SE457584B - Kylkropp foer halvledare - Google Patents

Kylkropp foer halvledare

Info

Publication number
SE457584B
SE457584B SE8103779A SE8103779A SE457584B SE 457584 B SE457584 B SE 457584B SE 8103779 A SE8103779 A SE 8103779A SE 8103779 A SE8103779 A SE 8103779A SE 457584 B SE457584 B SE 457584B
Authority
SE
Sweden
Prior art keywords
heat sink
sink according
cooling fins
profile insert
profile
Prior art date
Application number
SE8103779A
Other languages
English (en)
Swedish (sv)
Other versions
SE8103779L (sv
Inventor
U Bock
Original Assignee
Alusuisse
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alusuisse filed Critical Alusuisse
Publication of SE8103779L publication Critical patent/SE8103779L/xx
Publication of SE457584B publication Critical patent/SE457584B/sv

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/641—Snap-on arrangements, e.g. clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/10—Secondary fins, e.g. projections or recesses on main fins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
SE8103779A 1980-06-30 1981-06-16 Kylkropp foer halvledare SE457584B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3024748A DE3024748C2 (de) 1980-06-30 1980-06-30 Kühlkörper für Halbleiterbauelemente

Publications (2)

Publication Number Publication Date
SE8103779L SE8103779L (sv) 1981-12-31
SE457584B true SE457584B (sv) 1989-01-09

Family

ID=6106046

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8103779A SE457584B (sv) 1980-06-30 1981-06-16 Kylkropp foer halvledare

Country Status (4)

Country Link
DE (1) DE3024748C2 (https=)
FR (1) FR2485807A1 (https=)
GB (1) GB2079052B (https=)
SE (1) SE457584B (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3518310A1 (de) * 1985-05-22 1986-11-27 Aluminium-Walzwerke Singen Gmbh, 7700 Singen Kuehlkoerper fuer halbleiterbauelemente und verfahren zu seiner herstellung
DE8703604U1 (de) * 1987-03-11 1988-07-21 Euroatlas GmbH für Umformertechnik und Optronik, 2800 Bremen Kühlkörper mit Halbleiterschalter
DE59106364D1 (de) * 1990-10-24 1995-10-05 Alusuisse Lonza Services Ag Kühlkörper für Halbleiterbauelemente.
DE9319259U1 (de) * 1993-12-15 1994-03-24 Siemens AG, 80333 München Kühlkörper
GB2333353A (en) * 1998-01-16 1999-07-21 Kuo Ching Sung Heat dissipating device
DE19806978B4 (de) * 1998-02-19 2008-08-21 Behr Gmbh & Co. Kg Kühlvorrichtung zur Kühlung durch Konvektion
DE102004040557A1 (de) * 2004-08-16 2006-02-23 Kern, Dietmar, Dr.-Ing. Elektronikkühlkörper
DE102009037259B4 (de) * 2009-08-12 2012-04-19 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einer Kühleinrichtung und einem Leistungshalbleitermodul
US20160369995A1 (en) * 2015-06-16 2016-12-22 Posco Led Company Ltd. Optical semiconductor lighting apparatus
EP3403937B1 (en) * 2017-05-19 2021-01-13 Goodrich Lighting Systems GmbH Exterior aircraft light unit
DE102019107280B4 (de) * 2019-03-21 2026-01-29 apt Extrusions GmbH & Co. KG Kühleinrichtung zur Kühlung eines zu kühlenden Drittgegenstands
EP3973749B1 (en) * 2019-06-03 2026-02-25 Huawei Technologies Co., Ltd. An apparatus for transferring heat from a heat source to air

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1959193A1 (de) * 1969-11-25 1971-05-27 Leonhard Roesch Vorrichtung zum Ermitteln der Maschen- und Reihenzahl bei Strickwaren
DE7913126U1 (de) * 1979-05-07 1979-08-23 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Kuehlkoerper aus stranggepresstem aluminium fuer leistungshalbleiter

Also Published As

Publication number Publication date
DE3024748C2 (de) 1986-09-04
FR2485807A1 (fr) 1981-12-31
GB2079052A (en) 1982-01-13
SE8103779L (sv) 1981-12-31
GB2079052B (en) 1984-10-24
FR2485807B3 (https=) 1983-07-18
DE3024748A1 (de) 1982-02-04

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