961 A SE9703961 A SE 9703961A SE 511103 C2 SE511103 C2 SE 511103C2
Authority
SE
Sweden
Prior art keywords
bridge
circuit board
clamp
transistor unit
transistor
Prior art date
Application number
SE9703961A
Other languages
English (en)
Swedish (sv)
Other versions
SE9703961L (sv
SE9703961D0 (sv
Inventor
Bengt Yngve Haerdin
Nils Martin Schoeoen
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9703961A priority Critical patent/SE511103C2/sv
Publication of SE9703961D0 publication Critical patent/SE9703961D0/xx
Priority to US09/177,823 priority patent/US6128190A/en
Priority to BRPI9813350-0A priority patent/BR9813350B1/pt
Priority to JP2000518523A priority patent/JP4094808B2/ja
Priority to PCT/SE1998/001953 priority patent/WO1999022553A1/fr
Priority to CA002307631A priority patent/CA2307631A1/fr
Priority to AU97730/98A priority patent/AU9773098A/en
Publication of SE9703961L publication Critical patent/SE9703961L/xx
Publication of SE511103C2 publication Critical patent/SE511103C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W78/00—Detachable holders for supporting packaged chips in operation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/625—Clamping parts not primarily conducting heat

Landscapes

  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
SE9703961A 1997-10-29 1997-10-29 Klämma för att fästa en effekttransistorenhet eller liknande mot ett kretskort SE511103C2 (sv)

Priority Applications (7)

Application Number Priority Date Filing Date Title
SE9703961A SE511103C2 (sv) 1997-10-29 1997-10-29 Klämma för att fästa en effekttransistorenhet eller liknande mot ett kretskort
US09/177,823 US6128190A (en) 1997-10-29 1998-10-23 Electronic assembly
BRPI9813350-0A BR9813350B1 (pt) 1997-10-29 1998-10-28 grampo para fixar uma unidade de transistor ou similar a uma placa de circuito ou similar.
JP2000518523A JP4094808B2 (ja) 1997-10-29 1998-10-28 トランジスタ・クランプ
PCT/SE1998/001953 WO1999022553A1 (fr) 1997-10-29 1998-10-28 Pince a transistor
CA002307631A CA2307631A1 (fr) 1997-10-29 1998-10-28 Pince a transistor
AU97730/98A AU9773098A (en) 1997-10-29 1998-10-28 Transistor clamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9703961A SE511103C2 (sv) 1997-10-29 1997-10-29 Klämma för att fästa en effekttransistorenhet eller liknande mot ett kretskort

Publications (3)

Publication Number Publication Date
SE9703961D0 SE9703961D0 (sv) 1997-10-29
SE9703961L SE9703961L (sv) 1999-04-30
SE511103C2 true SE511103C2 (sv) 1999-08-02

Family

ID=20408797

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9703961A SE511103C2 (sv) 1997-10-29 1997-10-29 Klämma för att fästa en effekttransistorenhet eller liknande mot ett kretskort

Country Status (7)

Country Link
US (1) US6128190A (fr)
JP (1) JP4094808B2 (fr)
AU (1) AU9773098A (fr)
BR (1) BR9813350B1 (fr)
CA (1) CA2307631A1 (fr)
SE (1) SE511103C2 (fr)
WO (1) WO1999022553A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW591363B (en) * 2001-10-10 2004-06-11 Aavid Thermalloy Llc Heat collector with mounting plate
JP4457895B2 (ja) * 2005-01-14 2010-04-28 船井電機株式会社 電源装置、並びにそれに適用可能な放熱部材固定構造及び回路基板
WO2009078767A1 (fr) * 2007-12-17 2009-06-25 Telefonaktiebolaget Lm Ericsson (Publ) Dispositif pour réduire les contraintes thermiques sur des points de raccordement
US8674446B2 (en) * 2012-01-05 2014-03-18 Harris Corporation Electronic device including electrically conductive body for ESD protection and related methods
WO2017131638A1 (fr) * 2016-01-26 2017-08-03 Hewlett Packard Enterprise Development Lp Ensemble à semi-conducteur

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4597617A (en) * 1984-03-19 1986-07-01 Tektronix, Inc. Pressure interconnect package for integrated circuits
JPH02121353A (ja) * 1988-10-31 1990-05-09 Nec Corp モールドケース型半導体の保持用バンド
US5065280A (en) * 1990-08-30 1991-11-12 Hewlett-Packard Company Flex interconnect module
JPH04162382A (ja) * 1990-10-25 1992-06-05 Canon Inc Ｉｃソケット
US5825089A (en) * 1991-05-01 1998-10-20 Spectrian, Inc. Low thermal resistance spring biased RF semiconductor package mounting structure
US5439398A (en) * 1992-12-10 1995-08-08 Radio Frequency Systems, Inc. Transistor mounting clamp assembly
DE4417586A1 (de) * 1993-08-03 1995-02-09 Hewlett Packard Co Familie von demontierbaren Hybridanordnungen unterschiedlicher Größe mit Mikrowellenbandbreitenverbindern
DE4338393A1 (de) * 1993-11-10 1995-05-11 Philips Patentverwaltung Anordnung zur Entwärmung eines auf eine Platine gelöteten elektronischen Bauelements
JP2804433B2 (ja) * 1994-01-14 1998-09-24 ソニー・テクトロニクス株式会社 パワー・トランジスタの固定方法
US5468996A (en) * 1994-03-25 1995-11-21 International Business Machines Corporation Electronic package assembly and connector for use therewith
US5392193A (en) * 1994-05-31 1995-02-21 Motorola, Inc. Transistor mounting device
US5459640A (en) * 1994-09-23 1995-10-17 Motorola, Inc. Electrical module mounting apparatus and method thereof
US5796584A (en) * 1996-04-30 1998-08-18 Telefonaktiebolaget Lm Ericsson Bridge for power transistors with improved cooling

Also Published As

Publication number Publication date
WO1999022553A1 (fr) 1999-05-06
SE9703961L (sv) 1999-04-30
BR9813350A (pt) 2000-08-22
SE9703961D0 (sv) 1997-10-29
US6128190A (en) 2000-10-03
AU9773098A (en) 1999-05-17
JP2001522137A (ja) 2001-11-13
BR9813350B1 (pt) 2011-03-09
CA2307631A1 (fr) 1999-05-06
JP4094808B2 (ja) 2008-06-04

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