GB2079052B - Cooling bodies for semiconductors or the like - Google Patents

Cooling bodies for semiconductors or the like

Info

Publication number
GB2079052B
GB2079052B GB8120125A GB8120125A GB2079052B GB 2079052 B GB2079052 B GB 2079052B GB 8120125 A GB8120125 A GB 8120125A GB 8120125 A GB8120125 A GB 8120125A GB 2079052 B GB2079052 B GB 2079052B
Authority
GB
United Kingdom
Prior art keywords
semiconductors
cooling bodies
bodies
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8120125A
Other languages
English (en)
Other versions
GB2079052A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rio Tinto Switzerland AG
Original Assignee
Alusuisse Holdings AG
Schweizerische Aluminium AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alusuisse Holdings AG, Schweizerische Aluminium AG filed Critical Alusuisse Holdings AG
Publication of GB2079052A publication Critical patent/GB2079052A/en
Application granted granted Critical
Publication of GB2079052B publication Critical patent/GB2079052B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/641—Snap-on arrangements, e.g. clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/10—Secondary fins, e.g. projections or recesses on main fins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB8120125A 1980-06-30 1981-06-30 Cooling bodies for semiconductors or the like Expired GB2079052B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3024748A DE3024748C2 (de) 1980-06-30 1980-06-30 Kühlkörper für Halbleiterbauelemente

Publications (2)

Publication Number Publication Date
GB2079052A GB2079052A (en) 1982-01-13
GB2079052B true GB2079052B (en) 1984-10-24

Family

ID=6106046

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8120125A Expired GB2079052B (en) 1980-06-30 1981-06-30 Cooling bodies for semiconductors or the like

Country Status (4)

Country Link
DE (1) DE3024748C2 (https=)
FR (1) FR2485807A1 (https=)
GB (1) GB2079052B (https=)
SE (1) SE457584B (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3518310A1 (de) * 1985-05-22 1986-11-27 Aluminium-Walzwerke Singen Gmbh, 7700 Singen Kuehlkoerper fuer halbleiterbauelemente und verfahren zu seiner herstellung
DE8703604U1 (de) * 1987-03-11 1988-07-21 Euroatlas GmbH für Umformertechnik und Optronik, 2800 Bremen Kühlkörper mit Halbleiterschalter
DE59106364D1 (de) * 1990-10-24 1995-10-05 Alusuisse Lonza Services Ag Kühlkörper für Halbleiterbauelemente.
DE9319259U1 (de) * 1993-12-15 1994-03-24 Siemens AG, 80333 München Kühlkörper
GB2333353A (en) * 1998-01-16 1999-07-21 Kuo Ching Sung Heat dissipating device
DE19806978B4 (de) * 1998-02-19 2008-08-21 Behr Gmbh & Co. Kg Kühlvorrichtung zur Kühlung durch Konvektion
DE102004040557A1 (de) * 2004-08-16 2006-02-23 Kern, Dietmar, Dr.-Ing. Elektronikkühlkörper
DE102009037259B4 (de) * 2009-08-12 2012-04-19 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einer Kühleinrichtung und einem Leistungshalbleitermodul
US20160369995A1 (en) * 2015-06-16 2016-12-22 Posco Led Company Ltd. Optical semiconductor lighting apparatus
EP3403937B1 (en) * 2017-05-19 2021-01-13 Goodrich Lighting Systems GmbH Exterior aircraft light unit
DE102019107280B4 (de) * 2019-03-21 2026-01-29 apt Extrusions GmbH & Co. KG Kühleinrichtung zur Kühlung eines zu kühlenden Drittgegenstands
EP3973749B1 (en) * 2019-06-03 2026-02-25 Huawei Technologies Co., Ltd. An apparatus for transferring heat from a heat source to air

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1959193A1 (de) * 1969-11-25 1971-05-27 Leonhard Roesch Vorrichtung zum Ermitteln der Maschen- und Reihenzahl bei Strickwaren
DE7913126U1 (de) * 1979-05-07 1979-08-23 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Kuehlkoerper aus stranggepresstem aluminium fuer leistungshalbleiter

Also Published As

Publication number Publication date
SE457584B (sv) 1989-01-09
DE3024748C2 (de) 1986-09-04
FR2485807A1 (fr) 1981-12-31
GB2079052A (en) 1982-01-13
SE8103779L (sv) 1981-12-31
FR2485807B3 (https=) 1983-07-18
DE3024748A1 (de) 1982-02-04

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19980630